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11. 发明授权

US10401649B2 Method of designing progressive refractive power lens, and lens set 有权
$Method of designing progressive refractive power lens, and lens set$
公开(公告)号：US10401649B2
公开(公告)日：2019-09-03
申请号：US15576262
申请日：2016-05-26
申请人： HOYA LENS THAILAND LTD. , Hiroshi Asami , Ayumu Ito
发明人： Hiroshi Asami , Ayumu Ito
IPC分类号： G02C7/02 , G02C7/06
摘要： When an addition power at a position corresponding to a fitting point within a prescription addition power is greater than a target addition power set according to a target distance, the target addition power is set as an addition power between a progression-start point and a progression-end point on a principal meridian, and in addition the average gradient of an addition power between the progression-start point and the fitting point is set to differ from an average gradient of an addition power between the fitting point and the progression-end point. When the addition power at the position corresponding to the fitting point within the prescription addition power is equal to or smaller than the target addition power, a gradient of the addition power is made constant in a partial region including at least the fitting point between the progression-start point and the progression-end point on the principal meridian.

12. 发明授权

US07728431B2 Electronic component, semiconductor device employing same, and method for manufacturing electronic component 有权
标题翻译：电子部件，使用该半导体装置的半导体装置以及电子部件的制造方法
公开(公告)号：US07728431B2
公开(公告)日：2010-06-01
申请号：US11810070
申请日：2007-06-04
申请人： Yoshimichi Harada , Akiyoshi Aoyagi , Hiroshi Asami
发明人： Yoshimichi Harada , Akiyoshi Aoyagi , Hiroshi Asami
IPC分类号： H01L23/48
CPC分类号： H01L24/11 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/12 , H01L2224/02126 , H01L2224/02255 , H01L2224/03019 , H01L2224/0401 , H01L2224/05018 , H01L2224/05027 , H01L2224/05082 , H01L2224/0555 , H01L2224/05552 , H01L2224/05556 , H01L2224/05557 , H01L2224/05558 , H01L2224/05559 , H01L2224/05572 , H01L2224/05624 , H01L2224/10126 , H01L2224/1147 , H01L2224/11902 , H01L2224/13007 , H01L2224/13023 , H01L2224/13099 , H01L2224/131 , H01L2224/13144 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/10253 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： Herein disclosed an electronic component having a passivation layer in which an opening that exposes a part of a pad electrode is formed, an underlying metal layer formed on the pad electrode and the passivation layer, and a barrier metal layer formed on the underlying metal layer for an external connection electrode, the electronic component including a recess or/and a projection configured to be provided under the barrier metal layer outside or/and inside the opening, the underlying metal layer being formed on the recess or/and the projection and having a surface shape that follows the recess or/and the projection.
摘要翻译：这里公开了一种具有钝化层的电子部件，其中形成有露出焊盘电极的一部分的开口，形成在焊盘电极和钝化层上的下面的金属层以及形成在下面的金属层上的阻挡金属层外部连接电极，所述电子部件包括凹部或/和突出部，所述突起构造成设置在所述阻挡金属层的下方或/或所述开口内侧，所述下部金属层形成在所述凹部或/和所述突起上，并且具有跟随凹部或/和突起的表面形状。

13. 发明授权

US07421777B2 Method of manufacturing multilayer wiring substrate using temporary metal support layer 失效
标题翻译：使用临时金属支撑层制造多层布线基板的方法
公开(公告)号：US07421777B2
公开(公告)日：2008-09-09
申请号：US11063131
申请日：2005-02-22
申请人： Hiroshi Asami , Hidetoshi Kusano , Yuki Nishitani , Ken Orui
发明人： Hiroshi Asami , Hidetoshi Kusano , Yuki Nishitani , Ken Orui
IPC分类号： H05K3/36
CPC分类号： H05K3/4694 , H01L21/4846 , H01L21/4857 , H01L23/49833 , H01L2924/0002 , H01L2924/09701 , H05K3/0023 , H05K3/205 , H05K3/4617 , H05K3/4623 , H05K2201/0195 , H05K2201/09536 , H05K2201/09881 , H05K2201/09972 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiring substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.
摘要翻译：本发明提供一种制造多层布线基板的方法，其可以以细间距保持导体图案的尺寸稳定性，从材料选择的角度解决对工艺的限制，并且进一步降低制造成本，并且多层布线基板。形成在由金属制成的支撑片和粘合剂层上的第二布线基板通过使用支撑片部分堆叠在第一布线基板的预定区域上。在第二布线基板的层叠之后，最后蚀刻并去除支撑片。第二布线基板仅堆叠在第一布线基板上需要多层的部分上，从而减少第二布线基板的结构材料的量。

