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    • 16. 发明授权
    • Compound semiconductor apparatus and method for manufacturing the
apparatus
    • 化合物半导体装置及其制造方法
    • US6071780A
    • 2000-06-06
    • US285778
    • 1999-04-05
    • Naoya OkamotoHitoshi TanakaNaoki Hara
    • Naoya OkamotoHitoshi TanakaNaoki Hara
    • H01L21/28H01L21/314H01L21/316H01L21/335H01L21/336H01L29/51
    • H01L29/517H01L21/28158H01L21/28264H01L21/314H01L21/31604H01L29/66446H01L29/66522
    • An undoped GaAs layer and a GaAs active layer are formed on a GaAs semiconductor substrate in that order, and a surface of the GaAs active layer is inactivated. Thereafter, a wafer composed of the GaAs semiconductor substrate, the undoped G&As layer and the GaAs active layer is annealed at temperatures ranging from 570 to 580.degree. C. in a molecular beam epitaxy apparatus. Thereafter, the wafer is maintained at temperatures ranging from 350 to 500.degree. C., and an insulating layer made of amorphous GaAs is formed on the GaAs active layer while using tertiary-butyl-gallium-sulfide-cubane "((t-Bu)GaS).sub.4 " as a source of the insulating layer. Thereafter, the insulating layer is patterned according to a photo-lithography method to form a gate insulating layer on the GaAs active layer. Thereafter, a source electrode and a drain electrode are formed on both sides of the gate insulating layer to arrange the source and drain electrodes separated from each other on the GaAs active layer, and a gate electrode is formed on the gate insulating layer.
    • 在GaAs半导体衬底上依次形成未掺杂的GaAs层和GaAs有源层,GaAs活性层的表面失活。 然后,在分子束外延装置中,将由GaAs半导体衬底,未掺杂的G&As层和GaAs有源层构成的晶片在570〜580℃的温度下退火。 此后,将晶片保持在350〜500℃的温度范围内,在GaAs活性层上形成由非晶GaAs形成的绝缘层,同时使用叔丁基硫化镓 - 立方体“((t-Bu) GaS)4“作为绝缘层的源。 此后,根据光刻法将绝缘层图案化,以在GaAs有源层上形成栅极绝缘层。 然后,在栅极绝缘层的两侧形成源电极和漏电极,在GaAs有源层上排列相互分离的源电极和漏电极,在栅极绝缘层上形成栅电极。
    • 18. 发明授权
    • Compound semiconductor field effect transistor having an amorphous gas
gate insulation layer
    • 具有无定形气体栅极绝缘层的化合物半导体场效应晶体管
    • US5920105A
    • 1999-07-06
    • US16419
    • 1998-01-30
    • Naoya OkamotoHitoshi TanakaNaoki Hara
    • Naoya OkamotoHitoshi TanakaNaoki Hara
    • H01L21/28H01L21/314H01L21/316H01L21/335H01L21/336H01L29/51H01L29/78
    • H01L29/517H01L21/28158H01L21/28264H01L21/314H01L21/31604H01L29/66446H01L29/66522
    • An undoped GaAs layer and a GaAs active layer are formed on a GaAs semiconductor substrate in that order, and a surface of the GaAs active layer is inactivated. Thereafter, a wafer composed of the GaAs semiconductor substrate, the undoped GaAs layer and the GaAs active layer is annealed at temperatures ranging from 570 to 580.degree. C. in a molecular beam epitaxy apparatus. Thereafter, the wafer is maintained at temperatures ranging from 350 to 500.degree. C., and an insulating layer made of amorphous GaAs is formed on the GaAs active layer while using tertiary-butyl-gallium-sulfide-cubane "((t-Bu)GaS).sub.4 " as a source of the insulating layer. Thereafter, the insulating layer is patterned according to a photo-lithography method to form a gate insulating layer on the GaAs active layer. Thereafter, a source electrode and a drain electrode are formed on both sides of the gate insulating layer to arrange the source and drain electrodes separated from each other on the GaAs active layer, and a gate electrode is formed on the gate insulating layer.
    • 在GaAs半导体衬底上依次形成未掺杂的GaAs层和GaAs有源层,GaAs活性层的表面失活。 此后,在分子束外延装置中,将由GaAs半导体衬底,未掺杂的GaAs层和GaAs有源层组成的晶片在570〜580℃的温度下退火。 此后,将晶片保持在350〜500℃的温度范围内,在GaAs活性层上形成由非晶GaAs形成的绝缘层,同时使用叔丁基硫化镓 - 立方体“((t-Bu) GaS)4“作为绝缘层的源。 此后,根据光刻法将绝缘层图案化,以在GaAs有源层上形成栅极绝缘层。 然后,在栅极绝缘层的两侧形成源电极和漏电极,在GaAs有源层上排列相互分离的源电极和漏电极,在栅极绝缘层上形成栅电极。