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11. 发明申请

US20110120156A1 REFRIGERATION SYSTEM WITH PARALLEL EVAPORATORS AND VARIABLE SPEED COMPRESSOR 有权
标题翻译：具有平行蒸发器和可变速度压缩机的制冷系统
公开(公告)号：US20110120156A1
公开(公告)日：2011-05-26
申请号：US13018082
申请日：2011-01-31
申请人： Cullen E. Bash , Abdlmonem H. Beitelmal , Ratnesh K. Sharma , Chandrakant D. Patel
发明人： Cullen E. Bash , Abdlmonem H. Beitelmal , Ratnesh K. Sharma , Chandrakant D. Patel
IPC分类号： F25D17/06
CPC分类号： H05K7/20681 , F24F11/30 , F24F2110/10 , F25B5/02 , F25B49/025 , F25B2600/0253 , F25B2600/21 , F25B2600/2511 , F25B2700/2104 , F25B2700/21174 , F25B2700/21175 , Y02B30/741
摘要： A refrigeration system for controlling airflow around an air-cooled heat generating device having a plurality of components includes a refrigerant line split into second refrigerant lines, which are arranged in a parallel configuration with respect to each other. Evaporators are positioned along the second refrigerant lines and in the path of airflow supplied into the components or airflow exhausted from the components. The refrigeration system further includes a variable speed compressor and a controller for controlling the speed of the variable speed compressor. Furthermore, the refrigeration system includes a temperature sensor configured to transmit signals related to a detected temperature to the controller, and the controller is configured to vary the speed of the variable speed compressor based upon the detected temperature.
摘要翻译：用于控制具有多个部件的风冷发热装置周围的气流的制冷系统包括分成第二制冷剂管线的制冷剂管线，所述制冷剂管线相对于彼此并联配置。蒸发器沿着第二制冷剂管线定位并且在供应到部件中的气流的路径或从部件排出的气流中。制冷系统还包括变速压缩机和用于控制变速压缩机的速度的控制器。此外，制冷系统包括温度传感器，其被配置为将与检测到的温度相关的信号传送到控制器，并且控制器被配置为基于检测到的温度来改变变速压缩机的速度。

12. 发明授权

US06775997B2 Cooling of data centers 失效
公开(公告)号：US06775997B2
公开(公告)日：2004-08-17
申请号：US10262879
申请日：2002-10-03
申请人： Cullen E. Bash , Chandrakant D. Patel , Abdlmonem H. Beitelmal , Ratnesh K. Sharma
发明人： Cullen E. Bash , Chandrakant D. Patel , Abdlmonem H. Beitelmal , Ratnesh K. Sharma
IPC分类号： F25D1700
CPC分类号： H05K7/20836 , F25B2600/025 , G05D23/1931
摘要： In a cooling system for cooling racks in a data center, cooling fluid is circulated in the data center by a cooling device having a fan. In addition, this system includes a plenum having a plurality of returns and an outlet. The outlet of the plenum is in fluid communication with the fan and the plurality of returns are configured for removing the cooling fluid from the data center. Furthermore, the returns and are operable to vary a characteristic of the removal of the cooling fluid.

13. 发明授权

US06832490B2 Cooling of data centers 失效
公开(公告)号：US06832490B2
公开(公告)日：2004-12-21
申请号：US10697698
申请日：2003-10-31
申请人： Cullen E. Bash , Chandrakant D. Patel , Abdlmonem H. Beitelmal , Ratnesh K. Sharma
发明人： Cullen E. Bash , Chandrakant D. Patel , Abdlmonem H. Beitelmal , Ratnesh K. Sharma
IPC分类号： F25D1700
CPC分类号： H05K7/20836 , F25B2600/025 , G05D23/1931
摘要： In a cooling system for cooling racks in a data center, cooling fluid is circulated in the data center by a cooling device having a fan. In addition, this system includes a plenum having a plurality of returns and an outlet. The outlet of the plenum is in fluid communication with the fan and the plurality of returns are configured for removing the cooling fluid from the data center. Furthermore, the returns and are operable to vary a characteristic of the removal of the cooling fluid.

