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11. 发明申请

US20100134129A1 MECHANICAL DECOUPLING OF A PROBE CARD ASSEMBLY TO IMPROVE THERMAL RESPONSE 有权
公开(公告)号：US20100134129A1
公开(公告)日：2010-06-03
申请号：US12327643
申请日：2008-12-03
申请人： Keith J. Breinlinger , Eric D. Hobbs
发明人： Keith J. Breinlinger , Eric D. Hobbs
IPC分类号： G01R31/26 , G01R1/067 , G01R31/02
CPC分类号： G01R31/2874 , G01R31/2889
摘要： A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.

12. 发明授权

US07692433B2 Sawing tile corners on probe card substrates 失效
标题翻译：在探针卡片基板上锯切瓦角
公开(公告)号：US07692433B2
公开(公告)日：2010-04-06
申请号：US11455110
申请日：2006-06-16
申请人： Benjamin N. Eldridge , Roy J. Henson , Eric D. Hobbs , Peter B. Mathews , Makarand S. Shinde
发明人： Benjamin N. Eldridge , Roy J. Henson , Eric D. Hobbs , Peter B. Mathews , Makarand S. Shinde
IPC分类号： G01R31/26
CPC分类号： G01R1/07342
摘要： A composite substrate for testing semiconductor devices is formed by selecting a plurality of substantially identical individual substrates, cutting a corner from at least some of the individual substrates in accordance with their position in a final array configuration, and then assembling the individual substrates into the final array configuration. The final array configuration of substrates with corners cut or sawed away conforms more closely to the surface area of a wafer being tested, and can easily fit within space limits of a test environment.
摘要翻译：用于测试半导体器件的复合衬底通过选择多个基本上相同的单独衬底形成，根据它们在最终阵列构型中的位置从至少一些单个衬底切割拐角，然后将各个衬底组装成最终阵列配置。具有切割或锯切的角落的基底的最终阵列配置更接近于正被测试的晶片的表面积，并且可以容易地适应在测试环境的空间极限内。

13. 发明申请

US20090260960A1 SWITCH FOR USE IN MICROELECTROMECHANICAL SYSTEMS (MEMS) AND MEMS DEVICES INCORPORATING SAME 失效
标题翻译：用于微电子系统（MEMS）的开关和与其同时的MEMS器件
公开(公告)号：US20090260960A1
公开(公告)日：2009-10-22
申请号：US12106364
申请日：2008-04-21
申请人： John K. Gritters , Eric D. Hobbs , Sangtae Park , Jun Jason Yao
发明人： John K. Gritters , Eric D. Hobbs , Sangtae Park , Jun Jason Yao
IPC分类号： H01H59/00 , H02N1/00
CPC分类号： H01H1/60 , H01H1/0036 , H01H59/0009 , H01H2001/0047 , H01H2001/0052 , H01H2001/0078
摘要： Embodiments of the present invention provide microelectromechanical systems (MEMS) switching methods and apparatus having improved performance and lifetime as compared to conventional MEMS switches. In some embodiments, a MEMS switch may include a resilient contact element comprising a beam and a tip configured to wipe a contact surface; and a MEMS actuator having an open position that maintains the tip and the contact surface in a spaced apart relation and a closed position that brings the tip into contact with the contact surface, wherein the resilient contact element and the MEMS actuator are disposed on a substrate and are movable in a plane substantially parallel to the substrate. In some embodiments, various contact elements are provided for the MEMS switch. In some embodiments, various actuators are provided for control of the operation of the MEMS switch.
摘要翻译：与常规MEMS开关相比，本发明的实施例提供了具有改进的性能和寿命的微机电系统（MEMS）开关方法和装置。在一些实施例中，MEMS开关可以包括弹性接触元件，其包括梁和构造成擦拭接触表面的尖端; 以及MEMS致动器，其具有将尖端和接触表面保持间隔的关系和使尖端与接触表面接触的闭合位置的打开位置，其中弹性接触元件和MEMS致动器设置在基板上并且可以在基本上平行于基板的平面中移动。在一些实施例中，为MEMS开关提供各种接触元件。在一些实施例中，提供各种致动器用于控制MEMS开关的操作。

14. 发明申请

US20090206860A1 APPARATUS AND METHOD FOR ADJUSTING THERMALLY INDUCED MOVEMENT OF ELECTRO-MECHANICAL ASSEMBLIES 有权
标题翻译：用于调整电子机械装置的热诱导运动的装置和方法
公开(公告)号：US20090206860A1
公开(公告)日：2009-08-20
申请号：US12165325
申请日：2008-06-30
申请人： Andrew W. McFarland , Kevin Youl Yasumura , Eric D. Hobbs , Keith J. Breinlinger
发明人： Andrew W. McFarland , Kevin Youl Yasumura , Eric D. Hobbs , Keith J. Breinlinger
IPC分类号： G01R1/04
CPC分类号： G01R1/44 , G01R1/07307 , G01R31/2891
摘要： A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting force applied to the electro-mechanical assembly as temperature changes.
摘要翻译：一种用于调节机电组件的一个或多个热诱导运动的热调节装置包括：补偿元件以不同于机电组件膨胀的第二速率的第一速率膨胀以产生响应于变化的反作用力温度; 以及将补偿元件耦合到机电组件的耦合机构，并且可调节以在温度变化时控制施加到机电组件的抵抗力的量。

