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11. 发明申请

US20070119045A1 Method of assembling a carriage assembly and assembling apparatus 失效
标题翻译：组装支架组件和组装装置的方法
公开(公告)号：US20070119045A1
公开(公告)日：2007-05-31
申请号：US11375210
申请日：2006-03-15
申请人： Takayoshi Matsumura , Naoki Ishikawa , Hiroshi Kobayashi , Yasuo Moriya , Hidehiko Kira
发明人： Takayoshi Matsumura , Naoki Ishikawa , Hiroshi Kobayashi , Yasuo Moriya , Hidehiko Kira
IPC分类号： G11B5/48 , G11B21/16 , G11B5/127 , B23P19/00 , G11C5/12
CPC分类号： G11B5/4813 , Y10T29/49025 , Y10T29/49027 , Y10T29/49915 , Y10T29/49934 , Y10T29/49938 , Y10T29/53165
摘要： A method of assembling a carriage assembly is capable of suppressing deformation of spacer portions when suspensions are attached to carriage arms. The method of assembling a carriage assembly aligns fitting holes provided in front end portions of carriage arms and spacer holes provided in spacer portions of suspensions and places the suspensions onto the carriage arms, and then presses a ball with a diameter equal to or greater than an inner diameter of the spacer holes with a pressure-applying member to pass the ball through the spacer holes, thereby crimping spacer hole edge portions of the spacer portions and attaching the suspensions to the front end portions of the carriage arms. By applying ultrasonic vibration from two axial directions to the pressure applying member, the pressure applying member is caused to vibrate on a two dimensional movement path on a predetermined plane and passes the ball through the spacer holes while causing the ball to rotate.
摘要翻译：一种组装滑架组件的方法能够在将悬架连接到滑架臂时抑制间隔部分的变形。组装滑架组件的方法将设置在滑架臂的前端部分的设置孔和设置在悬架的间隔部分中的间隔孔对准，并将悬架放置在滑架臂上，然后将直径等于或大于具有加压构件的间隔孔的内径使球通过间隔孔，由此压接间隔件部分的间隔孔边缘部分并将悬架附接到托架臂的前端部。通过将两个轴向的超声波振动施加到压力施加构件，使压力施加构件在预定平面上的二维运动路径上振动，并使球通过间隔孔，同时使球旋转。

12. 发明授权

US07562434B2 Method of assembling a carriage assembly 失效
标题翻译：组装滑架组件的方法
公开(公告)号：US07562434B2
公开(公告)日：2009-07-21
申请号：US11442935
申请日：2006-05-30
申请人： Naoki Ishikawa , Hidehiko Kira , Hiroshi Kobayashi , Takayoshi Matsumura
发明人： Naoki Ishikawa , Hidehiko Kira , Hiroshi Kobayashi , Takayoshi Matsumura
IPC分类号： G11B5/127 , H04R31/00
CPC分类号： G11B5/4833 , Y10T29/49025 , Y10T29/49027 , Y10T29/4903 , Y10T29/49032
摘要： When crimping suspensions to carriage arms using a metal ball by applying ultrasonic vibration to a crimping tool, the suspensions can be crimped to the carriage arms without causing deformation to the suspensions and the like. A method of assembling a carriage assembly aligns attachment holes provided in front ends of carriage arms and crimping portions provided on suspensions to set the suspensions on the carriage arms and then presses a ball through crimping holes provided in the crimping portions while applying ultrasonic vibration to the crimping tool to crimp the suspensions to the carriage arms. When doing so, a ball, such as a ball whose surface has been subjected to a dimpling process, for which a load that acts on the ball when the ball passes through the crimping holes is low compared to a spherical ball is used to crimp the suspensions to the carriage arms.
摘要翻译：当通过对压接工具施加超声波振动将金属球通过金属球压接到支架臂上时，可以将悬架卷曲到托架臂而不会使悬架等变形。组装滑架组件的方法将设置在滑架臂的前端的设置孔和设置在悬架上的压接部对准，以将悬架设置在滑架臂上，然后通过设置在压接部分中的压接孔将球压入同时向超声波振动施加超声波振动压接工具将悬架压接到托架臂上。当这样做时，使用诸如球表面已经进行了凹坑处理的球，当球通过压接孔时作用在球上的负载与球形球相比较低，悬挂在托架臂上。

