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    • 15. 发明授权
    • Method for making punches using multi-layer ceramic technology
    • 使用多层陶瓷技术制作冲孔的方法
    • US06352014B1
    • 2002-03-05
    • US09464510
    • 1999-12-15
    • David B. GolandDavid C. LongJohn U. KnickerbockerSubhash L. Shinde
    • David B. GolandDavid C. LongJohn U. KnickerbockerSubhash L. Shinde
    • B26F114
    • B26F1/14B23P15/24B26F2210/08H05K1/0306H05K3/005Y10T83/9423
    • A method for making small punches by employing multi-layer ceramic (MLC) technology includes the steps of preparing a sublaminate matrix of a high or low sintering temperature material, drilling holes in the sublaminate using a mask as a guide, filling the holes with punch material paste by a solupor process, laminating the sublaminate to a base plate or as a freestanding substrate, firing a laminate at an appropriate sintering temperature and removing the matrix material by a chemical or mechanical method. In accordance with the present invention, a large number of small punches are made in parallel to precise dimensions of two to ten mils in diameter and approximately 100 mils in length. This method allows that a punch plate array can also be used to simultaneously punch an array of vias in a greensheet and eliminates the additional step of loading individual punches into a punch plate, offering cost and time savings.
    • 通过采用多层陶瓷(MLC)技术制造小冲孔的方法包括以下步骤:制备高或低烧结温度材料的层压基质,使用掩模作为导向孔在该层压板上钻孔,用冲孔 通过溶剂法处理材料糊料,将层压材料层压到基板或独立的基材上,在适当的烧结温度下焙烧层压材料,并通过化学或机械方法除去基体材料。 根据本发明,大量的小冲头与直径为2至10密耳,长度为大约100密耳的精确尺寸并联制成。 该方法允许冲压板阵列也可以用于同时冲切毛坯中的通孔阵列,并且消除了将单个冲头加载到冲压板中的额外步骤,从而节约了成本和时间。
    • 16. 发明授权
    • Method for marking substrates
    • 标记基材的方法
    • US5808268A
    • 1998-09-15
    • US686239
    • 1996-07-23
    • James G. BalzMark J. LaPlanteDavid C. LongBrenda L. Peterson
    • James G. BalzMark J. LaPlanteDavid C. LongBrenda L. Peterson
    • G06K1/12B23K26/00
    • G06K1/126B41M5/24B41M5/26
    • A method for marking a surface with high-density indicia comprising the steps of providing a marking device, providing input data defining indicia to be marked on the surface wherein the indicia comprises characters and the input data further defines a font for each character of the indicia, determining pixels for each character in accordance with the font, forming raster lines in accordance with the pixels, and traversing each raster line with the marking device to mark the surface according to the pixels of the raster line. If a laser is used as the marking device, the laser may need time to recharge in between marking closely spaced pixels. Thus, the laser may pass over certain pixels while the laser is recharging. Therefore, the laser may have to make an additional pass over the raster line to mark the pixels that were skipped over while the laser was recharging.
    • 一种用于以高密度标记标记表面的方法,包括以下步骤:提供标记装置,提供定义要在表面上标记的标记的输入数据,其中标记包括字符,并且输入数据进一步限定标记的每个字符的字体 根据该字体确定每个字符的像素,根据像素形成光栅线,以及用标记装置遍历每个光栅线,以根据光栅线的像素来标记表面。 如果使用激光作为标记装置,激光器可能需要时间在标记紧密间隔的像素之间进行充电。 因此,激光可以在激光器再充电时通过某些像素。 因此,激光可能需要在光栅线上进行额外的通过,以便在激光充电时标记跳过的像素。
    • 18. 发明授权
    • Method for punching slug from workpiece
    • 从工件上冲压块塞的方法
    • US06276246B1
    • 2001-08-21
    • US09411575
    • 1999-10-04
    • Raschid J. BezamaLaertis EconomikosMark J. LaPlanteDavid C. LongKeith C. O'Neil
    • Raschid J. BezamaLaertis EconomikosMark J. LaPlanteDavid C. LongKeith C. O'Neil
    • B26D718
    • B26D7/1863B26D7/1854B26F2210/08H05K1/0306H05K3/005Y10T83/0453Y10T83/2066Y10T83/2068Y10T83/207
    • A punched slug removal system for punching a slug from a workpiece and removing the punched slug. The system includes a punch having a reciprocating travel path with a transition point where the punch changes direction. A die plate has an aperture into which a die bushing may be disposed. The die bushing provides support for the workpiece and has an opening through which the punch and a slug pass. A manifold supports the die plate and (if present) the die bushing and has a distribution channel and an orifice which direct a gas flow onto a slug attached to the punch in a direction perpendicular to the reciprocating travel path of the punch to remove the slug from the punch. The distribution channel is tapered to increase the velocity of the gas flow. The orifice is positioned at the top of the manifold adjacent the transition point of the reciprocating travel path of the punch. The manifold extends into the aperture of the die plate, reducing the cross sectional area of the aperture, and has a step formed under the punch. The system also includes a vacuum, offset relative to the punch and applied to the side of the punch opposite the orifice, to enhance removal of slugs from the punch.
    • 一种用于从工件上冲压块塞并且移除冲压块的冲压块塞移除系统。 该系统包括具有往复运动路径的冲头,其具有冲头改变方向的转变点。 模板具有可以设置模具衬套的孔。 模具衬套为工件提供支撑,并且具有穿孔穿过的开口。 歧管支撑模板和(如果存在)模具衬套,并且具有分配通道和孔口,该分配通道和孔口沿着垂直于冲头的往复运动路径的方向将气流引导到附接到冲头的塞子上,以移除塞子 从拳打 分配通道是锥形的,以增加气流的速度。 孔口位于歧管的顶部,与冲头的往复运动路径的过渡点相邻。 歧管延伸到模板的孔中,减小了孔的横截面积,并且具有形成在冲头下方的台阶。 该系统还包括真空,相对于冲头偏移并施加到与孔口相对的冲头侧面,以增强从冲头中移除塞子。