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11. 发明专利

JP2000337534A STOP VALVE AND PIPING SYSTEM 失效
公开(公告)号：JP2000337534A
公开(公告)日：2000-12-05
申请号：JP15007099
申请日：1999-05-28
申请人： NISSO ENGINEERING CO LTD , HARUNA KK
发明人： YONETANI AKIRA , UEDA KOJI , SATO JUNICHI
IPC分类号： F16K7/17 , F16K11/00
摘要： PROBLEM TO BE SOLVED: To provide a stop valve that is suitable for making its footprint small while maintaining such fundamental valve functions as safety and opening/ closing action, and a piping system that has a small footprint. SOLUTION: The stop valve is so constructed that a body 1 has a valve element, a valve operating mechanism, and a line forming part 2 integrated on the lower side and partly integrated with a valve seat facing a fluid passage and the valve element, and that the valve element pressed on and separated from the valve seat by the valve operating mechanism closes and opens the inflow-outflow connection of the fluid passage accordingly. Improvements are made in that one inflow passage portion 21 of the fluid passage opens, at its end situated in the body 1, onto the valve element and has the valve seat at the opening end, and in that the other passage portion 22 has two or more lines which connect to a generally C-channeled relay passage portion adapted to be disconnected from that one passage portion 21 when the valve element is on the valve seat and at least one of which serves as the outflow fluid passage.

12. 发明专利

JP2002217165A EQUIPMENT AND METHOD FOR PROCESSING SOLUTION FOR SEMICONDUCTOR WAFER 失效
公开(公告)号：JP2002217165A
公开(公告)日：2002-08-02
申请号：JP2001009915
申请日：2001-01-18
申请人： NISSO ENGINEERING CO LTD
发明人： HARADA MICHIYUKI , MIYAKOSHI EIICHI , KOBAYASHI NORIYUKI , YONETANI AKIRA , KATAYANAGI MAMORU , KACHI TOSHIMITSU , HORIKI YASUYUKI
IPC分类号： H01L21/306 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To effectively realize a series of processes of etching, purification, regeneration and reuse by effectively removing NOx contained in a solution after etching process. SOLUTION: An equipment for processing a solution for treating a semiconductor wafer 1 using a chemical solution containing nitric acid and hydrofluoric acid as an etching solution provides a supporting means 20 for levelly supporting and rotating the semiconductor wafer 1, a chemical solution ejecting means 22 for ejecting the etching solution, and a pure water ejecting means 22 that ejects pure water. The equipment comprises recovery means 21A that recovers etching solution used for the treatment, a recovery tank 3 that stores a recovered etching solution recovered by recovery means 21A, a gas suction mouth 3b provided at the bottom side of the recovery tank 3 for inducing gas like inert gas, and means for measuring absorbency 33 and 34 by which the end point of the purification treatment of the recovered etching solution can be detected with a gas induced from the gas suction mouth 3b.

13. 发明专利

JP2001085385A METHOD AND DEVICE FOR ETCHING SILICON 失效
公开(公告)号：JP2001085385A
公开(公告)日：2001-03-30
申请号：JP2000206105
申请日：2000-07-07
申请人： NISSO ENGINEERING CO LTD , DISCO ABRASIVE SYSTEMS LTD
发明人： YONETANI AKIRA , KOBAYASHI NORIYUKI , IZUTA NOBUHIKO
IPC分类号： H01L21/306
摘要： PROBLEM TO BE SOLVED: To re-use an etching liquid with no degradation in etching quality by contacting the etching liquid which was used for etching to a gas which is inactive to the etching liquid, and removing NOx generated at etching from the etching liquid. SOLUTION: An etching liquid 34 which was used for etching and flows on the surface of a silicon wafer 10 is recovered into a recovering means 16. The recovered etching liquid 34 flows down to a main part 64 of a gas-liquid contact tower 62 through a flow path 76. At the gas-liquid contact tower 62, the gas supplied from a gas supply source 72 flows to under the main part 64 while flows upward through the main part 64. At the main part 64 with numerous filling elements packed, the etching liquid 34 contacts the rising gas. So, NOx generated by etching is removed together with the gas from the etching liquid 34.

14. 发明专利

JP2001237209A SCRUB CLEANING DEVICE 失效
公开(公告)号：JP2001237209A
公开(公告)日：2001-08-31
申请号：JP2000044343
申请日：2000-02-22
申请人： NISSO ENGINEERING CO LTD
发明人： SAWAURA MITSUO , YONETANI AKIRA , KAWASHIMA TSUTOMU
IPC分类号： B08B1/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To realize a scrub cleaning device which is enhanced in cleaning efficiency, performance, and maintainability. SOLUTION: A scrub cleaning device is equipped with a wafer rotating/ holding means 1 which rotates a wafer W while holding it nearly in a vertical position, a brush means 2 which scrubs the one side or both the sides of the wafer W while rotating on its own axis. The brush means 2 is formed like a bottomed cylinder consisting of a rotary shaft member 21 provided with a large number of liquid-passing holes 25 bored in its wall surface, and a brush member 22 mounted on the outer wall surface of the rotary shaft member 21. A cleaning liquid is supplied from a liquid feed means 3 into the cylinder through the one opening 21a of the rotary shaft member 21, and discharged out through the liquid passing holes 25 passing through the brush member 22.

15. 发明专利

JP2001031185A FLUID STORAGE TANK AND STORAGE TANK EQUIPMENT 失效
公开(公告)号：JP2001031185A
公开(公告)日：2001-02-06
申请号：JP20437499
申请日：1999-07-19
申请人： NISSO ENGINEERING CO LTD
发明人： YONETANI AKIRA , UEDA KOJI , OZAWA KIMIYOSHI
IPC分类号： B65D88/20 , B65D90/02
摘要： PROBLEM TO BE SOLVED: To obtain a fluid storage tank and a storage tank equipment simple in structure and effective in quality control. SOLUTION: A fluid storage tank 10 has a construction mainly composed of a tank body 1 having a manhole 2a which can be sealed and through which a worker can go in and out of the tank body, a nozzle 2b provided on the lower side of the tank body, and an outlet and inlet port nozzle 2d for an in- tank internal pressure regulating sealing gas, which is provided on the upper side of the tank body. In this fluid storage tank 10, a deformable linear 5 is provided which is formed into a substantially baggy shape, whose upper 5A side is folded toward a lower 5B side via a section portion 5C and the like on the circumference of the bag so that a content volume V can be reduced, and which has a first outlet and inlet port nozzle 6a corresponding to the nozzle 2b and second outlet and inlet port nozzles 6b, 6c. The liner 5 can be housed and arranged in the tank body 1 in a replaceable manner through the manhole 2a. A process fluid (a) is introduced into and discharged through the first port nozzle 6a.

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