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11. 发明申请

WO2009154260A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：可固化的有机聚硅氧烷组合物和半导体器件
公开(公告)号：WO2009154260A1
公开(公告)日：2009-12-23
申请号：PCT/JP2009/061137
申请日：2009-06-11
申请人： DOW CORNING TORAY CO., LTD. , SAGAWA, Takashi , TERADA, Masayoshi , YOSHITAKE, Makoto
发明人： SAGAWA, Takashi , TERADA, Masayoshi , YOSHITAKE, Makoto
IPC分类号： C08L83/06 , H01L23/29
CPC分类号： H01L23/296 , C08G77/12 , C08G77/14 , C08G77/20 , C08G77/80 , C08K5/56 , C08L83/00 , C08L83/04 , C08L83/06 , H01L33/483 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2924/1301 , H01L2924/00014 , H01L2924/00
摘要： A curable organopolysiloxane composition comprising: (A) an organopolysiloxane that contains in one molecule at least two alkenyl groups and at least 30 mole % of all silicon-bonded monovalent hydrocarbon groups in the form of aryl groups: (B) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms and at least 15 mole % of all silicon-bonded organic groups in the form of aryl groups; (C) a branched-chain organopolysiloxane that contains alkenyl, aryl, and epoxy-containing organic groups; and (D) a hydrosilylation catalyst. The composition is capable of forming a cured body that has a high index of refraction and strong adhesion to substrates.
摘要翻译：一种可固化的有机聚硅氧烷组合物，其包含：（A）在一个分子中含有至少两个烯基和至少30摩尔％的芳基形式的所有与硅键合的一价烃基的有机聚硅氧烷：（B）含有至少两个与硅键合的氢原子和至少15摩尔％的芳基形式的所有与硅键合的有机基团的分子; （C）含有烯基，芳基和含环氧基的有机基团的支链有机聚硅氧烷; 和（D）氢化硅烷化催化剂。该组合物能够形成具有高折射率和对基材的强粘附性的固化体。

12. 发明申请

WO2012002560A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开
标题翻译：可固化的有机聚硅氧烷组合物和光学半导体器件
公开(公告)号：WO2012002560A1
公开(公告)日：2012-01-05
申请号：PCT/JP2011/065247
申请日：2011-06-28
申请人： DOW CORNING TORAY CO., LTD. , YOSHITAKE, Makoto , YAMAKAWA, Mieko
发明人： YOSHITAKE, Makoto , YAMAKAWA, Mieko
IPC分类号： C08L83/04 , H01L23/29 , C08L83/05 , C08L83/07
CPC分类号： C08G77/20 , C08G77/12 , C08G77/16 , C08L83/04 , H01L23/296 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2924/09701 , C08L83/00 , H01L2924/00014
摘要： A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements and comprises at least the following components: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises a constituent (B-1) containing at least 0.5 wt.% of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt.% of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, if necessary, constituent (B-3) of an average molecular formula; and (C) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively high hardness.
摘要翻译：可用作光学半导体元件的密封剂或粘合剂的可固化的有机基聚硅氧烷组合物，并且至少包括以下组分：（A）含有平均组成式的组分（A-1）的烯基含有机聚硅氧烷和其组分（A-2）的平均组成式; （B）含有硅键合的氢原子的有机聚硅氧烷，并且包含含有至少0.5重量％的与硅键合的氢原子并由平均分子式表示的成分（B-1）的成分（B-2），含有至少0.5重量％的与硅键合的氢原子，并且由平均组成式表示，并且如果需要，平均分子式的组分（B-3）和（C）氢化硅烷化反应催化剂。该组合物可以形成具有透光性和粘合性的长久性能以及较高硬度的固化体。

