会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 12. 发明授权
    • FETS with self-aligned bodies and backgate holes
    • 具有自对准主体和后盖孔的FET
    • US07659579B2
    • 2010-02-09
    • US11539288
    • 2006-10-06
    • Brent A. AndersonAndres BryantEdward J. NowakRichard Q. Williams
    • Brent A. AndersonAndres BryantEdward J. NowakRichard Q. Williams
    • H01L29/78
    • H01L29/78612H01L29/66772H01L29/78621H01L29/78648
    • A FET has a shallow source/drain region, a deep channel region, a gate stack and a back gate that is surrounded by dielectric. The FET structure also includes halo or pocket implants that extend through the entire depth of the channel region. Because a portion of the halo and well doping of the channel is deeper than the source/drain depth, better threshold voltage and process control is achieved. A back-gated FET structure is also provided having a first dielectric layer in this structure that runs under the shallow source/drain region between the channel region and the back gate. This first dielectric layer extends from under the source/drain regions on either side of the back gate and is in contact with a second dielectric such that the back gate is bounded on each side or isolated by dielectric.
    • FET具有浅电源/漏极区域,深沟道区域,栅极堆叠和被电介质包围的背栅极。 FET结构还包括延伸通过通道区域的整个深度的晕或凹坑植入物。 因为沟道的一部分光晕和阱掺杂比源极/漏极深度更深,所以实现了更好的阈值电压和过程控制。 还提供了后栅化FET结构,其具有在该结构中的第一介电层,其在沟道区域和后栅极之间的浅源极/漏极区域下方延伸。 该第一电介质层从背栅的两侧的源极/漏极区下方延伸并与第二电介质接触,使得后栅极在每一侧上界定或通过电介质隔离。
    • 15. 发明申请
    • Doped Single Crystal Silicon Silicided eFuse
    • 掺杂单晶硅硅胶eFuse
    • US20080153278A1
    • 2008-06-26
    • US12043226
    • 2008-03-06
    • Edward J. NowakJed H. RankinWilliam R. TontiRichard Q. Williams
    • Edward J. NowakJed H. RankinWilliam R. TontiRichard Q. Williams
    • H01L21/84
    • H01L27/10H01L23/5256H01L2924/0002H01L2924/3011H01L2924/00
    • An eFuse begins with a single crystal silicon-on-insulator (SOI) structure that has a single crystal silicon layer on a first insulator layer. The single crystal silicon layer is patterned into a strip. Before or after the patterning, the single crystal silicon layer is doped with one or more impurities. At least an upper portion of the single crystal silicon layer is then silicided to form a silicided strip. In one embodiment the entire single crystal silicon strip is silicided to create a silicide strip. Second insulator(s) is/are formed on the silicide strip, so as to isolate the silicided strip from surrounding structures. Before or after forming the second insulators, the method forms electrical contacts through the second insulators to ends of the silicided strip. By utilizing a single crystal silicon strip, any form of semiconductor, such as a diode, conductor, insulator, transistor, etc. can form the underlying portion of the fuse structure. The overlying silicide material allows the fuse to act as a conductor in its unprogrammed state. However, contrary to metal or polysilicon based eFuses which only comprise an insulator in the programmed state, when the inventive eFuse is programmed (and the silicide is moved or broken) the underlying semiconductor structure operates as an active semiconductor device.
    • eFuse从在第一绝缘体层上具有单晶硅层的单晶硅绝缘体(SOI)结构开始。 将单晶硅层图案化成条带。 在构图之前或之后,单晶硅层掺杂有一种或多种杂质。 至少单晶硅层的上部然后被硅化以形成硅化带。 在一个实施例中,整个单晶硅带被硅化以产生硅化物条。 在硅化物条上形成第二绝缘体,从而将硅化物带与周围结构隔离。 在形成第二绝缘体之前或之后,该方法通过第二绝缘体形成与硅化带的端部的电接触。 通过使用单晶硅条,任何形式的半导体,例如二极管,导体,绝缘体,晶体管等都可以形成熔丝结构的下面部分。 上覆的硅化物材料允许熔丝作为未编程状态的导体。 然而,与仅编程状态的仅包含绝缘体的金属或多晶硅基eFuse相反,当本发明的eFuse被编程(并且硅化物被移动或断开)时,下面的半导体结构作为有源半导体器件工作。
    • 16. 发明授权
    • Doped single crystal silicon silicided eFuse
    • 掺杂单晶硅硅片eFuse
    • US07382036B2
    • 2008-06-03
    • US11161320
    • 2005-07-29
    • Edward J. NowakJed H. RankinWilliam R. TontiRichard Q. Williams
    • Edward J. NowakJed H. RankinWilliam R. TontiRichard Q. Williams
    • H01L27/148
    • H01L27/10H01L23/5256H01L2924/0002H01L2924/3011H01L2924/00
    • An eFuse begins with a single crystal silicon-on-insulator (SOI) structure that has a single crystal silicon layer on a first insulator layer. The single crystal silicon layer is patterned into a strip. Before or after the patterning, the single crystal silicon layer is doped with one or more impurities. At least an upper portion of the single crystal silicon layer is then silicided to form a silicided strip. In one embodiment the entire single crystal silicon strip is silicided to create a silicide strip. Second insulator(s) is/are formed on the silicide strip, so as to isolate the silicided strip from surrounding structures. Before or after forming the second insulators, the method forms electrical contacts through the second insulators to ends of the silicided strip. By utilizing a single crystal silicon strip, any form of semiconductor, such as a diode, conductor, insulator, transistor, etc. can form the underlying portion of the fuse structure. The overlying silicide material allows the fuse to act as a conductor in its unprogrammed state. However, contrary to metal or polysilicon based eFuses which only comprise an insulator in the programmed state, when the inventive eFuse is programmed (and the silicide is moved or broken) the underlying semiconductor structure operates as an active semiconductor device.