13. 发明申请

US20070180673A1 Method of assembling a carriage assembly 审中-公开
标题翻译：组装滑架组件的方法
公开(公告)号：US20070180673A1
公开(公告)日：2007-08-09
申请号：US11444292
申请日：2006-05-31
申请人： Hiroshi Kobayashi , Hidehiko Kira , Naoki Ishikawa , Takayoshi Matsumura
发明人： Hiroshi Kobayashi , Hidehiko Kira , Naoki Ishikawa , Takayoshi Matsumura
IPC分类号： B23P11/00 , B21D39/00
CPC分类号： B23P11/005 , B21D39/032 , B21J5/006 , B21K25/00 , Y10T29/49764 , Y10T29/49771 , Y10T29/49774 , Y10T29/49908
摘要： There is provided a method of assembling a carriage assembly that can crimp suspensions to carriage arms by applying ultrasonic vibration to a crimping tool without causing deformation of the suspensions and the like. The method of assembling a carriage assembly aligns attachment holes provided in front ends of carriage arms and crimping portions provided on suspensions to set the suspensions on the carriage arms and then presses a metal ball through crimping holes provided in the crimping portions while applying ultrasonic vibration to a crimping tool to crimp the suspensions to the carriage arms. The suspensions are crimped to the carriage arms by detecting stress that acts on the crimping tool when the metal ball is pressed in by the crimping tool and controlling the amplitude of the ultrasonic vibration applied to the crimping tool so as to increase and decrease in accordance with the magnitude of the stress.
摘要翻译：提供了一种组装滑架组件的方法，其可以通过对压接工具施加超声振动而不会引起悬架等的变形而将悬架压紧到滑架臂。组装滑架组件的方法将设置在滑架臂的前端的设置孔和设置在悬架上的压接部对准，以将悬架设置在滑架臂上，然后通过设置在压接部中的压接孔将金属球压入同时施加超声波振动压接工具，以将悬架压紧到托架臂上。通过检测当金属球被压接工具压入时作用在压接工具上的应力，并且控制施加到压接工具的超声波振动的振幅以按照压力的大小。

14. 发明申请

US20080072643A1 Ultrasonic crimping apparatus, crimping member, ultrasonic crimping method and arm production method 审中-公开
标题翻译：超声波压接装置，压接构件，超声波压接方法和手臂制作方法
公开(公告)号：US20080072643A1
公开(公告)日：2008-03-27
申请号：US11698058
申请日：2007-01-26
申请人： Takayoshi Matsumura , Naoki Ishikawa , Hidehiko Kira
发明人： Takayoshi Matsumura , Naoki Ishikawa , Hidehiko Kira
IPC分类号： B21D26/02
CPC分类号： B21D26/00 , B21D39/00 , B23P11/005 , G11B5/4806
摘要： The ultrasonic crimping apparatus of the invention includes: a supporting section that supports a crimped object having a crimped section with a through hole formed therein; a crimping member in a bar shape that is smaller toward a front end thereof and larger toward a rear end thereof; a driving section that causes the crimping member to be inserted in the through hole, first from the front end thereof; an ultrasonic application section that applies ultrasonic wave to the crimping member, thereby causing radial displacement of the crimping member; and a crimping control section that causes the crimping member to be inserted into the through hole of the crimped object, while causing application of ultrasonic wave to the crimping member, thereby causing the crimped section of the crimped object to be crimped.
摘要翻译：本发明的超声波压接装置包括：支撑部分，其支撑具有形成在其中的通孔的卷曲部分的卷曲物体; 棒状的压接构件朝向其前端较小并且朝向其后端较大; 驱动部，其使所述压接部件从其前端首先插入到所述通孔中; 超声波应用部，其向所述压接部施加超声波，由此引起所述压接部的径向位移; 以及压接控制部，其使得压接构件插入到压接对象的通孔中，同时施加超声波到压接构件，从而使压接对象的压接部被压接。