13. 发明申请

WO2010087522A1 CURABLE SILICONE COMPOSITION THAT PROVIDES A HIGHLY TRANSPARENT CURED SILICONE MATERIAL 审中-公开
标题翻译：提供高度透明的固化硅材料的可固化硅胶组合物
公开(公告)号：WO2010087522A1
公开(公告)日：2010-08-05
申请号：PCT/JP2010/051660
申请日：2010-01-29
申请人： DOW CORNING TORAY CO., LTD. , HASEGAWA, Chiichiro , YOSHITAKE, Makoto , AKITOMO, Hiroshi
发明人： HASEGAWA, Chiichiro , YOSHITAKE, Makoto , AKITOMO, Hiroshi
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08L83/00
摘要： A curable silicone composition characteristically comprises (A) (A-I) an alkenyl- containingdialkylpolysiloxane and a viscosity of at least 1,000 mPa s to not more than 20,000 mPa-s and (A-2) an alkenyl-containing, resin-form organopolysiloxane that comprises the SiO 4/2 unit, R 1 2 R 2 SiO 1/2 unit, and R 1 3 SiO 1/2 unit wherein R 1 is alkyl and R 2 is alkenyl, that contains from 2.5 to 5.0 mass% alkenyl group, and that has a ratio for the total number of moles of R 1 2 R 2 SiO 1/2 and R 1 3 SiO 1/2 units to 1 mole of the SiO 4/2 unit in the range from 0.70 to 1.10; (B) an organopolysiloxane that contains at least 0.9 mass% silicon-bonded hydrogen; and (C) a hydrosilylation reaction catalyst and provides a bending-tolerant and highly transparent cured silicone material that characteristically has a hardness is in the range from 80 to 95, the parallel light transmittance at 200°C is a value that is at least 99% of the parallel light transmittance at 25°C.
摘要翻译：一种可固化有机硅组合物特征在于包含（A）（A1）含链烯基的二烷基聚硅氧烷和至少1,000mPa·s至不大于20,000mPa·s的粘度和（A-2）含链烯基的树脂型有机基聚硅氧烷，其包含 SiO 4/2单元，R 1 2R 2 SiO 1/2单元和R 1 3 SiO 1/2单元，其中R 1是烷基，R 2是含有2.5-5.0质量％链烯基的链烯基，并且具有总共 R1 2R2SiO1 / 2和R1 3SiO1 / 2单元的摩尔数相对于1摩尔的SiO 4/2单元在0.70至1.10的范围内; （B）含有至少0.9质量％硅键合氢的有机聚硅氧烷; 和（C）氢化硅烷化反应催化剂，并且提供具有硬度在80至95范围内的弯曲耐受性和高度透明的固化的硅氧烷材料，在200℃下的平行光透射率为至少99 25℃平行透光率的百分比。

14. 发明申请

WO2010027105A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT SEALANT, AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开
标题翻译：可固化的有机聚硅氧烷组合物，光学半导体元件密封剂和光学半导体器件
公开(公告)号：WO2010027105A1
公开(公告)日：2010-03-11
申请号：PCT/JP2009/065885
申请日：2009-09-04
申请人： DOW CORNING TORAY CO., LTD. , YOSHITAKE, Makoto , ENAMI, Hiroji , KATO, Tomoko , TERADA, Masayoshi
发明人： YOSHITAKE, Makoto , ENAMI, Hiroji , KATO, Tomoko , TERADA, Masayoshi
IPC分类号： C08L83/04 , H01L23/29
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/70 , C08L83/04 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , C08L83/00 , H01L2924/00
摘要： A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole% of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight%, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole% of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.
摘要翻译：一种可固化的有机聚硅氧烷组合物和光学半导体元件密封剂，每个包含（A）具有至少2个烯基的二有机聚硅氧烷，其中所有硅氧烷单元的至少70摩尔％是甲基苯基硅氧烷单元，三甲基-1,3,5-三苯基环三硅氧烷和1,3,5,7-四甲基-1,3,5,7-四苯基环四硅氧烷不超过5重量％，（B）具有至少2个硅键合的有机聚硅氧烷其中至少15摩尔％的与硅键合的有机基团是苯基的氢原子，和（C）氢化硅烷化反应催化剂。一种光学半导体器件，其中壳体内的光学半导体元件由上述组合物用固化产物密封。