    • eFuse从在第一绝缘体层上具有单晶硅层的单晶硅绝缘体(SOI)结构开始。 将单晶硅层图案化成条带。 在构图之前或之后,单晶硅层掺杂有一种或多种杂质。 至少单晶硅层的上部然后被硅化以形成硅化带。 在一个实施例中,整个单晶硅带被硅化以产生硅化物条。 在硅化物条上形成第二绝缘体,从而将硅化物带与周围结构隔离。 在形成第二绝缘体之前或之后,该方法通过第二绝缘体形成与硅化带的端部的电接触。 通过使用单晶硅条,任何形式的半导体,例如二极管,导体,绝缘体,晶体管等都可以形成熔丝结构的下面部分。 上覆的硅化物材料允许熔丝作为未编程状态的导体。 然而,与仅编程状态的仅包含绝缘体的金属或多晶硅基eFuse相反,当本发明的eFuse被编程(并且硅化物被移动或断开)时,下面的半导体结构作为有源半导体器件工作。
    • 19. 发明授权
    • Integrated circuit (IC) with high-Q on-chip discrete capacitors
    • 集成电路(IC)与高Q片上分立电容
    • US07345334B2
    • 2008-03-18
    • US10908081
    • 2005-04-27
    • Edward J. NowakRichard Q. Williams
    • Edward J. NowakRichard Q. Williams
    • H01L29/72
    • H01L27/1203H01L27/0805H01L29/94
    • A semiconductor structure that may be a discrete capacitor, a Silicon On Insulator (SOI) Integrated Circuit (IC) including circuits with discrete such capacitors and/or decoupled by such discrete capacitors and an on-chip decoupling capacitor (decap). One capacitor plate may be a well (N-well or P-well) in a silicon bulk layer or a thickened portion of a surface silicon layer. The other capacitor plate may be doped polysilicon and separated from the first capacitor plate by capacitor dielectric, e.g., CVD or thermal oxide. Contacts to each of the capacitor plates directly connect and extend from the respective plates, such that direct contact is available from both plates.
    • 可以是分立电容器的半导体结构,包括具有离散这种电容器的电路和/或由这种分立电容器去耦合的片上绝缘体(SOI)集成电路(IC)和片上去耦电容器(decap))。 一个电容器板可以是硅本体层中的阱(N阱或P阱)或表面硅层的增厚部分。 另一个电容器板可以是掺杂多晶硅并且通过电容器电介质例如CVD或热氧化物与第一电容器板分离。 与每个电容器板的接触件从相应的板直接连接和延伸,使得从两个板可以直接接触。
    • 20. 发明授权
    • Method and apparatus for providing electrostatic discharge protection
    • 提供静电放电保护的方法和装置
    • US06256184B1
    • 2001-07-03
    • US09334088
    • 1999-06-16
    • Robert J. Gauthier Jr.Edward J. NowakSteven H. VoldmanRichard Q. Williams
    • Robert J. Gauthier Jr.Edward J. NowakSteven H. VoldmanRichard Q. Williams
    • H02H322
    • H01L27/0251H01L27/0266
    • An ESD protection method and apparatus are provided for an IC chip having an I/O pad and I/O circuitry coupled to the I/O pad. A low threshold voltage FET is coupled to the I/O pad in parallel with the I/O circuitry for protecting the IC chip from an ESD event on the I/O pad. The FET also is coupled to a first voltage terminal of the I/O circuitry for providing a shunting path for the ESD event, thereby effectuating the protecting of the IC chip from the ESD event on the I/O pad. A first control circuit is coupled to a gate of the FET for maintaining the gate at a voltage level below a threshold voltage of the FET, thereby maintaining the FET in an off state during normal operation of the IC chip. Preferably a second control circuit is coupled between the FET and the first voltage terminal and operates in conjunction with the first control circuit for maintaining the FET in an off state during normal operation of the IC chip. The first control circuit preferably comprises a short circuit between the gate of the FET and the first voltage terminal, an inverter coupled between the gate of the FET and a second voltage terminal or a negative bias generator coupled to the gate of the FET. The second control circuit preferably comprises a short circuit between the FET and the first voltage terminal or a diode coupled between the FET and the first voltage terminal.
    • 为具有耦合到I / O焊盘的I / O焊盘和I / O电路的IC芯片提供ESD保护方法和装置。 低阈值电压FET与I / O电路并联耦合到I / O焊盘,以保护IC芯片免受I / O焊盘上的ESD事件。 FET还耦合到I / O电路的第一电压端子,用于为ESD事件提供分流路径,从而实现IC芯片免受I / O焊盘上的ESD事件的保护。 第一控制电路耦合到FET的栅极,用于将栅极保持在低于FET阈值电压的电压电平,从而在IC芯片正常工作期间保持FET处于截止状态。 优选地,第二控制电路耦合在FET和第一电压端子之间,并且与第一控制电路一起操作,以在IC芯片的正常操作期间将FET保持在截止状态。 第一控制电路优选地包括在FET的栅极和第一电压端子之间的短路,耦合在FET的栅极和耦合到FET的栅极的第二电压端子或负偏压发生器之间的反相器。 第二控制电路优选地包括FET和第一电压端子之间的短路或耦合在FET和第一电压端子之间的二极管。