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11. 发明授权

US08943679B2 Device for manufacturing antenna pattern frame for built-in antenna 有权
标题翻译：内置天线天线图案框制造装置
公开(公告)号：US08943679B2
公开(公告)日：2015-02-03
申请号：US12650005
申请日：2009-12-30
申请人： Dae Kyu Lee , Jae Suk Sung , Sung Eun Cho , Dae Seong Jeon , Dae Ki Lim , Chan Gwang An , Ha Ryong Hong , Nam Il Seo
发明人： Dae Kyu Lee , Jae Suk Sung , Sung Eun Cho , Dae Seong Jeon , Dae Ki Lim , Chan Gwang An , Ha Ryong Hong , Nam Il Seo
IPC分类号： B23P19/00 , H01P11/00 , H01Q1/38 , H01Q1/24
CPC分类号： H01Q1/243 , B21D5/00 , B29C45/14065 , B29L2031/3456 , H01Q1/38 , H01Q1/50 , Y10T29/49016 , Y10T29/49018 , Y10T29/5313
摘要： A device for manufacturing an antenna pattern frame includes a conveyor for conveying a radiator sheet including antenna radiators successively arranged thereon in a form of cells, the antenna radiators including respective antenna pattern portions for receiving an external signal, a bending mold for successively forming connection terminal portions in the radiator sheet that is being conveyed, by using a bending process, and an injection mold for injection-molding antenna frames such that the antenna pattern portions are placed on one set of respective sides of the radiator frames and the connection terminal portions are placed on another set of respective opposite sides of the radiator frames.
摘要翻译：一种用于制造天线图案框架的装置包括：输送机，用于输送包括以单元格形式连续地布置在其上的天线辐射器的散热片，所述天线辐射器包括用于接收外部信号的各个天线图案部分，用于连续形成连接端子的弯曲模具通过使用弯曲工艺在散热片中被传送的部分，以及用于注射成型天线框架的注射模具，使得天线图案部分放置在散热器框架和连接端子部分的一组各自的侧面上放置在散热器框架的另一组相应的相对侧上。

12. 发明申请

US20120281384A1 COMMUNICATIONS TERMINAL AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：通信终端及其制造方法
公开(公告)号：US20120281384A1
公开(公告)日：2012-11-08
申请号：US13461321
申请日：2012-05-01
申请人： Ha Ryong HONG , Dae Ki LIM , Chang Mok HAN , Hyun Do PARK , Dae Kyu Lee , Sung Eun CHO , Jae Suk SUNG , Chan Gwang AN , Sang Woo BAE
发明人： Ha Ryong HONG , Dae Ki LIM , Chang Mok HAN , Hyun Do PARK , Dae Kyu Lee , Sung Eun CHO , Jae Suk SUNG , Chan Gwang AN , Sang Woo BAE
IPC分类号： H05K7/00 , B29C45/14
CPC分类号： H04M1/026 , B29C45/14639 , B29C45/1671 , B29C2045/1673 , B29L2031/3437 , B29L2031/3456 , H01Q1/243 , H01Q7/00
摘要： There are provided a communications terminal, in which an antenna and a case are integrally formed, and a method of manufacturing the same. The communications terminal includes: a terminal body; a case coupled to the terminal body to form an exterior of the terminal; and an antenna part including an antenna pattern integrally formed with the case and an elastic pin formed at one end of the antenna pattern to be electrically connected to a wireless module provided in the terminal body.
摘要翻译：提供了一种通信终端及其制造方法，其中天线和壳体一体形成。通信终端包括：终端主体; 耦合到所述终端主体以形成所述终端的外部的壳体; 以及天线部分，其包括与壳体一体形成的天线图案和形成在天线图案的一端处以与设置在终端主体中的无线模块电连接的弹性销。