14. 发明授权

US06772604B2 Cooling of data centers 失效
公开(公告)号：US06772604B2
公开(公告)日：2004-08-10
申请号：US10697693
申请日：2003-10-31
申请人： Cullen E. Bash , Chandrakant D. Patel , Abdlmonem H. Beitelmal , Ratnesh K. Sharma
发明人： Cullen E. Bash , Chandrakant D. Patel , Abdlmonem H. Beitelmal , Ratnesh K. Sharma
IPC分类号： F25D2312
CPC分类号： H05K7/20836 , F25B2600/025 , G05D23/1931
摘要： In a cooling system for cooling racks in a data center, cooling fluid is circulated in the data center by a cooling device having a fan. In addition, this system includes a plenum having a plurality of returns and an outlet. The outlet of the plenum is in fluid communication with the fan and the plurality of returns are configured for removing the cooling fluid from the data center. Furthermore, the returns and are operable to vary a characteristic of the removal of the cooling fluid.

15. 发明授权

US07072739B2 Data center robotic device 有权
标题翻译：数据中心机器人装置
公开(公告)号：US07072739B2
公开(公告)日：2006-07-04
申请号：US10446867
申请日：2003-05-29
申请人： Cullen E. Bash , Abdlmonem H. Beitelmal , Keith Farkas , Chandrakant D. Patel , Parthasarathy Ranganathan
发明人： Cullen E. Bash , Abdlmonem H. Beitelmal , Keith Farkas , Chandrakant D. Patel , Parthasarathy Ranganathan
IPC分类号： G06F19/00
CPC分类号： G05D1/0246 , G05B2219/40298 , G05D2201/0216
摘要： A method for operating a data center with a robotic device. In the method, a condition is detected in a location of the data center. The robotic device, which includes a camera and a manipulator, is maneuvered to travel to the location of the data center. The location of the data center is imaged with the camera of the robotic device and an object is manipulated with the manipulator of the robotic device.
摘要翻译：一种用机器人装置操作数据中心的方法。在该方法中，在数据中心的位置检测到条件。包括摄像机和操纵器的机器人装置被操纵以行进到数据中心的位置。使用机器人装置的照相机对数据中心的位置进行成像，并且用机器人装置的操纵器操纵物体。

16. 发明授权

US06817204B2 Modular sprayjet cooling system 有权
标题翻译：模块化喷雾冷却系统
公开(公告)号：US06817204B2
公开(公告)日：2004-11-16
申请号：US10684884
申请日：2003-10-14
申请人： Cullen E. Bash , Abdlmonem H. Beitelmal , Chandrakant D. Patel
发明人： Cullen E. Bash , Abdlmonem H. Beitelmal , Chandrakant D. Patel
IPC分类号： F28D500
CPC分类号： G06F1/20 , F25D19/00 , G06F2200/201 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.
摘要翻译：一种模块化半导体芯片冷却系统，其具有容易打开的外壳，其限定了配置成容纳承载待冷却部件的印刷电路板的室。外壳可以包括储存器，冷凝器和泵。室内的喷雾器可调节地安装在一个或多个支架上，以允许每个喷雾器为其各自部件的单独高度设定。外壳可以通过快速释放连接容易地从计算机系统中移除。计算机系统可以包括冷凝器和泵来操作其所有的模块化冷却系统，从各个模块中去除冷凝功能。

