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11. 发明申请

US20110180692A1 OPTICAL RECEIVER CIRCUIT 有权
标题翻译：光接收电路
公开(公告)号：US20110180692A1
公开(公告)日：2011-07-28
申请号：US12987116
申请日：2011-01-08
申请人： Shougo MATSUDA , Hiroyuki Yoshioka , Ryuichi Satomura , Hideyuki Takahashi , Akihiko Goto
发明人： Shougo MATSUDA , Hiroyuki Yoshioka , Ryuichi Satomura , Hideyuki Takahashi , Akihiko Goto
IPC分类号： H03F3/08
CPC分类号： H03F3/087
摘要： An optical receiver circuit is configured as follows: a preamplifier and a reference voltage generating circuit are connected with a first ground potential wiring and a first power supply wiring, which are used in common, and are formed in a first region where elements are formed on a substrate to which the potential of the first ground potential wiring is supplied; a main amplifier is connected with a second ground potential wiring and a second power supply wiring, which are separated from the first ground potential wiring and the first power supply wiring, and is formed in a second region where elements are formed on the substrate to which the potential of the second ground potential wiring is supplied; and a substrate supply interval where a first substrate supply position at which the potential of the first ground potential wiring is supplied and a second substrate supply position at which the potential of the second ground potential wiring is supplied are closest to each other is large to an extent where a substrate permeability characteristic, in which noise is fully attenuated in an alternating current (AC) manner, is obtained.
摘要翻译：光接收器电路如下构成：前置放大器和参考电压产生电路与第一地电位布线和第一电源布线相连，共同使用，并形成在形成元件的第一区域中提供第一接地电位布线的电位的基板; 主放大器与与第一接地电位布线和第一电源布线分离的第二接地电位布线和第二电源布线连接，并且形成在第二区域中，元件形成在基板上提供第二地电位布线的电位; 以及提供第一接地电位布线的电位的第一基板供给位置和供给第二接地电位布线的电位的第二基板供给位置彼此最接近的基板供给间隔大到其中以交流（AC）方式完全衰减噪声的衬底磁导率特性的程度。

12. 发明授权

US07518389B2 Interface assembly and dry gas enclosing apparatus using same 失效
标题翻译：接口组件和使用其的干燥气体封闭装置
公开(公告)号：US07518389B2
公开(公告)日：2009-04-14
申请号：US11407479
申请日：2006-04-20
申请人： Akihiko Goto
发明人： Akihiko Goto
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R31/2889
摘要： An interface assembly provided at a test head, for connecting a probe card to the test head. The interface assembly includes an interface comprising an interface body and a coaxial connector supported by the interface body, and a casing for enclosing a dry gas that is introduced between the test head and the probe card and leaks into the test head through a gap formed by the interface (20) in a state where the coaxial connector is engaged with a mating coaxial connector provided at the probe card. An interface assembly provided at a test head, for connecting a probe card to the test head, the interface assembly comprising: an interface comprising an interface body and a coaxial connector supported by the interface body; and a cover member provided at the interface, for enclosing a dry gas that is introduced between the test head and the probe card and leaks into the test head through a gap formed by the interface in a state where the coaxial connector is engaged with a mating coaxial connector provided at the probe card.
摘要翻译：设置在测试头的接口组件，用于将探针卡连接到测试头。所述接口组件包括接口主体和由所述接口体支撑的同轴连接器的接口，以及用于封闭干燥气体的壳体，所述干燥气体被引入到所述测试头和所述探针卡之间，并通过由所述测试头形成的间隙而泄漏到所述测试头中所述接口（20）处于所述同轴连接器与设置在所述探针卡处的配合同轴连接器接合的状态。一种接口组件，设置在测试头处，用于将探针卡连接到测试头，所述接口组件包括：接口，包括接口主体和由所述接口体支撑的同轴连接器; 以及设置在界面处的盖构件，用于封闭引入测试头和探针卡之间的干燥气体，并且在同轴连接器与配合物接合的状态下通过由界面形成的间隙而泄漏到测试头中同轴连接器设置在探针卡上。

13. 发明授权

US5335702A Cutting and forming device for lead frame for the semiconductor device 失效
标题翻译：用于半导体器件的引线框架的切割和成形装置
公开(公告)号：US5335702A
公开(公告)日：1994-08-09
申请号：US900898
申请日：1992-06-18
申请人： Akihiko Goto
发明人： Akihiko Goto
IPC分类号： B21D28/00 , H01L23/50 , H05K13/00 , B21F1/00
CPC分类号： H05K13/0092 , H01L2924/0002 , Y10T29/53183
摘要： A cutting and forming device of a lead frame of a resin molded semi-finished semiconductor device makes use of a press mechanism having a speed deceleration function in the vicinity of a bottom dead point of a press ram. The device includes an upper die base and a lower die base, a stripper frame, a die, a feeder for lead frames, and a machine base. The feeder is mounted over the lower die base and fixed to the machine base. In order to reduce impact noise when the stripper frame and the feeder abut with each other, there is provided an air cylinder mounted on the machine base and a cam follower plate fixed to an underside of the lower die base as well as a cam plate slidably mounted on the machine base for horizontal movement by the air cylinder which is driven by a driving mechanism independent from that for the press ram. In an alternative arrangement, the air cylinder may be fixed to the lower die base and carry the feeder in such a way as to allow the feeder to move up and down through the air cylinder. All the noise making impacts concentrate in the vicinity of the bottom dead point of the press ram and this enables to reduce noise during the press operation.
摘要翻译：树脂模制半成品半导体装置的引线框架的切割成形装置利用在压力机的下死点附近具有减速功能的冲压机构。该装置包括上模底座和下模座，剥离器框架，模具，引线框架的进料器和机座。进料器安装在下模底座上并固定在机器底座上。为了减轻剥离器框架和进料器相互抵接时的冲击噪声，设置有安装在机器基座上的气缸和固定到下模座底面的凸轮随动板以及可滑动地安装在机器基座上，由气缸水平运动，气缸由独立于压力机的驱动机构驱动。在另一种配置中，气缸可以固定在下模座上，并以这样一种方式进给进料器，以使进料器能够上下移动穿过气缸。所有产生噪音的冲击集中在压力机压头的下死点附近，这样可以降低压机操作过程中的噪音。

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