13. 发明授权

US08982009B2 Antenna pattern frame, method and mold for manufacturing the same, and electronic device 有权
标题翻译：天线图案框架，其制造方法和模具以及电子设备
公开(公告)号：US08982009B2
公开(公告)日：2015-03-17
申请号：US12649820
申请日：2009-12-30
申请人： Jae Suk Sung , Ki Won Chang , Ha Ryong Hong , Chang Mok Han , Chan Gwang An , Duk Woo Lee , Hyun Kil Nam , Dae Kyu Lee , Sang Woo Bae , Byung Hwa Lee
发明人： Jae Suk Sung , Ki Won Chang , Ha Ryong Hong , Chang Mok Han , Chan Gwang An , Duk Woo Lee , Hyun Kil Nam , Dae Kyu Lee , Sang Woo Bae , Byung Hwa Lee
IPC分类号： H01Q1/40 , H01Q1/24 , B29C45/14 , H01Q5/00 , H01Q9/04 , H01Q9/42 , B29L31/34
CPC分类号： H01Q1/40 , B29C45/14065 , B29C45/14639 , B29K2101/00 , B29K2705/00 , B29L2031/3456 , H01Q1/243 , H01Q5/371 , H01Q9/0421 , H01Q9/42
摘要： An antenna pattern frame according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal; a ground portion extending from the antenna pattern portion; a connection portion connecting the antenna pattern portion and the ground portion to be arranged in different planes; and a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion may be provided on one side of the radiator frame and the connection terminal portion may be provided on the other side thereof, the radiator frame allowing the antenna pattern portion to be embedded in the electronic device case.
摘要翻译：根据本发明的一个方面的天线图案框架可以包括：具有发射和接收信号的天线图案部分的散热器; 从天线图案部分延伸的接地部分; 连接天线图案部分和接地部分的连接部分布置在不同的平面中; 以及通过在散热器上注射成型而制造的散热器框架，使得天线图案部分可以设置在散热器框架的一侧，并且连接端子部分可以设置在其另一侧，散热器框架允许天线图案部分嵌入电子设备外壳。

14. 发明申请

US20100271272A1 ANTENNA PATTERN FRAME, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE 有权
标题翻译：天线图案框，其制造方法和模具以及电子设备
公开(公告)号：US20100271272A1
公开(公告)日：2010-10-28
申请号：US12649820
申请日：2009-12-30
申请人： Jae Suk Sung , Ki Won Chang , Ha Ryong Hong , Chang Mok Han , Chan Gwang An , Duk Woo Lee , Hyun Kil Nam , Dae Kyu Lee , Sang Woo Bae , Byung Hwa Lee
发明人： Jae Suk Sung , Ki Won Chang , Ha Ryong Hong , Chang Mok Han , Chan Gwang An , Duk Woo Lee , Hyun Kil Nam , Dae Kyu Lee , Sang Woo Bae , Byung Hwa Lee
IPC分类号： H01Q1/40 , H01Q1/24 , B29C45/14 , B29C45/00
CPC分类号： H01Q1/40 , B29C45/14065 , B29C45/14639 , B29K2101/00 , B29K2705/00 , B29L2031/3456 , H01Q1/243 , H01Q5/371 , H01Q9/0421 , H01Q9/42
摘要： An antenna pattern frame according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal; a ground portion extending from the antenna pattern portion; a connection portion connecting the antenna pattern portion and the ground portion to be arranged in different planes; and a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion may be provided on one side of the radiator frame and the connection terminal portion may be provided on the other side thereof, the radiator frame allowing the antenna pattern portion to be embedded in the electronic device case.
摘要翻译：根据本发明的一个方面的天线图案框架可以包括：具有发射和接收信号的天线图案部分的散热器; 从天线图案部分延伸的接地部分; 连接天线图案部分和接地部分的连接部分布置在不同的平面中; 以及通过在散热器上注射成型而制造的散热器框架，使得天线图案部分可以设置在散热器框架的一侧，并且连接端子部分可以设置在其另一侧，散热器框架允许天线图案部分嵌入电子设备外壳。

