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    • 19. 发明授权
    • Wiring board and method of producing the same
    • 接线板及其制造方法
    • US06998336B1
    • 2006-02-14
    • US11070200
    • 2005-03-03
    • Masahiro IbaHajime SakaiTakahiro Hayashi
    • Masahiro IbaHajime SakaiTakahiro Hayashi
    • H01L21/44
    • H05K3/3484H05K3/244H05K3/3463H05K3/3473H05K2203/043
    • A method of producing a wiring board includes a preliminary plating step of forming a solder resist layer such that the main layer of each metal pad of the board is exposed in each corresponding opening and covering the surface of the exposed main layer with a preliminary Sn plated layer. A solder paste application step involves applying a solder paste, containing solder powder comprised of the high temperature Sn solder and thicker than the preliminary Sn plated layer, on the preliminary Sn plated layer. A subsequent solder melting step involves forming the Sn solder covering layer by melting the solder paste layer together with the preliminary Sn plated layer by heating the solder paste layer to a temperature higher than the liquid phase line temperature of the high temperature Sn solder. This wettingly extends the melted layers over the surface of the main layer.
    • 一种布线基板的制造方法,其特征在于,具有:形成阻焊层的预镀工序,使得板的每个金属焊盘的主层在相应的开口中露出,并且利用预镀Sn镀层覆盖暴露的主层的表面 层。 焊膏施加步骤包括在预镀Sn镀层上涂覆含有由高温Sn焊料构成的焊料粉末并且比预备Sn镀层厚的焊膏。 随后的焊料熔化步骤包括通过将焊膏层加热到高于高温Sn焊料的液相管线温度的温度,通过将焊膏层与预浸镀锡层一起熔化来形成Sn焊料覆盖层。 这使熔融层在主层的表面上湿润地延伸。