15. 发明申请

US20080157789A1 ROTATING CONTACT ELEMENT AND METHODS OF FABRICATION 失效
标题翻译：旋转接触元件和制造方法
公开(公告)号：US20080157789A1
公开(公告)日：2008-07-03
申请号：US11617394
申请日：2006-12-28
申请人： Eric D. Hobbs
发明人： Eric D. Hobbs
IPC分类号： G01R31/02 , H01L23/58 , H05K3/20
CPC分类号： G01R1/06716 , G01R1/06733 , Y10T29/49128
摘要： Rotating contact elements and methods of fabrication are provided herein. In one embodiment, a rotating contact element includes a tip having a first side configured to contact a device to be tested and an opposing second side; and a plurality of deformed members extending from the second side of the tip and arranged about a central axis thereof, wherein the tip rotates substantially about the central axis upon compression of the plurality of deformed members.
摘要翻译：本文提供旋转接触元件和制造方法。在一个实施例中，旋转接触元件包括尖端，其具有被配置为接触待测试装置和相对的第二侧的第一侧; 以及多个变形构件，其从所述尖端的第二侧延伸并围绕其中心轴线布置，其中当所述多个变形构件压缩时，所述尖端基本上围绕所述中心轴线旋转。

16. 发明授权

US07368930B2 Adjustment mechanism 失效
标题翻译：调整机制
公开(公告)号：US07368930B2
公开(公告)日：2008-05-06
申请号：US11464593
申请日：2006-08-15
申请人： Eric D. Hobbs , Christopher D. McCoy , James M. Porter, Jr. , Alexander H. Slocum
发明人： Eric D. Hobbs , Christopher D. McCoy , James M. Porter, Jr. , Alexander H. Slocum
IPC分类号： G01R31/02
CPC分类号： G01R31/2891 , G01R31/31905
摘要： A probe card assembly can comprise a support structure to which a plurality of probes can be directly or indirectly attached. The probes can be disposed to contact an electronic device to be tested. The probe card assembly can further comprise actuators, which can be configured to change selectively an attitude of the support structure with respect to a reference structure. The probe card assembly can also comprise a plurality of lockable compliant structures. While unlocked, the lockable compliant structures can allow the support structure to move with respect to the reference structure. While locked, however, the compliant structures can provide mechanical resistance to movement of the support structure with respect to the reference structure.
摘要翻译：探针卡组件可以包括支撑结构，多个探针可以直接或间接附接到支撑结构。可以将探针设置成接触要测试的电子设备。探针卡组件还可以包括致动器，其可以被配置为相对于参考结构选择性地改变支撑结构的姿态。探针卡组件还可以包括多个可锁定的柔顺结构。当解锁时，可锁定的柔性结构可以允许支撑结构相对于参考结构移动。然而，当锁定时，柔性结构可以提供对支撑结构相对于参考结构的移动的机械阻力。

17. 发明申请

US20080079449A1 METHOD AND APPARATUS FOR INDIRECT PLANARIZATION 失效
标题翻译：用于间接平面化的方法和装置
公开(公告)号：US20080079449A1
公开(公告)日：2008-04-03
申请号：US11537164
申请日：2006-09-29
申请人： Eric D. Hobbs
发明人： Eric D. Hobbs
IPC分类号： G01R31/02
CPC分类号： G01R1/07364
摘要： Methods and apparatus for indirect planarization of a substrate are provided herein. In one embodiment, an apparatus for indirectly planarizing a probe card assembly includes an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly; a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from the adjustment portion; and a mechanism coupling the adjustment portion to the force application portion.
摘要翻译：本文提供了用于衬底的间接平面化的方法和装置。在一个实施例中，用于间接平面化探针卡组件的装置包括用于控制施加到探针卡组件的探针基板的力的调节部分; 力施加部，其构造成在从所述调节部侧向偏移的位置处向所述探针基板施加力; 以及将调节部联接到力施加部的机构。