15. 发明申请

WO2007148812A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：可固化的有机聚硅氧烷组合物和半导体器件
公开(公告)号：WO2007148812A1
公开(公告)日：2007-12-27
申请号：PCT/JP2007/062649
申请日：2007-06-18
申请人： DOW CORNING TORAY CO., LTD. , MORITA, Yoshitsugu , TERADA, Masayoshi , ENAMI, Hiroji , YOSHITAKE, Makoto
发明人： MORITA, Yoshitsugu , TERADA, Masayoshi , ENAMI, Hiroji , YOSHITAKE, Makoto
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08G77/70 , H01L2224/48091 , H01L2924/1301 , C08L83/00 , C08L2666/14 , H01L2924/00014 , H01L2924/00
摘要： A curable organopolysiloxane composition comprises at least the following components: an organopolysiloxane (A) represented by the following general formula: R 1 3 SiO(R 1 2 SiO) m SiR 1 3 (where R 1 is a monovalent hydrocarbon group, and "m" is an integer from 0 to 100); an organopolysiloxane (B) represented by the following average unit formula: (R 2 SiO 3/2 ) a (R 2 2 SiO 2/2 ) b (R 2 3 SiO 1/2 ) c (where R 2 is a monovalent hydrocarbon group, and "a", "b", and "c" are specific numbers); an organopolysiloxane (C) having in one molecule on average at least two silicon-bonded aryl groups and on average at least two silicon-bonded hydrogen atoms; and a hydrosilylation-reaction catalyst (D); is characterized by good fillability and curability and that, when cured, forms a cured body that possesses a high refractive index, high light transmissivity, and strong adhesion to various substrates.
摘要翻译：可固化的有机基聚硅氧烷组合物至少包含以下组分：由以下通式表示的有机聚硅氧烷（A）：R 1，S 3，

16. 发明申请

WO2007099863A1 CURABLE SILICONE RESIN COMPOSITION AND CURED BODY THEREOF 审中-公开
标题翻译：可固化的硅氧烷树脂组合物和固化体
公开(公告)号：WO2007099863A1
公开(公告)日：2007-09-07
申请号：PCT/JP2007/053347
申请日：2007-02-16
申请人： DOW CORNING TORAY CO., LTD. , YOSHITAKE, Makoto , TAKEUCHI, Kasumi , NAKANISHI, Koji
发明人： YOSHITAKE, Makoto , TAKEUCHI, Kasumi , NAKANISHI, Koji
IPC分类号： C08K9/10 , C08J3/14
CPC分类号： C08J3/226 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08J2383/04 , C08J2483/00 , C08K5/56 , C08L83/04 , C08L83/00
摘要： A hydrosilylation-curable silicone resin composition having a melting point of 50°C or higher and a melt viscosity at 150°C of 5,000 mPa s or higher, comprising a fine thermoplastic resin powder that contains a platinum-type catalyst; is a solid in a powdered form at room temperature, melts when heated, is suitable for transfer and injection molding, and is suitable for molding into a cured body that possesses high strength and is not subject to change of color under the effect of heat or ultraviolet radiation.
摘要翻译：熔点为50℃以上，150℃下的熔融粘度为5000mPa·s以上的氢化硅烷化固化型有机硅树脂组合物，其含有含铂型催化剂的细小热塑性树脂粉末; 在室温下为粉末状固体，加热时熔融，适用于转印和注射成型，适用于成型为具有高强度的固化体，并且在热的作用下不会变色，或紫外线辐射。