17. 发明授权

US07218996B1 Method for thermally managing a room 有权
标题翻译：热管理房间的方法
公开(公告)号：US07218996B1
公开(公告)日：2007-05-15
申请号：US11474765
申请日：2006-06-26
申请人： Abdlmonem H. Beitelmal , Cullen E. Bash , Chandrakant D. Patel
发明人： Abdlmonem H. Beitelmal , Cullen E. Bash , Chandrakant D. Patel
IPC分类号： G06F19/00
CPC分类号： H05K7/20745 , H05K7/20836
摘要： In a method for thermally managing a room with at least one air moving device having a temperature actuator and an airflow rate actuator, a temperature of airflow at a first location in the room is received and compared with a first predetermined temperature range and a second predetermined temperature range. In the method, one of the temperature actuator and the airflow rate actuator is varied when the received temperature of the airflow is outside of the first predetermined temperature range and the other of the temperature actuator and the airflow rate actuator is varied when the received temperature of the airflow is within the first predetermined temperature range and outside of the second predetermined temperature range.
摘要翻译：在具有至少一个具有温度致动器和气流速率致动器的空气移动装置的热管理房间的方法中，接收房间第一位置处的气流温度，并与第一预定温度范围和第二预定温度范围进行比较温度范围。在该方法中，当气流的接收温度超出第一预定温度范围时，温度致动器和气流速率致动器中的一个变化，并且温度致动器和气流速率致动器中的另一个在接收到的温度气流在第一预定温度范围内并且在第二预定温度范围之外。

18. 发明授权

US06644058B2 Modular sprayjet cooling system 有权
公开(公告)号：US06644058B2
公开(公告)日：2003-11-11
申请号：US09945044
申请日：2001-08-31
申请人： Cullen E. Bash , Abdlmonem H. Beitelmal , Chandrakant D. Patel
发明人： Cullen E. Bash , Abdlmonem H. Beitelmal , Chandrakant D. Patel
IPC分类号： F25D1702
CPC分类号： G06F1/20 , F25D19/00 , G06F2200/201 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.

19. 发明授权

US07361081B2 Small form factor air jet cooling system 有权
标题翻译：小型空气喷射冷却系统
公开(公告)号：US07361081B2
公开(公告)日：2008-04-22
申请号：US10898736
申请日：2004-07-23
申请人： Abdlmonem H. Beitelmal , Chandrakant D. Patel , Cullen E. Bash
发明人： Abdlmonem H. Beitelmal , Chandrakant D. Patel , Cullen E. Bash
IPC分类号： H05K5/02
CPC分类号： H05K7/20727
摘要： An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. A cooling system is formed by a plenum pressurized by a blower. The plenum defines a plurality of configurable orifices in the chassis, each directing pressurized air toward a component. The plenum includes adjustable valves to controllably limit airflow through the orifices, and a controller to control the air pressure within the plenum and the orifice flow rates through the valves.
摘要翻译：外壳形成在纵向尺寸上垂直堆叠的多个层。每个层是1U模块化计算机系统，其具有配置成安装在多层支持中的计算机机箱以及需要在计算机机箱内进行冷却的计算机组件。冷却系统由通过鼓风机加压的增压室形成。气室在底盘中限定了多个可配置的孔，每个将加压空气朝向组件。气室包括可调节的阀门，以可控地限制通过孔口的气流，以及控制器来控制气室内的空气压力和通过阀门的孔口流量。

20. 发明授权

US06994158B2 Multi-load thermal regulating system having electronic valve control 失效
公开(公告)号：US06994158B2
公开(公告)日：2006-02-07
申请号：US10684480
申请日：2003-10-15
申请人： Abdlmonem H. Beitelmal , Cullen E. Bash , Chandrakant D. Patel
发明人： Abdlmonem H. Beitelmal , Cullen E. Bash , Chandrakant D. Patel
IPC分类号： F24F3/00
CPC分类号： H01L23/34 , F25B5/04 , F25B49/022 , F25B2600/025 , F25B2700/2117 , G06F1/206 , H01L2924/0002 , H01L2924/00
摘要： System and method for reducing temperature variation among components in a multi-component system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while allowing for multiple fluctuating heat loads between components. A refrigeration system possessing a variable capacity (speed) compressor and an electronic valve is utilized to control the flow of refrigerant through the refrigeration system. The temperature of the components is reduced by metering the mass flow rate of the refrigerant cooling the components to compensate for the heat load applied to the refrigeration system. The temperature variation among the components is reduced by supplemental heaters independently providing heat to respective evaporators of any relatively inactive, and therefore relatively cooler, component with respect to other components, the supplemental heater may add heat to the respective evaporator, such that the temperature of the relatively inactive component is not reduced below the specified temperature range.

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