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11. 发明专利

JP2007208197A Chip element 有权
标题翻译：芯片元件
公开(公告)号：JP2007208197A
公开(公告)日：2007-08-16
申请号：JP2006028607
申请日：2006-02-06
申请人： Tohoku Univ , 国立大学法人東北大学
发明人： OMI TADAHIRO , MORIMOTO AKITA
IPC分类号： H01C7/00 , H01C13/00 , H01F27/29
CPC分类号： H01F17/0013 , H01F41/046
摘要： PROBLEM TO BE SOLVED: To provided a chip element with a small coefficient of thermal expansion and small change in a resistance value even in a temperature change of a use environment and using a low-permittivity resin of good quality without a problem such as disconnection. SOLUTION: In a chip element 10 formed with an impedance element 2 on a substrate 1, and a plurality of electrodes 3 and 5 connected to this impedance element 2, the substrate 1 is a low-permittivity material having a permittivity kept at as low a value as can reduce a parasitic capacitance in a GHz band. Further, the substrate 1 is constituted by containing at least a synthetic resin and an inorganic material. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使在使用环境的温度变化中，也可以使用低质量的低介电常数的树脂，即使在不产生问题的情况下，也能够提供具有小的热膨胀系数和小的电阻值变化的芯片元件作为断开连接。解决方案：在衬底1上形成有阻抗元件2的芯片元件10和连接到该阻抗元件2的多个电极3和5中，衬底1是介电常数维持在作为可以降低GHz频带中的寄生电容的值。此外，基板1由至少含有合成树脂和无机材料构成。版权所有（C）2007，JPO＆INPIT

12. 发明专利

JP2007096192A Multilayer circuit board with built-in semiconductor element 有权
标题翻译：具有内置半导体元件的多层电路板
公开(公告)号：JP2007096192A
公开(公告)日：2007-04-12
申请号：JP2005286440
申请日：2005-09-30
申请人： Ibiden Co Ltd , Tohoku Univ , イビデン株式会社 , 国立大学法人東北大学
发明人： ENOMOTO AKIRA , OMI TADAHIRO , MORIMOTO AKITA
IPC分类号： H01L25/10 , H01L25/11 , H01L25/18
CPC分类号： H01L2224/18 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01074 , H01L2924/01322 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a multilayer circuit board with built-in semiconductor elements which can efficiently radiating heat generated from semiconductor elements, and multilayer circuit board with a built-in semiconductor element which can securely electrically connect an electronic component such as a semiconductor element with a short wiring and also enables high-density mounting of semiconductor elements, miniaturization and increase in operation speed. SOLUTION: In the multilayer circuit board with built-in semiconductor elements, a plurality of boards with a built-in semiconductor element, which is housed in a recess provided on an insulated base material, are stacked. In this circuit board, a high-temperature transmissive ceramic is used for the insulated base material, a difference in a temperature range 20-300°C between the thermal expansion rate of the insulated base material and that of the semiconductor element is less than 1×10 -5 /K. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有能够有效地辐射由半导体元件产生的热量的内置半导体元件的多层电路板，以及具有内置半导体元件的多层电路板，其可以可靠地电连接诸如作为具有短布线的半导体元件，并且还能够实现半导体元件的高密度安装，小型化和增加操作速度。解决方案：在具有内置半导体元件的多层电路板中，堆叠容纳在设置在绝缘基材上的凹部中的具有内置半导体元件的多个板。在该电路基板中，绝缘基材使用高温透过性陶瓷，绝缘基材的热膨胀率与半导体元件的热膨胀率之间的温度范围为20〜300℃的差异小于1 ×10 -5 / K。版权所有（C）2007，JPO＆INPIT

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