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    • 18. 发明授权
    • Memory chip for high capacity memory subsystem supporting multiple speed bus
    • 支持多速总线的高容量内存子系统的内存芯片
    • US07809913B2
    • 2010-10-05
    • US11769006
    • 2007-06-27
    • Gerald Keith BartleyJohn Michael BorkenhagenPhilip Raymond Germann
    • Gerald Keith BartleyJohn Michael BorkenhagenPhilip Raymond Germann
    • G06F13/18
    • G06F13/4243
    • A memory module contains an interface for receiving memory access commands from an external source, in which a first portion of the interface receives memory access data at a first bus frequency and a second portion of the interface receives memory access data at a second different bus frequency. Preferably, the memory module contains a second interface for re-transmitting memory access data, also operating at dual frequency. The memory module is preferably used in a high-capacity memory subsystem organized in a tree configuration in which data accesses are interleaved. Preferably, the memory module has multiple-mode operation, one of which supports dual-speed buses for receiving and re-transmitting different parts of data access commands, and another of which supports conventional daisy-chaining.
    • 存储器模块包含用于从外部源接收存储器访问命令的接口,其中接口的第一部分以第一总线频率接收存储器访问数据,并且接口的第二部分以第二不同总线频率接收存储器访问数据 。 优选地,存储器模块包含第二接口,用于重新传输也以双频操作的存储器访问数据。 存储器模块优选地用于以树形结构组织的高容量存储器子系统,其中数据访问是交错的。 优选地,存储器模块具有多模式操作,其中之一支持用于接收和重新传送数据访问命令的不同部分的双速总线,另一个支持常规的菊花链。
    • 19. 发明授权
    • Hub for supporting high capacity memory subsystem
    • 用于支持高容量内存子系统的集线器
    • US07921271B2
    • 2011-04-05
    • US11769019
    • 2007-06-27
    • Gerald Keith BartleyJohn Michael BorkenhagenPhilip Raymond Germann
    • Gerald Keith BartleyJohn Michael BorkenhagenPhilip Raymond Germann
    • G06F13/18
    • G06F13/4243
    • A high-capacity memory subsystem architecture utilizes multiple memory modules arranged in one or more clusters, each attached to a respective hub which in turn is attached to a memory controller. Within a cluster, data is interleaved so that each data access command accesses all modules of the cluster. The hub communicates with the memory modules at a lower bus frequency, but the distributing of data among multiple modules enables the cluster to maintain the composite data rate of the memory-controller-to-hub bus. Preferably, the memory system employs buffered memory chips having dual-mode operation, one of which supports a cluster configuration in which data is interleaved and the communications buses operate at reduced bus width and/or reduced bus frequency to match the level of interleaving.
    • 高容量存储器子系统架构利用布置在一个或多个簇中的多个存储器模块,每个存储器模块连接到相应的集线器,该集线器又连接到存储器控制器。 在集群内,数据被交织,以便每个数据访问命令访问集群的所有模块。 集线器以较低的总线频率与存储器模块通信,但是在多个模块之间分配数据使集群能够保持存储器 - 控制器到集线器总线的复合数据速率。 优选地,存储器系统采用具有双模操作的缓冲存储器芯片,其中之一支持数据被交错的集群配置,并且通信总线以减小的总线宽度和/或减少的总线频率进行操作以匹配交织级别。