15. 发明申请

US20080054440A1 Wire bonding method, wire bonding apparatus and semiconductor device 审中-公开
标题翻译：引线接合方法，引线接合装置和半导体器件
公开(公告)号：US20080054440A1
公开(公告)日：2008-03-06
申请号：US11651515
申请日：2007-01-10
申请人： Takayoshi Matsumura , Hidehiko Kira , Naoki Ishikawa
发明人： Takayoshi Matsumura , Hidehiko Kira , Naoki Ishikawa
IPC分类号： H01L23/48
CPC分类号： H01L24/85 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/05554 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/78301 , H01L2224/786 , H01L2224/78801 , H01L2224/851 , H01L2224/85181 , H01L2224/85205 , H01L2224/85206 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： The wire bonding method includes: a first connecting step of supplying an end of wire for electric wiring to a first electrode on an IC chip and applying vibration to the wire, thereby connecting the end of the wire to the first electrode; a wire stretching step of stretching the wire whose end is connected to the first electrode up to a second electrode on a different member from the IC chip; and a second connecting step of connecting the wire to the second electrode by applying vibration, in an extension direction of the wire stretched from the first electrode to the second electrode, to a portion of the wire overlapping the second electrode.
摘要翻译：引线接合方法包括：向IC芯片上的第一电极提供用于电布线的端部的第一连接步骤，并且对线施加振动，从而将线的端部连接到第一电极; 线材拉伸步骤，其将所述导线的端部与所述IC芯片连接到第一电极直到与所述IC芯片不同的构件上的第二电极; 以及第二连接步骤，通过在从第一电极延伸到第二电极的电线的延伸方向上施加振动，将电线连接到第二电极到与第二电极重叠的部分。

16. 发明申请

US20100095515A1 METHOD AND APPARATUS FOR ASSEMBLING A CARRIAGE ASSEMBLY 审中-公开
标题翻译：装配运输装配的方法和装置
公开(公告)号：US20100095515A1
公开(公告)日：2010-04-22
申请号：US12524864
申请日：2007-03-15
申请人： Hidehiko Kira , Naoki Ishikawa , Kimio Nakamura , Takayoshi Matsumura
发明人： Hidehiko Kira , Naoki Ishikawa , Kimio Nakamura , Takayoshi Matsumura
IPC分类号： B23P19/00
CPC分类号： G11B5/4833 , Y10T29/4902 , Y10T29/53
摘要： A method of assembling a carriage assembly that is operable, during a crimping step that passes a ball, which has a diameter that is equal to or larger than an inner diameter of spacer holes of suspensions, successively through the spacer holes using a bar-shaped pressing member that is subjected to ultrasonic vibration to thereby crimp spacer hole inner circumferential portions of the spacer portions and attach the suspensions to the front end portions of the carriage arms, to prevent the pressing member that presses the ball from colliding with an inner circumferential surface and the like of the spacer holes of the spacer portions and is therefore able to substantially eliminate tilting from the standard angle of the suspensions due to deformation of the spacer portions, and an assembling apparatus that uses such method are provided.After the ball 20 has passed through one of the spacer holes 12b, the inner diameter of the through-hole 36a of the gap maintaining plates 36 positioned to the rear of such spacer hole 12b in the direction in which the ball 20 passes is reduced to a smaller diameter than the inner diameter of the spacer holes 12b.
摘要翻译：一种组装滑架组件的方法，其可以在通过球的压接步骤期间操作，所述压接步骤通过间隔孔连续穿过所述间隔孔，所述滚珠的直径等于或大于悬架的间隔孔的内径，进行超声波振动的压紧构件，从而压接间隔部的间隔孔内周部，并将悬架安装在托架臂的前端部，防止按压滚珠的按压部件与内周面并且因此能够基本上消除由于间隔部分的变形而导致的悬架的标准角度的倾斜，并且提供了使用这种方法的组装装置。在球20已经穿过间隔孔12b之一之后，沿着球20通过的方向位于该间隔孔12b的后方的间隙保持板36的通孔36a的内径减小到比间隔孔12b的内径小的直径。