14. 发明授权

US07288724B2 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate 失效
标题翻译：多层布线基板的制造方法以及多层布线基板
公开(公告)号：US07288724B2
公开(公告)日：2007-10-30
申请号：US10403550
申请日：2003-03-31
申请人： Hiroshi Asami , Hidetoshi Kusano , Yuji Nishitani , Ken Orui
发明人： Hiroshi Asami , Hidetoshi Kusano , Yuji Nishitani , Ken Orui
IPC分类号： H05K1/02 , H05K1/11 , H05K1/14
CPC分类号： H05K3/4694 , H01L21/4846 , H01L21/4857 , H01L23/49833 , H01L2924/0002 , H01L2924/09701 , H05K3/0023 , H05K3/205 , H05K3/4617 , H05K3/4623 , H05K2201/0195 , H05K2201/09536 , H05K2201/09881 , H05K2201/09972 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiling substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.
摘要翻译：制造可以以细间距保持导体图案的尺寸稳定性的多层布线基板的方法从材料选择的角度解决了对工艺的限制，并且进一步降低了制造成本，以及多层布线基板。形成在由金属制成的支撑片和粘合剂层上的第二布线基板通过使用支撑片部分堆叠在第一布线基板的预定区域上。在第二布线基板的层叠之后，最后蚀刻并去除支撑片。第二卷绕基板仅叠层在第一布线基板上的多层的部分上，从而减少第二布线基板的结构材料的量。

15. 发明授权

US07053315B2 Junction structure and junction method for conductive projection 有权
标题翻译：导电投影的结结构和接合方法
公开(公告)号：US07053315B2
公开(公告)日：2006-05-30
申请号：US10802188
申请日：2004-03-17
申请人： Ken Orui , Hiroko Jinno , Yuji Nishitani , Hiroshi Asami
发明人： Ken Orui , Hiroko Jinno , Yuji Nishitani , Hiroshi Asami
IPC分类号： H05K1/11 , H01R12/04
CPC分类号： H05K3/3452 , H01L2224/10126 , H05K3/3478 , H05K2201/10734 , H05K2201/10977 , H05K2203/041 , H05K2203/043 , H05K2203/0594 , Y10T29/49147
摘要： To provide a junction structure and a junction method for conductive projection advantageous in that a required reinforcement strength can be obtained while suppressing the amount of a reinforcing resin material supplied to prevent warpage due to curing shrinkage. A conductive projection is joined to the surface of a conductor portion formed at the same level as that of the surface of the insulating layer so that a root portion of the projection is surrounded by a fillet-form resin material. The resin material contains an activator which assists in the junction between the conductive projection and the conductor portion when the resin material is in an uncured state, and is fused by heating to wet and rise the root portion of the conductive projection so as to be in a fillet form. The resin material is cured by an ultraviolet light while excluding the resin material on the conductor portion.
摘要翻译：提供一种用于导电突起的接合结构和接合方法，其优点在于可以获得所需的增强强度，同时抑制供应的增强树脂材料的量以防止由于固化收缩引起的翘曲。导电突起与形成在与绝缘层的表面相同水平面的导体部分的表面接合，使得突起的根部被圆角状的树脂材料包围。树脂材料含有活化剂，当树脂材料处于未固化状态时，其有助于导电突起与导体部分之间的接合，并通过加热熔化并使导电突起的根部上升，使其处于一个圆角形状。树脂材料通过紫外线固化，同时排除导体部分上的树脂材料。

