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    • 12. 发明授权
    • Device and method of low voltage SCR protection for high voltage failsafe ESD applications
    • 低压SCR保护装置和方法,用于高电压故障安全ESD应用
    • US06764892B2
    • 2004-07-20
    • US10445743
    • 2003-05-27
    • Keith E. KunzCharvaka DuvvuryHisashi Shichijo
    • Keith E. KunzCharvaka DuvvuryHisashi Shichijo
    • H01L218238
    • H01L27/0262H01L29/87
    • A semiconductor circuit for multi-voltage operation having built-in electrostatic discharge (ESD) protection is described, comprising a drain extended nMOS transistor and a pnpn silicon controlled rectifier (SCR) merged with the transistor so that a dual npn structure is created and both the source of the transistor and the cathode of the SCR are connected to electrical ground potential, forming a dual cathode, whereby the ESD protection is enhanced. The rectifier has a diffusion region, forming an abrupt junction, resistively coupled to the drain, whereby the electrical breakdown-to-substrate of the SCR can be triggered prior to the breakdown of the nMOS transistor drain. The SCR has anode and cathode regions spaced apart by semiconductor surface regions and insulating layers positioned over the surface regions with a thickness suitable for high voltage operation and ESD protection.
    • 描述了具有内置静电放电(ESD)保护的多电压操作的半导体电路,包括与晶体管合并的漏极扩展nMOS晶体管和pnpn可控硅整流器(SCR),从而产生双重npn结构, 晶体管的源极和SCR的阴极连接到电接地电位,形成双阴极,从而增强了ESD保护。 整流器具有形成突起结的扩散区,电阻耦合到漏极,由此可以在nMOS晶体管漏极击穿之前触发SCR的电击穿到衬底。 SCR具有由半导体表面区域隔开的阳极和阴极区域,并且位于表面区域上方的绝缘层具有适合于高电压操作和ESD保护的厚度。
    • 20. 发明授权
    • Vertical one-transistor DRAM with enhanced capacitance and process for
fabricating
    • 具有增强的电容和制造工艺的垂直单晶体管DRAM
    • US5164917A
    • 1992-11-17
    • US741197
    • 1991-07-30
    • Hisashi Shichijo
    • Hisashi Shichijo
    • H01L21/8242H01L27/108
    • H01L27/10876H01L27/10838Y10S257/906
    • One embodiment of the present invention is a one transistor DRAM cell having enhanced capacitance and minimized soft error rate by providing an ungrounded cell capacitor plate which is insulated from the substrate. The structure includes a vertical transistor on the sides of a vertical depression or trench in a substrate. In the bottom of the trench, a memory cell capacitor is fabricated. This capacitor includes a conductive polycrystalline silicon post through the middle of the capacitor, thereby increasing the surface area of the capacitor plates. This increases the capacitance of the memory cell capacitor.The ungrounded plate of the memory cell capacitor is fabricated in the trench and is insulated from the substrate. This ungrounded plate is connected to the vertical transistor via a polycrystalline silicone plug. Thus this embodiment of the present invention reduces soft error rate by providing a fully insulated ungrounded memory cell capacitor plate.
    • 本发明的一个实施例是通过提供与衬底绝缘的未接地单元电容器板,其具有增强的电容和最小化的软错误率的单晶体管DRAM单元。 该结构包括在基板中的垂直凹陷或沟槽的侧面上的垂直晶体管。 在沟槽的底部,制造存储单元电容器。 该电容器包括穿过电容器中间的导电多晶硅柱,从而增加电容器板的表面积。 这增加了存储单元电容器的电容。 存储单元电容器的未接地板制造在沟槽中并与衬底绝缘。 该未接地板通过多晶硅插头连接到垂直晶体管。 因此,本发明的该实施例通过提供完全绝缘的非接地存储单元电容器板来降低软错误率。