17. 发明申请

US20090320270A1 METHOD AND APPARATUS FOR ASSEMBLING A CARRIAGE ASSEMBLY 审中-公开
标题翻译：装配运输装配的方法和装置
公开(公告)号：US20090320270A1
公开(公告)日：2009-12-31
申请号：US12525019
申请日：2007-03-15
申请人： Naoki Ishikawa , Hidehiko Kira , Kimio Nakamura , Takayoshi Matsumura
发明人： Naoki Ishikawa , Hidehiko Kira , Kimio Nakamura , Takayoshi Matsumura
IPC分类号： B23P11/00 , B25B27/00
CPC分类号： G11B5/4833 , Y10T29/49908 , Y10T29/53961
摘要： There are provided a method of assembling a carriage assembly that can uniformly crimp edge portions of spacer holes of spacer portions and keep the spacer portions flat, thereby maintaining the angles of suspensions with high accuracy, and an assembling apparatus that uses such method.The method includes an attaching step of positioning spacer holes 12b of suspensions 12 on through-holes 10a formed in front end portions of a plurality of carriage arms 10 that have been disposed in parallel and attaching the suspensions to the respective carriage arms; and a crimping step of pressing a ball 20 with a diameter that is equal to or larger than an inner diameter of the spacer holes 12b using a pressing member 40 so as to pass the ball successively through the spacer holes 12b and thereby crimp spacer hole 12b edge portions of the spacer portions 12a and attach the suspensions 12 to the carriage arms 10, wherein during the crimping step, the ball 20 is placed in a vicinity of the center axis a at least when the ball 20 is located between the carriage arms 10.
摘要翻译：提供了一种组装支架组件的方法，其可以均匀地压接间隔件部分的间隔孔的边缘部分并且使间隔部分保持平坦，从而以高精度保持悬架的角度，以及使用这种方法的组装装置。该方法包括将悬架12的间隔孔12b定位在形成在已经平行布置的多个托架臂10的前端部的通孔10a上并将悬架附接到相应的托架臂上的安装步骤; 以及使用按压部件40按压直径等于或大于间隔孔12b的内径的球20的压接步骤，以使球连续通过间隔孔12b，从而压接间隔孔12b 间隔部分12a的边缘部分并将悬架12附接到托架臂10，其中在压接步骤期间，至少当球20位于托架臂10之间时，将球20放置在中心轴线a附近。

18. 发明授权

US07049217B2 Method of forming multi-piled bump 有权
标题翻译：形成多堆块的方法
公开(公告)号：US07049217B2
公开(公告)日：2006-05-23
申请号：US10817807
申请日：2004-04-06
申请人： Naoki Ishikawa , Shuichi Takeuchi , Hidehiko Kira
发明人： Naoki Ishikawa , Shuichi Takeuchi , Hidehiko Kira
IPC分类号： H01L21/44
CPC分类号： H01L24/11 , H01L24/73 , H01L25/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/1308 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13664 , H01L2224/16145 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45644 , H01L2224/48091 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06555 , H01L2225/06562 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2224/13099 , H01L2924/00 , H01L2924/20752 , H01L2224/05599 , H01L2224/45664
摘要： In the method of forming a multi-piled bump, metal balls can be stably and securely piled so as to form the multi-piled bump having a prescribed height. The method of the present invention comprises the steps of: holding a metal wire by a capillary; sparking and melting the wire so as to form metal balls; piling a plurality of the metal balls with applying a load and ultrasonic vibrations thereto, and characterized in that a tail length of the metal wire, which is held by the capillary, is controlled to make a gap between a center of the metal wire and a center of the metal ball one half of a diameter of the metal wire or less.
摘要翻译：在形成多层凸块的方法中，可以稳定且可靠地堆叠金属球，以形成具有规定高度的多层凸块。本发明的方法包括以下步骤：通过毛细管保持金属线; 引发和熔化电线，形成金属球; 通过施加载荷和超声振动来堆叠多个金属球，其特征在于，控制由毛细管保持的金属线的尾部长度，以在金属丝的中心和金属球的中心是金属线的直径的一半或更少。