17. 发明申请

WO2013047898A1 CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF 审中-公开
标题翻译：可固化硅胶组合物及其固化产品
公开(公告)号：WO2013047898A1
公开(公告)日：2013-04-04
申请号：PCT/JP2012/075737
申请日：2012-09-27
申请人： DOW CORNING TORAY CO., LTD. , HIRAI, Kazuo , YOSHITAKE, Makoto
发明人： HIRAI, Kazuo , YOSHITAKE, Makoto
IPC分类号： C08L83/04 , C08L83/10
CPC分类号： C08G77/44 , C08G77/12 , C08G77/20 , C08L83/04 , C08L83/10
摘要： A curable silicone composition comprising: (A) an organopolysiloxane that has at least a straight-chain polysiloxane block represented by the general formula: -(R 1 R 2 SiO) m -, wherein R 1 is a C 1-6 alkyl group or the phenyl group, R 2 is a C 2-10 alkenyl group, and m is a positive number from 5 to 50; (B) an organopolysiloxane that has at least a straight-chain polysiloxane block represented by the general formula: -(R 3 HSiO) n -, wherein R 3 is a C 1-6 alkyl group or the phenyl group and n is a positive number from 10 to 100; and (C) a hydrosilylation reaction catalyst, cures to form a cured product that has a small thermal expansion coefficient.
摘要翻译：一种可固化有机硅组合物，其包含：（A）至少具有由以下通式表示的直链聚硅氧烷嵌段的有机聚硅氧烷： - （R 1 R 2 SiO）m - ，其中R 1是C 1-6烷基或苯基，R 2是 C2-10烯基，m为5〜50的正数; （B）至少具有由以下通式表示的直链聚硅氧烷嵌段的有机聚硅氧烷： - （R3HSiO）n-，其中R3是C1-6烷基或苯基，n是从10到 100; 和（C）氢化硅烷化反应催化剂，固化形成热膨胀系数小的固化物。

18. 发明申请

WO2012173167A1 CROSS-LINKABLE SILICONE COMPOSITION AND CROSS-LINKED PRODUCT THEREOF 审中-公开
标题翻译：交联硅胶组合物及其交联产品
公开(公告)号：WO2012173167A1
公开(公告)日：2012-12-20
申请号：PCT/JP2012/065181
申请日：2012-06-07
申请人： DOW CORNING TORAY CO., LTD. , YOSHITAKE, Makoto
发明人： YOSHITAKE, Makoto
IPC分类号： C08L83/04
CPC分类号： C08G77/38 , C08G77/12 , C08G77/20 , C08G77/80 , C08L83/04 , C08L83/00
摘要： A cross-linkable silicone composition comprising at least the following components: (A) an organopolysiloxane represented by an average unit formula and containing phenyl and alkenyl groups; (B) an organopolysiloxane represented by a general formula and containing phenyl and alkenyl groups; (C) an organopolysiloxane having in one molecule at least one phenyl group and two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst, can be cross-linked by a hydrosilylation reaction and forms a solid body which has high hardness at room temperature and becomes significantly soft or a liquefied at high temperature.
摘要翻译：一种可交联的有机硅组合物，其至少包含以下组分：（A）由平均单元式表示并含有苯基和烯基的有机聚硅氧烷; （B）由通式表示并含有苯基和烯基的有机聚硅氧烷; （C）在一个分子中具有至少一个苯基和两个与硅键合的氢原子的有机聚硅氧烷; 和（D）氢化硅烷化催化剂可以通过氢化硅烷化反应进行交联，并形成在室温下具有高硬度并变得显着柔软或在高温下液化的固体。