16. 发明授权

US5590533A Refrigerator having regenerator 失效
标题翻译：冰箱有再生器
公开(公告)号：US5590533A
公开(公告)日：1997-01-07
申请号：US479114
申请日：1995-06-07
申请人： Hiroshi Asami , Mitsuru Suzuki
发明人： Hiroshi Asami , Mitsuru Suzuki
IPC分类号： F17C3/08 , F25B9/14 , F28D17/00 , H01F6/00 , F25B9/00
CPC分类号： F25B9/14 , F17C3/085 , F28D17/005 , H01F6/00 , F25B2309/003
摘要： A refrigerator with a regenerator is provided which is supported by a holder. The refrigerator has a cylinder having an inner circumferential surface matching a circular tube shape, a displacer being disposed in the cylinder and forming an expansion space near at one end of the inside of the cylinder, a groove pattern having a groove formed along the direction intersecting the axial direction of the displacer, the groove allowing a gas flowing through a gap between the cylinder and displacer from one end to the other end of the outer circumferential surface of the displacer to positively heat-exchange with the cylinder and displacer, and a main gas passage for supplying gas to the expansion space of the cylinder and recovering the gas from the expansion space. The holder supports the refrigerator so that the axial direction of the cylinder is directed in the vertical direction and the expansion space is formed at the upper end of the inside of the cylinder, or the axial direction of the cylinder is directed in an oblique direction relative to the vertical direction.
摘要翻译：提供具有再生器的冰箱，其由保持器支撑。冰箱具有圆筒状的圆筒状，圆筒状的内周面配置有位于圆筒内侧的膨胀空间的排水器，沿着与圆筒形状相交的方向形成有槽的槽图形，排出器的轴向方向，槽允许气体从排出器的外周表面的一端到另一端流过气缸和置换器之间的间隙，以与气缸和置换器积极地热交换，主体气体通道，用于向气缸的膨胀空间供应气体并从膨胀空间回收气体。支架支撑冰箱，使得气缸的轴向在垂直方向上被引导，并且膨胀空间形成在气缸内部的上端，或者气缸的轴向方向相对于倾斜方向到垂直方向。

17. 发明授权

US5361588A Cryogenic refrigerator 失效
标题翻译：低温冰箱
公开(公告)号：US5361588A
公开(公告)日：1994-11-08
申请号：US87710
申请日：1993-07-14
申请人： Hiroshi Asami , Mitsuru Suzuki
发明人： Hiroshi Asami , Mitsuru Suzuki
IPC分类号： F25B9/14 , F25B9/00
CPC分类号： F25B9/14 , F25B2309/006
摘要： In a cryogenic refrigerator using a Gifford MacMahon (GM) cycle, a rotary valve device (RV) for controlling the supply and discharge of refrigerant gas with respect to the refrigerator (2) is adapted by a reversible motor (15) to be rotated in normal and reverse directions, and during the rotation in the normal direction, a cooling mode operation for producing cold by an adiabatic expansion is effected, and during the rotation in the reverse direction, a temperature-raising mode operation for producing heat by an adiabatic compression is effected. In order that the optimum efficiency can be obtained in each of the cooling mode operation and the temperature-raising mode operation, the timing of opening and closing of the rotary valve device (RV) with respect to the reciprocal movement of displacers (3a, 3b) during the rotation in the normal direction is made different from said timing during the rotation in the reverse direction. As a result, the time required for raising the temperature of a cooling portion in a cryogenic condition to the normal temperature can be shortened without the need for any special equipment.
摘要翻译： PCT No.PCT / JP92 / 01500 Sec。 371日期：1993年7月14日 102（e）日期1993年7月14日PCT提交1992年11月17日PCT公布。公开号WO93 / 10407 日期：1993年5月27日。在使用吉福德马克马洪（GM）循环的低温冰箱中，用于控制制冷剂气体相对于冰箱（2）的供应和排出的旋转阀装置（RV）由可逆电动机 15）沿正向和反向旋转，并且在正向旋转期间，进行用于通过绝热膨胀产生冷的冷却模式操作，并且在反向旋转期间，进行升温模式操作，用于通过绝热压缩产生热量。为了在每个冷却模式操作和升温模式操作中获得最佳效率，旋转阀装置（RV）的打开和关闭定时相对于置换器（3a，3b）的往复运动）在正反方向的旋转期间与所述旋转期间的定时不同。结果，可以缩短在低温条件下将冷却部分的温度升高到常温所需的时间，而不需要任何特殊设备。

18. 发明授权

US4827737A Cold reserving apparatus 失效
标题翻译：冷藏设备
公开(公告)号：US4827737A
公开(公告)日：1989-05-09
申请号：US234408
申请日：1988-08-19
申请人： Yasukage Oda , Hiroshi Asami
发明人： Yasukage Oda , Hiroshi Asami
IPC分类号： B01L7/00 , B01L7/04 , F17C3/08 , F17C13/00 , F25D3/10 , F25D13/00 , F25D19/00 , G01N1/28
CPC分类号： F17C13/00 , F17C3/08 , F25D19/006
摘要： A cold reserving apparatus having a specimen accommodation chamber capable of being closed and inserted and disposed in a vacuum vessel. A cooling stage of the refrigerator is inserted into this vacuum vessel, and a cooling stage provided on the specimen accommodation chamber in the vacuum vessel and the cooling stage of the refrigerator are connected by a solid heat-conductive material.