19. 发明申请

US20050090091A1 Method of forming multi-piled bump 有权
标题翻译：形成多堆块的方法
公开(公告)号：US20050090091A1
公开(公告)日：2005-04-28
申请号：US10817807
申请日：2004-04-06
申请人： Naoki Ishikawa , Shuichi Takeuchi , Hidehiko Kira
发明人： Naoki Ishikawa , Shuichi Takeuchi , Hidehiko Kira
IPC分类号： H01L21/00 , H01L21/44 , H01L21/60 , H01L21/607 , H01L25/065
CPC分类号： H01L24/11 , H01L24/73 , H01L25/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/1308 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13664 , H01L2224/16145 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45644 , H01L2224/48091 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06555 , H01L2225/06562 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2224/13099 , H01L2924/00 , H01L2924/20752 , H01L2224/05599 , H01L2224/45664
摘要： In the method of forming a multi-piled bump, metal balls can be stably and securely piled so as to form the multi-piled bump having a prescribed height. The method of the present invention comprises the steps of: holding a metal wire by a capillary; sparking and melting the wire so as to form metal balls; piling a plurality of the metal balls with applying a load and ultrasonic vibrations thereto, and characterized in that a tail length of the metal wire, which is held by the capillary, is controlled to make a gap between a center of the metal wire and a center of the metal ball one half of a diameter of the metal wire or less.
摘要翻译：在形成多层凸块的方法中，可以稳定且可靠地堆叠金属球，以形成具有规定高度的多层凸块。本发明的方法包括以下步骤：通过毛细管保持金属线; 引发和熔化电线，形成金属球; 通过施加载荷和超声振动来堆叠多个金属球，其特征在于，控制由毛细管保持的金属线的尾部长度，以在金属丝的中心和金属球的中心是金属线的直径的一半或更少。

20. 发明申请

US20060131426A1 RFID tag and method of manufacturing the same 失效
标题翻译： RFID标签及其制造方法
公开(公告)号：US20060131426A1
公开(公告)日：2006-06-22
申请号：US11091934
申请日：2005-03-29
申请人： Naoki Ishikawa , Shunji Baba , Hidehiko Kira , Hiroshi Kobayashi
发明人： Naoki Ishikawa , Shunji Baba , Hidehiko Kira , Hiroshi Kobayashi
IPC分类号： G06K19/06 , G08B13/14 , H01Q17/00
CPC分类号： H01L24/12 , G06K19/07749 , G06K19/0775 , H01L23/49855 , H01L24/11 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/10135 , H01L2224/10165 , H01L2224/1134 , H01L2224/131 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/2929 , H01L2224/293 , H01L2224/73203 , H01L2224/81136 , H01L2224/81139 , H01L2224/8114 , H01L2224/81191 , H01L2224/8159 , H01L2224/816 , H01L2224/81801 , H01L2224/81903 , H01L2224/83192 , H01L2224/83851 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , Y10T29/49018 , H01L2224/13099 , H01L2924/00012 , H01L2224/29075 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The present invention provides a radio frequency identification (RFID) tag which exchanges information with an external device in a noncontact manner, in which a paste is used as a material for an antenna, and which is designed to prevent sinking of bumps. A stopper for limiting sinking of bumps of a circuit chip caused by a pressing force when the circuit chip is connected to an antenna is provided on the circuit chip or a base at a position adjacent to the bumps.
摘要翻译：本发明提供了一种射频识别（RFID）标签，其以非接触方式与外部设备交换信息，其中使用糊料作为天线的材料，并且被设计成防止凸起的下沉。当电路芯片连接到天线时，用于限制由压力引起的电路芯片的凸块的下沉的止动器设置在电路芯片或与凸块相邻的位置的基座上。

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