15. 发明申请

US20100271270A1 ELECTRONIC DEVICE CASE, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND MOBILE COMMUNICATIONS TERMINAL 有权
标题翻译：电子设备案例，其制造方法和模具以及移动通信终端
公开(公告)号：US20100271270A1
公开(公告)日：2010-10-28
申请号：US12608818
申请日：2009-10-29
申请人： Jae Suk SUNG , Sung Eun Cho , Ha Ryong Hong , Dae Kyu Lee , Dae Seong Jeon , Ki Won Chang , Tae Sung Kim , Dae Ki Lim , Hyun Do Park , Nam II Seo
发明人： Jae Suk SUNG , Sung Eun Cho , Ha Ryong Hong , Dae Kyu Lee , Dae Seong Jeon , Ki Won Chang , Tae Sung Kim , Dae Ki Lim , Hyun Do Park , Nam II Seo
IPC分类号： H01Q1/40 , H01Q1/24 , B29C45/14 , B29C45/00
CPC分类号： B29D99/006 , B29C45/14065 , B29C45/14639 , B29L2031/3456 , H01Q1/243 , H01Q1/40 , H01Q1/42 , H01Q9/0421 , H04M1/026 , H04W88/02
摘要： An electronic device case having an antenna pattern embedded therein according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion of the radiator is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof; and a case frame covering the one side of the radiator frame on which the antenna pattern portion is provided so that the antenna pattern portion is embedded between the case frame and the radiator frame.
摘要翻译：根据本发明的一个方面的具有嵌入其中的天线方向图的电子设备壳体可以包括：具有发送和接收信号的天线图案部分的散热器和允许信号被发送到电路板并从电路板接收的连接端子部分的电子设备; 连接部，其部分地形成所述散热器，并将所述天线图案部分和所述连接端子部分连接在不同的平面内; 散热器框架，其通过在散热器上注射成型而制造，使得散热器的天线图案部分设置在散热器框架的一侧，并且连接端子部分设置在其另一侧上; 以及壳体框架，其覆盖设置有天线图案部分的辐射体框架的一侧，使得天线图案部分嵌入在壳体框架和散热器框架之间。

16. 发明授权

US08289216B2 Antenna-embedded case for mobile communications terminal, method of manufacturing the same, and mobile communications terminal 有权
标题翻译：用于移动通信终端的天线嵌入式壳体，制造方法以及移动通信终端
公开(公告)号：US08289216B2
公开(公告)日：2012-10-16
申请号：US12608874
申请日：2009-10-29
申请人： Sung Eun Cho , Jae Gyu Go , Yong Shik Na , Dae Kyu Lee , Chan Gwang An , Hyun Kil Nam , Byung Hwa Lee , Dae Seong Jeon , Ha Ryong Hong , Jae Suk Sung
发明人： Sung Eun Cho , Jae Gyu Go , Yong Shik Na , Dae Kyu Lee , Chan Gwang An , Hyun Kil Nam , Byung Hwa Lee , Dae Seong Jeon , Ha Ryong Hong , Jae Suk Sung
IPC分类号： H01Q1/24
CPC分类号： B29C45/1671 , B29L2031/3431 , B29L2031/3437 , B29L2031/3456 , H01Q1/243 , H01Q9/0421 , H04M1/026
摘要： A method of manufacturing an antenna-embedded case for a mobile communications terminal includes providing an antenna pattern, forming a first injection-molded member covering one surface of the antenna pattern, and disposing the first injection-molded member, provided with the antenna pattern on one surface thereof, in a second mold with the antenna pattern disposed in a space inside the second mold, and injection-molding a second injection-molded member covering the other surface of the antenna pattern to embed the antenna pattern between the first injection-molded member and the second injection-molded member.
摘要翻译：一种制造用于移动通信终端的天线嵌入式壳体的方法包括提供天线图案，形成覆盖天线图案的一个表面的第一注射成型构件，并将设置有天线图案的第一注射成型构件设置在在第二模具中，天线图案设置在第二模具内部的空间中，并且注塑成型覆盖天线图案的另一表面的第二注射成型构件，以将天线图案嵌入第一注塑模制件构件和第二注塑构件。