19. 发明申请

WO2010087523A1 CURABLE SILICONE COMPOSITION THAT PROVIDES A HIGHLY TRANSPARENT CURED SILICONE MATERIAL 审中-公开
标题翻译：提供高度透明的固化硅材料的可固化硅胶组合物
公开(公告)号：WO2010087523A1
公开(公告)日：2010-08-05
申请号：PCT/JP2010/051661
申请日：2010-01-29
申请人： DOW CORNING TORAY CO., LTD. , HASEGAWA, Chiichiro , YOSHITAKE, Makoto , AKITOMO, Hiroshi
发明人： HASEGAWA, Chiichiro , YOSHITAKE, Makoto , AKITOMO, Hiroshi
IPC分类号： C08L83/04 , C09D183/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C09D183/04 , C08L83/00 , C08K5/56
摘要： A curable silicone composition characteristically comprises (A) (A-1) a dialkylpolysiloxane that has at least two alkenyl groups in each molecule and a viscosity of at least 1,000 mPa•s to not more than 50,000 mPa•s and (A-2) an alkenyl-containing, resin-form organopolysiloxane that comprises the SiO 4/2 unit, R 1 R 2 SiO 1/2 unit, and R 1 3 SiO 1/2 unit wherein R 1 is alkyl and R 2 is alkenyl and that contains the alkenyl group in the range from at least 0.5 mass% to less than 3.5 mass%; (B) an organopolysiloxane that has at least three silicon-bonded hydrogen atoms; and (C) a hydrosilylation reaction catalyst and provides a highly transparent cured silicone material that characteristically has a hardness is in the range from at least 30 to not more than 80, the parallel light transmittance at 25 °C is at least 90%, and the parallel light transmittance at 200 °C is a value that is at least 99% of the parallel light transmittance at 25 °C.
摘要翻译：可固化的有机硅组合物特征在于包含（A）（A-1）在每个分子中具有至少两个烯基的二烷基聚硅氧烷和至少1,000mPa·s至50,000mPa·s以下的粘度和（A-2）包含SiO 4/2单元，R1R2SiO1 / 2单元和R1 3SiO1 / 2单元的含烯基的树脂形式的有机聚硅氧烷，其中R1是烷基，R2是链烯基并且含有至少0.5质量％％至小于3.5质量％; （B）具有至少三个与硅键合的氢原子的有机聚硅氧烷; 和（C）氢化硅烷化反应催化剂，并且提供特征在于硬度在至少30至不大于80的范围内的高度透明的固化的硅氧烷材料，25℃下的平行透光率为至少90％，以及在200℃下的平行透光率是在25℃下的平行光透射率的至少99％的值。

20. 发明申请

WO2007132932A1 CURABLE SILICONE RESIN COMPOSITION AND CURED BODY THEREOF 审中-公开
标题翻译：可固化硅树脂组合物及其固化体
公开(公告)号：WO2007132932A1
公开(公告)日：2007-11-22
申请号：PCT/JP2007/060182
申请日：2007-05-11
申请人： DOW CORNING TORAY CO., LTD. , YOSHITAKE, Makoto , TAKEUCHI, Kasumi , SAGAWA, Takashi , NAKANISHI, Koji
发明人： YOSHITAKE, Makoto , TAKEUCHI, Kasumi , SAGAWA, Takashi , NAKANISHI, Koji
IPC分类号： C08L83/04 , C08K5/5377 , C08K5/00
CPC分类号： C08K5/50 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08L83/04 , C08L83/00
摘要： A hydrosilylation-curable silicone resin composition having a melting point of not less than 5O0C and a melt-viscosity of not less than 5,000 mPa-s at 15O0C, which is characterized by having a phosphorous-containing hydrosilylation-reaction retardant; is solid at room temperature, melts with heating, suitable for transfer and injection molding, and, when cured, capable of forming a cured body of high strength and minimal color change under the effect of ultraviolet rays and heat.
摘要翻译：一种在150℃下熔点不低于50℃，熔融粘度不小于5000mPa·s的氢化硅烷化固化性有机硅树脂组合物，其特征在于具有含磷氢化硅烷化反应阻滞剂; 在室温下为固体，加热熔融，适于转印和注射成型，并且当固化时，能够在紫外线和热的作用下形成高强度和最小颜色变化的固化体。

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