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    • 16. 发明申请
    • ELECTROCHEMICAL CELL WITH WELD POINTS CONNECTIONS AND ENERGY STORAGE ASSEMBLY
    • 具有焊点的电化学电池连接和能量储存组件
    • WO2008128770A1
    • 2008-10-30
    • PCT/EP2008/003272
    • 2008-04-23
    • TEMIC AUTOMOTIVE ELECTRIC MOTORS GMBHENAX INC.BIRKE, PeterKELLER, MichaelTAKAHASHI, KazuhiroABE, HideoABE, KiyokoOZAWA, Kazunori
    • BIRKE, PeterKELLER, MichaelTAKAHASHI, KazuhiroABE, HideoABE, KiyokoOZAWA, Kazunori
    • H01M2/26
    • H01M2/266
    • The invention relates to an electrochemical cell (2) with a pair of electrodes (A, K) arranged as a stack of flat electrode films (A1 to An, K1 to Kn) separated by a separator film, wherein: electrode films (A1 to An, K1 to Kn) of each electrode (A, K) are electrically connected with each other through inner electrode conductors (4.A, 4.K); the inner electrode conductors (4.A, 4.K) of the different electrodes (A, K) are arranged on opposite sides of the electrochemical cell (2) in electrode material-free area of the electrode films (A1 to An, K1 to Kn); each inner electrode conductor (4.A, 4.K) is connected with the respective electrode films (A1 to An, K1 to Kn) through a predetermined number of weld points (5.1 to 5.z) in the electrode material -free area of the respective electrode (A, K); each inner electrode conductor (4.A, 4.K) comprises a predetermined number of openings (6.1 to 6.m) in which coupling elements are set to connect the inner electrode conductor (4.A, 4.K) with an outward electrode conductor (7.A, 7.K) for the respective electrode (A, K).
    • 本发明涉及一种具有一对电极(A,K)的电化学电池(2),其被布置成由分隔膜隔开的扁平电极膜(A1至An,K1至Kn)的叠层,其中:电极膜 每个电极(A,K)的一个,K1到Kn)通过内部电极导体(4.A,4.K)彼此电连接; 不同电极(A,K)的内部电极导体(4.A,4.K)被布置在电化学电池(2)的相对电极膜的电极材料区域(A1至An,K1 到Kn); 每个内电极导体(4.A,4.K)通过电极材料自由区域中的预定数量的焊接点(5.1至5.z)与各个电极膜(A1至An,K1至Kn)连接 的电极(A,K); 每个内部电极导体(4.A,4.K)包括预定数量的开口(6.1至6.m),其中连接元件设置成将内部电极导体(4.A,4.K)与外部 用于各个电极(A,K)的电极导体(7.A,7.K)。
    • 18. 发明申请
    • SURFACE PROTECTIVE SHEET FOR USE IN WAFER BACK GRINDING AND PROCESS FOR PRODUCING SEMICONDUCTOR CHIP
    • 用于回磨的表面保护片和用于生产半导体芯片的工艺
    • WO2003043076A2
    • 2003-05-22
    • PCT/JP2002/011566
    • 2002-11-06
    • LINTEC CORPORATIONIZUMI, TatsuyaTAKAHASHI, KazuhiroSENOO, HideoEBE, Kazuyoshi
    • IZUMI, TatsuyaTAKAHASHI, KazuhiroSENOO, HideoEBE, Kazuyoshi
    • H01L21/68
    • B24B55/00B24B7/228H01L21/6835H01L21/6836H01L2221/68327H01L2221/6834
    • Disclosed herein is a surface protective sheet for semiconductor wafer, used in wafer back grinding during a process comprising providing a wafer of predetermined thickness having a surface furnished with circuits and a back, forming grooves of a cut depth smaller than the thickness of the wafer from the wafer surface and grinding the back of the wafer so that the thickness of the wafer is reduced and so that the wafer is finally divided into individual semiconductor chips, which surface protective sheet comprises a base material and, superimposed thereon, a pressure sensitive adhesive layer, the base material comprising two or more constituent layers which include a first constituent layer of 10 to 300 μm thickness exhibiting a Young's modulus of 3000 to 30,000 N/m 2 , and a second constituent layer exhibiting a glass transition temperature, measured by DSC, of 70 C or below, the second constituent layer beingan outermost layer. The use of the surface protective sheet, in the so-called predicing process, not only enables maintaining a given calf interval during and after the wafer back grinding but also facilitates fitting of the stripping tape.
    • 本文公开了一种用于半导体晶片的表面保护片,用于在包括提供电路和背面的表面的预定厚度的晶片的工艺过程中的晶片背面研磨中,形成切割深度小于晶片厚度的凹槽 晶片表面并研磨晶片的背面,使得晶片的厚度减小,并且使得晶片最终分成单独的半导体芯片,该表面保护片包括基底材料并且叠加在其上的压敏粘合剂层 所述基材包含两个或多个构成层,所述构成层包括具有3000至30,000N / m 2的杨氏模量的10至300μm厚度的第一构成层,以及显示玻璃化转变温度的第二构成层,其由 DSC为70℃以下,第二构成层为最外层。 在所谓的检测过程中,使用表面保护片不仅可以在晶片背面研磨期间和之后保持给定的小腿间隔,而且有利于剥离胶带的装配。