19. 发明申请

US20070287265A1 Substrate treating method and method of manufacturing semiconductor apparatus 有权
标题翻译：基板处理方法及制造半导体装置的方法
公开(公告)号：US20070287265A1
公开(公告)日：2007-12-13
申请号：US11799023
申请日：2007-04-30
申请人： Masaki Hatano , Hiroshi Asami
发明人： Masaki Hatano , Hiroshi Asami
IPC分类号： H01L21/304
CPC分类号： H01L21/76898 , H01L21/6835 , H01L24/73 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2221/68345 , H01L2224/04105 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2225/06582 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/181 , H01L2924/18161 , H01L2924/19043 , H01L2924/3511 , H01L2224/81 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： The present invention provides a substrate treating method including the steps of joining a one-side surface of a substrate to be treated to a support substrate, treating the substrate to be treated in the condition where the substrate to be treated is supported by the support substrate, and removing the support substrate from the substrate to be treated. The step of joining the substrate to be treated to the support substrate includes melting a joint bump formed on the substrate to be treated so as to join the substrate to be treated to the support substrate, and the step of removing the support substrate from the substrate to be treated includes polishing the support substrate so as to remove the support substrate.
摘要翻译：本发明提供了一种基板处理方法，包括以下步骤：将待处理基板的单面表面连接到支撑基板上，在被处理基板被支撑基板支撑的状态下处理待处理基板从待处理的基板上除去支撑基板。将待处理基板接合到支撑基板的步骤包括熔化形成在待处理基板上的接合凸起，以将待处理的基板接合到支撑基板，以及从基板移除支撑基板的步骤待处理包括抛光支撑基板以移除支撑基板。

20. 发明申请

US20060124345A1 Method for manufacturing board with built-in device and board with built-in device and method for manufacturing printed wiring board and printed wiring board 有权
标题翻译：具有内置装置的板的制造方法和用于制造印刷线路板和印刷线路板的内置装置和方法
公开(公告)号：US20060124345A1
公开(公告)日：2006-06-15
申请号：US10523331
申请日：2003-06-20
申请人： Hiroshi Asami , Orui Ken , Kusano Hidetoshi , Fumito Hiwatashi
发明人： Hiroshi Asami , Orui Ken , Kusano Hidetoshi , Fumito Hiwatashi
IPC分类号： H05K1/00 , H05K3/30 , H05K3/10
CPC分类号： H05K1/187 , H01L21/6835 , H01L23/3128 , H01L23/3157 , H01L23/49816 , H01L24/10 , H01L24/13 , H01L24/24 , H01L24/81 , H01L24/97 , H01L25/105 , H01L2221/68345 , H01L2221/68377 , H01L2224/13 , H01L2224/13111 , H01L2224/13144 , H01L2224/16237 , H01L2224/24227 , H01L2224/8121 , H01L2224/81815 , H01L2224/83192 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H05K3/205 , H05K3/386 , H05K3/4614 , H05K3/4617 , H05K2201/0394 , H05K2201/10674 , H05K2203/063 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A device-incorporated substrate and a method of manufacturing a device-incorporated substrate, as well as a printed circuit board and a method of manufacturing a printed circuit board in which a fine-pitch conductor pattern can be formed on an insulating layer with high precision while securing the dimensional stability of the conductor pattern, are provided. A transfer sheet (61) has a structure that includes two layers, a metal base material (62) and a dissolvee metal layer (64), and a conductor pattern (55) is formed on the dissolvee metal layer (64) through electroplating. Then, after the transfer sheet (61) on which the conductor pattern (55) is formed is adhered onto an insulating base material (51), the transfer sheet (61) is removed through a step of separating the metal base material (62) from the dissolvee metal layer (64), and a step of selectively dissolving and removing the dissolvee metal layer (64) with respect to the conductor pattern (55).
摘要翻译：一种基于器件的衬底和一种制造器件结合衬底的方法，以及印刷电路板和制造印刷电路板的方法，其中可以在绝缘层上以高精度形成精细间距导体图案同时确保导体图案的尺寸稳定性。转印片（61）具有包括金属基材（62）和溶解金属层（64）的两层的结构，并且通过电镀在溶解金属层（64）上形成导体图案（55）。然后，在其上形成有导体图案（55）的转印片（61）粘附到绝缘基材（51）上之后，通过分离金属基材（62）的步骤去除转印片（61）从所述溶解金属层（64）和相对于所述导体图案（55）选择性地溶解和除去所述溶解金属层（64）的步骤。

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