17. 发明授权

US08711041B2 Case of electronic device having antenna pattern embedded therein and mold and method for manufacturing the same 失效
标题翻译：具有嵌入其中的天线图案的电子设备的情况及其制造方法
公开(公告)号：US08711041B2
公开(公告)日：2014-04-29
申请号：US13103398
申请日：2011-05-09
申请人： Chang Hok Han , Ha Ryong Hong , Ki Won Chang , Duk Woo Lee , Hyun Sam Mun , Dae Seong Jeon , Tae Sung Kim , Hyun Kil Nam , Jae Suk Sung , Dae Kyu Lee
发明人： Chang Hok Han , Ha Ryong Hong , Ki Won Chang , Duk Woo Lee , Hyun Sam Mun , Dae Seong Jeon , Tae Sung Kim , Hyun Kil Nam , Jae Suk Sung , Dae Kyu Lee
IPC分类号： H01Q1/24
CPC分类号： B29C45/1671 , B29C45/0046 , B29C45/14065 , B29C45/14418 , B29C45/14639 , B29C45/14836 , B29C2045/0049 , B29L2031/3431 , B29L2031/3437 , B29L2031/3456 , B29L2031/3481 , H01Q1/243 , H01Q1/40 , H01Q5/40 , H01Q7/00 , H01Q9/0421
摘要： There is provided a case of an electronic device having an antenna pattern embedded therein, the case including: a radiator frame injection molded so that a radiator including an antenna pattern part formed of a metal sheet is exposed on one surface thereof; a case frame injection molded upward of the radiator frame, such that the radiator is embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inward of the case frame.
摘要翻译：提供一种具有嵌入其中的天线图案的电子设备的壳体，所述壳体包括：注射模制的散热器框架，使得包括由金属片形成的天线图案部分的散热器在其一个表面上露出; 在所述散热器框架的上方注射模塑框架，使得所述散热器嵌入在所述散热器框架和所述壳体框架之间; 以及形成散热器框架和壳体框架之间的边界并且具有形成在壳体框架内侧的槽的边界部分。

18. 发明授权

US08159400B2 Chip antenna and mobile-communication terminal having the same 失效
标题翻译：芯片天线和具有相同功能的移动通信终端
公开(公告)号：US08159400B2
公开(公告)日：2012-04-17
申请号：US12170999
申请日：2008-07-10
申请人： Chang Mok Han , Ki Won Chang , Duk Woo Lee , Dae Kyu Lee , Jeong Sik Seo , Hyun Do Park
发明人： Chang Mok Han , Ki Won Chang , Duk Woo Lee , Dae Kyu Lee , Jeong Sik Seo , Hyun Do Park
IPC分类号： H01Q1/24 , H01Q1/38
CPC分类号： H01Q1/38 , H01Q9/0407
摘要： There are provided a chip antenna and a mobile telecommunication terminal having the chip antenna. The chip antenna includes: a dielectric block having opposing top and bottom surfaces and a plurality of side surfaces connecting the top and bottom surfaces; a first conductive pattern formed on at least one of the surfaces of the dielectric block and connected to an external feeding part; a second conductive pattern formed on at least one of the surfaces of the dielectric block to connect to the first conductive pattern, and having one end connected to an external ground part; and a third conductive pattern formed on at least one of the surfaces of the dielectric block, and spaced apart from the first and second conductive patterns to be capacitively coupled to the first and second conductive patterns, respectively, the third conductive pattern having a lower end connected to the external ground part.
摘要翻译：提供了具有芯片天线的芯片天线和移动电信终端。芯片天线包括：具有相对的顶表面和底表面的介质块和连接顶表面和底表面的多个侧表面; 形成在介质块的至少一个表面上并连接到外部馈电部分的第一导电图案; 形成在所述介电块的至少一个表面上以连接到所述第一导电图案并且具有连接到外部接地部分的一端的第二导电图案; 以及形成在所述介质块的至少一个表面上并且与所述第一和第二导电图案间隔开以分别电容耦合到所述第一和第二导电图案的第三导电图案，所述第三导电图案具有下端连接到外部接地部分。

