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11. 发明专利

JP2014084452A Thermosetting resin composition, prepreg, laminate and printed wiring board 有权
标题翻译：热固性树脂组合物，PREPREG，层压板和印刷线路板
公开(公告)号：JP2014084452A
公开(公告)日：2014-05-12
申请号：JP2012237313
申请日：2012-10-26
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KATO IKUHIKO , KOTAKE TOMOHIKO , UCHIMURA RYOICHI , NAKAMURA YUKIO , OZE MASAHISA
IPC分类号： C08L35/00 , C08J5/24 , C08L83/04 , C08L101/02 , C09D7/47 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, a prepreg, a laminate, and a printed wiring board which are excellent in heat resistance, a thermal expansion coefficient, surface smoothness and warp reduction.SOLUTION: A thermosetting resin composition contains (A) a maleimide compound having at least two N-substitution maleimide groups in one molecular structure, (B) a silicone compound having at least one reactant organic group in one molecular structure and (C) a leveling agent. A prepreg, a laminate and a printed wiring board are obtained using the thermosetting resin composition.
摘要翻译：要解决的问题：提供耐热性，热膨胀系数，表面光滑度和翘曲减少性优异的热固性树脂组合物，预浸料坯，层压板和印刷线路板。热固性树脂组合物含有（A ）具有一个分子结构中具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物，（B）在一个分子结构中具有至少一个反应性有机基团的硅氧烷化合物和（C）流平剂。使用热固性树脂组合物获得预浸料，层压体和印刷线路板。

12. 发明专利

JP2013071940A Prepreg for printed circuit board, laminated board and printed circuit board 有权
标题翻译：印刷电路板，层压板和印刷电路板
公开(公告)号：JP2013071940A
公开(公告)日：2013-04-22
申请号：JP2011209668
申请日：2011-09-26
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MIYATAKE MASATO , KOTAKE TOMOHIKO , NAGAI SHUNSUKE , TAKANEZAWA SHIN , MURAI AKIRA , UCHIMURA RYOICHI , TAKAHARA NAOKI
IPC分类号： C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a laminated board in which good impregnating ability of a resin and good adhesion of the resin to glass cloth are achieved and which has a low thermal expansion coefficient, excellent heat resistance and insulation reliability, and to provide a printed circuit board.SOLUTION: A thermosetting resin composition comprising a resin (A) having unsaturated maleimide groups produced by reacting a maleimide compound (a) having at least two N-substituted maleimide groups per molecule with an amine compound (b) having at least two primary amino groups per molecule in an organic solvent and a thermosetting resin (B) is impregnated into glass cloth having a thermal expansion coefficient of ≤5 ppm/°C treated with a phenylaminosilane treating agent represented by general formula (I), and drying by heating and B-staging are performed to obtain a prepreg for a printed circuit board. The laminated board and the printed circuit board are also provided. In the formula, R is 1-5C alkylene, and X is independently OCH, OCHor OCH.
摘要翻译：要解决的问题：提供一种树脂的良好浸渍能力和树脂对玻璃布具有良好粘附性并且具有低热膨胀系数，优异的耐热性和绝缘可靠性的层压板，以及提供印刷电路板。解决方案：一种热固性树脂组合物，其包含具有不饱和马来酰亚胺基团的树脂（A），其通过使每分子具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物（a）与具有至少两个将有机溶剂中的每分子的伯氨基和热固性树脂（B）浸渍到用通式（I）表示的苯基氨基硅烷处理剂处理的热膨胀系数≤5ppm/℃的玻璃布中，并通过进行加热和B阶分级以获得用于印刷电路板的预浸料。还提供了层压板和印刷电路板。在该式中，R为1-5C亚烷基，X独立地为OCH 3，SB SB =“POST”> 2 5 或OC 3 H 7 。版权所有（C）2013，JPO＆INPIT

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