18. 发明授权

US08400173B2 Method and apparatus for thermally conditioning probe cards 有权
标题翻译：用于热调节探针卡的方法和装置
公开(公告)号：US08400173B2
公开(公告)日：2013-03-19
申请号：US12492177
申请日：2009-06-26
申请人： Eric D. Hobbs
发明人： Eric D. Hobbs
IPC分类号： G01R31/00 , G01R31/10
CPC分类号： G01R31/2874
摘要： Embodiments of probe cards and methods for fabricating and using same are provided herein. In some embodiments, an apparatus for testing a device (DUT) may include a probe card configured for testing a DUT; a thermal management apparatus disposed on the probe card to heat and/or cool the probe card; a sensor disposed on the probe card and coupled to the thermal management apparatus to provide data to the thermal management apparatus corresponding to a temperature of a location of the probe card; a first connector disposed on the probe card and coupled to the thermal management apparatus for connecting to a first power source internal to a tester; and a second connector, different than the first connector, disposed on the probe card and coupled to the thermal management apparatus for connecting to a second power source external to the tester.
摘要翻译：本文提供了探针卡及其制造和使用方法的实施例。在一些实施例中，用于测试设备（DUT）的设备可以包括配置用于测试DUT的探针卡; 设置在探针卡上以加热和/或冷却探针卡的热管理装置; 传感器，设置在所述探针卡上并耦合到所述热管理装置，以向与所述探针卡的位置的温度相对应的所述热管理装置提供数据; 第一连接器，其设置在所述探针卡上并且耦合到所述热管理装置，用于连接到测试仪内部的第一电源; 以及与第一连接器不同的第二连接器，其设置在探针卡上并且耦合到热管理装置，用于连接到测试仪外部的第二电源。

19. 发明授权

US08138859B2 Switch for use in microelectromechanical systems (MEMS) and MEMS devices incorporating same 失效
标题翻译：开关用于微机电系统（MEMS）和结合其的MEMS器件
公开(公告)号：US08138859B2
公开(公告)日：2012-03-20
申请号：US12106364
申请日：2008-04-21
申请人： John K. Gritters , Eric D. Hobbs , Sangtae Park , Jun Jason Yao
发明人： John K. Gritters , Eric D. Hobbs , Sangtae Park , Jun Jason Yao
IPC分类号： H01H51/22 , H01H57/00
CPC分类号： H01H1/60 , H01H1/0036 , H01H59/0009 , H01H2001/0047 , H01H2001/0052 , H01H2001/0078
摘要： Embodiments of the present invention provide microelectromechanical systems (MEMS) switching methods and apparatus having improved performance and lifetime as compared to conventional MEMS switches. In some embodiments, a MEMS switch may include a resilient contact element comprising a beam and a tip configured to wipe a contact surface; and a MEMS actuator having an open position that maintains the tip and the contact surface in a spaced apart relation and a closed position that brings the tip into contact with the contact surface, wherein the resilient contact element and the MEMS actuator are disposed on a substrate and are movable in a plane substantially parallel to the substrate. In some embodiments, various contact elements are provided for the MEMS switch. In some embodiments, various actuators are provided for control of the operation of the MEMS switch.
摘要翻译：与常规MEMS开关相比，本发明的实施例提供了具有改进的性能和寿命的微机电系统（MEMS）开关方法和装置。在一些实施例中，MEMS开关可以包括弹性接触元件，其包括梁和构造成擦拭接触表面的尖端; 以及MEMS致动器，其具有将尖端和接触表面保持间隔开的关闭位置和使尖端与接触表面接触的闭合位置，其中弹性接触元件和MEMS致动器设置在基板上并且可以在基本上平行于基板的平面中移动。在一些实施例中，为MEMS开关提供各种接触元件。在一些实施例中，提供各种致动器用于控制MEMS开关的操作。

20. 发明申请

US20110156735A1 WAFER TEST CASSETTE SYSTEM 有权
标题翻译： WAFER测试CASSETTE系统
公开(公告)号：US20110156735A1
公开(公告)日：2011-06-30
申请号：US12979200
申请日：2010-12-27
申请人： Keith J. Breinlinger , Eric D. Hobbs
发明人： Keith J. Breinlinger , Eric D. Hobbs
IPC分类号： G01R31/00
CPC分类号： G01R1/0491 , G01R31/3025
摘要： Wafer cassette systems and methods of using wafer cassette systems. A wafer cassette system can include a base and a probe card assembly. The base and the probe card assembly can each include complementary interlocking alignment elements. The alignment elements can constrain relative movement of the base and probe card assembly in directions parallel to a wafer receiving surface of the base, while permitting relative movement in a direction perpendicular to the receiving surface.
摘要翻译：晶圆盒系统和使用晶片盒系统的方法。晶片盒系统可以包括基座和探针卡组件。基座和探针卡组件可以各自包括互补的互锁对准元件。对准元件可以约束基部和探针卡组件在平行于基部的晶片接收表面的方向上的相对运动，同时允许在垂直于接收表面的方向上的相对运动。

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