19. 发明申请

US20090015486A1 CHIP ANTENNA AND MOBILE-COMMUNICATION TERMINAL HAVING THE SAME 失效
标题翻译：芯片天线和移动通信终端
公开(公告)号：US20090015486A1
公开(公告)日：2009-01-15
申请号：US12170999
申请日：2008-07-10
申请人： Chang Mok Han , Ki Won Chang , Duk Woo Lee , Dae Kyu Lee , Jeong Sik Seo , Hyun Do Park
发明人： Chang Mok Han , Ki Won Chang , Duk Woo Lee , Dae Kyu Lee , Jeong Sik Seo , Hyun Do Park
IPC分类号： H01Q9/04
CPC分类号： H01Q1/38 , H01Q9/0407
摘要： There are provided a chip antenna and a mobile telecommunication terminal having the chip antenna. The chip antenna includes: a dielectric block having opposing top and bottom surfaces and a plurality of side surfaces connecting the top and bottom surfaces; a first conductive pattern formed on at least one of the surfaces of the dielectric block and connected to an external feeding part; a second conductive pattern formed on at least one of the surfaces of the dielectric block to connect to the first conductive pattern, and having one end connected to an external ground part; and a third conductive pattern formed on at least one of the surfaces of the dielectric block, and spaced apart from the first and second conductive patterns to be capacitively coupled to the first and second conductive patterns, respectively, the third conductive pattern having a lower end connected to the external ground part.
摘要翻译：提供了具有芯片天线的芯片天线和移动电信终端。芯片天线包括：具有相对的顶表面和底表面的介质块和连接顶表面和底表面的多个侧表面; 形成在介质块的至少一个表面上并连接到外部馈电部分的第一导电图案; 形成在所述介电块的至少一个表面上以连接到所述第一导电图案并且具有连接到外部接地部分的一端的第二导电图案; 以及形成在所述介质块的至少一个表面上并且与所述第一和第二导电图案间隔开以分别电容耦合到所述第一和第二导电图案的第三导电图案，所述第三导电图案具有下端连接到外部接地部分。

20. 发明申请

US20100208933A1 ELECTRONIC DEVICE MANUFACTURED BY MOLDING, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPLICATION USING THE SAME 审中-公开
标题翻译：通过成型制造的电子设备，用于制造它们的方法和模具以及使用该电子设备的电子应用
公开(公告)号：US20100208933A1
公开(公告)日：2010-08-19
申请号：US12629716
申请日：2009-12-02
申请人： Duk Woo Lee , Jae Suk Sung , Dae Kyu Lee , Tae Sook Yang , Young Ho Jeon
发明人： Duk Woo Lee , Jae Suk Sung , Dae Kyu Lee , Tae Sook Yang , Young Ho Jeon
IPC分类号： H04R1/02 , B29B13/02 , B29C45/14
CPC分类号： B29C45/14655 , B29C45/14065 , B29C45/14819 , B29C2045/14122 , H01H9/0214 , H01H9/0235 , H01H9/04 , H01H2223/002 , H01H2229/044 , H01H2231/032 , H04R1/1041 , H04R1/1075 , H04R2201/107 , H05K5/06
摘要： An electronic device manufactured by molding according to an aspect of the invention may include a driving unit supplying a signal upon being pressed and then returning to its original state; a board having the driving unit mounted thereon; a driving unit mold casing unit molded with the driving unit from a resin material such that the driving unit can be driven; and a casing molding unit molded to completely cover the board, together with the driving unit mold casing unit, to form the outer appearance.
摘要翻译：根据本发明的一个方面通过模制制造的电子装置可以包括：驱动单元，在被按压时提供信号，然后返回到其初始状态; 具有安装在其上的驱动单元的板; 驱动单元模具外壳单元，其由来自树脂材料的所述驱动单元模制，使得所述驱动单元能够被驱动; 以及模制成与驱动单元模具壳单元一起完全覆盖板的外壳模制单元，以形成外观。

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