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11. 发明申请

US20090109688A1 Photoelectronic device 有权
标题翻译：光电器件
公开(公告)号：US20090109688A1
公开(公告)日：2009-04-30
申请号：US12289478
申请日：2008-10-29
申请人： Chia-Liang Hsu , Chien-Fu Huang , Chun-Yi Wu
发明人： Chia-Liang Hsu , Chien-Fu Huang , Chun-Yi Wu
IPC分类号： F21V13/00
CPC分类号： H01L33/54 , H01L33/483 , Y10S362/80
摘要： A photoelectronic device including a carrier, a light-emitting component mounted on the carrier; a patterned structure deposited on the carrier and around the light-emitting component; and a transparent sealing structure formed above the light-emitting component. The patterned structure mentioned above can cause the transparent sealing structure to be focused above the light-emitting component, and restrained in the patterned structure. The transparent sealing structure with predetermined proportional configuration is obtained by controlling the quantity of the transparent sealing structure. Therefore light efficiency of the photoelectronic device can be greatly improved.
摘要翻译：一种光电子器件，包括载体，安装在载体上的发光部件; 沉积在载体上并围绕发光部件的图案结构; 以及形成在发光部件上方的透明密封结构。上述图案化结构可以使透明密封结构聚焦在发光部件的上方，并被限制在图案化结构中。通过控制透明密封结构的数量来获得具有预定比例构型的透明密封结构。因此，可以大大提高光电子器件的光效率。

12. 发明授权

US08207539B2 Light-emitting device having a thinned structure and the manufacturing method thereof 有权
标题翻译：具有薄型结构的发光装置及其制造方法
公开(公告)号：US08207539B2
公开(公告)日：2012-06-26
申请号：US12481048
申请日：2009-06-09
申请人： Min-Hsun Hsieh , Chih-Chiang Lu , Chien-Yuan Wang , Yen-Wen Chen , Jui-Hung Yeh , Shih-Chin Hung , Yu-Wei Tu , Chun-Yi Wu , Wei-Chih Peng
发明人： Min-Hsun Hsieh , Chih-Chiang Lu , Chien-Yuan Wang , Yen-Wen Chen , Jui-Hung Yeh , Shih-Chin Hung , Yu-Wei Tu , Chun-Yi Wu , Wei-Chih Peng
IPC分类号： H01L27/15 , H01L31/12 , H01L33/00
CPC分类号： H01L33/0079 , H01L33/382 , H01L33/387 , H01L33/642
摘要： A semiconductor light-emitting device having a thinned structure comprises a thinned structure formed between a semiconductor light-emitting structure and a carrier. The manufacturing method comprises the steps of forming a semiconductor light-emitting structure above a substrate; attaching the semiconductor light-emitting structure to a support; thinning the substrate to form a thinned structure; forming or attaching a carrier to the thinned substrate; and removing the support.
摘要翻译：具有减薄结构的半导体发光器件包括在半导体发光结构和载体之间形成的薄化结构。该制造方法包括以下步骤：在衬底上形成半导体发光结构; 将半导体发光结构附着到支撑体上; 使衬底变薄以形成薄的结构; 将载体形成或附着到薄化的基底上; 并移除支持。

13. 发明授权

US08486729B2 Light-emitting device having a thinned structure and the manufacturing method thereof 有权
标题翻译：具有薄型结构的发光装置及其制造方法
公开(公告)号：US08486729B2
公开(公告)日：2013-07-16
申请号：US13478698
申请日：2012-05-23
申请人： Min-Hsun Hsieh , Chih-Chiang Lu , Chien-Yuan Wang , Yen-Wen Chen , Jui-Hung Yeh , Shih-Chin Hung , Yu-Wei Tu , Chun-Yi Wu , Wei-Chih Peng
发明人： Min-Hsun Hsieh , Chih-Chiang Lu , Chien-Yuan Wang , Yen-Wen Chen , Jui-Hung Yeh , Shih-Chin Hung , Yu-Wei Tu , Chun-Yi Wu , Wei-Chih Peng
IPC分类号： H01L21/00
CPC分类号： H01L33/0079 , H01L33/382 , H01L33/387 , H01L33/642
摘要： A semiconductor light-emitting device having a thinned structure comprises a thinned structure formed between a semiconductor light-emitting structure and a carrier. The manufacturing method comprises the steps of forming a semiconductor light-emitting structure above a substrate; attaching the semiconductor light-emitting structure to a support; thinning the substrate to form a thinned structure; forming or attaching a carrier to the thinned substrate; and removing the support.
摘要翻译：具有减薄结构的半导体发光器件包括在半导体发光结构和载体之间形成的薄化结构。该制造方法包括以下步骤：在衬底上形成半导体发光结构; 将半导体发光结构附着到支撑体上; 使衬底变薄以形成薄的结构; 将载体形成或附着到薄化的基底上; 并移除支持。

14. 外观设计

USD676001S1 Light emitting diode 有权
公开(公告)号：USD676001S1
公开(公告)日：2013-02-12
申请号：US29389215
申请日：2011-04-07
申请人： Chia-Liang Hsu , Chun-Yi Wu , Shih-I Chen
设计人： Chia-Liang Hsu , Chun-Yi Wu , Shih-I Chen

15. 外观设计

USD680977S1 Light emitting diode 有权
公开(公告)号：USD680977S1
公开(公告)日：2013-04-30
申请号：US29432255
申请日：2012-09-14
申请人： Chia-Liang Hsu , Chun-Yi Wu , Shih-I Chen
设计人： Chia-Liang Hsu , Chun-Yi Wu , Shih-I Chen

16. 外观设计

USD648287S1 Light-emitting diode 有权
公开(公告)号：USD648287S1
公开(公告)日：2011-11-08
申请号：US29388571
申请日：2011-03-30
申请人： Chia-Liang Hsu , Han-Min Wu , Shih-I Chen , Chun-Yi Wu , Mei-Chun Liu
设计人： Chia-Liang Hsu , Han-Min Wu , Shih-I Chen , Chun-Yi Wu , Mei-Chun Liu

17. 发明申请

US20120231560A1 LIGHT-EMITTING DEVICE HAVING A THINNED STRUCTURE AND THE MANUFACTURING METHOD THEREOF 有权
标题翻译：具有薄壁结构的发光装置及其制造方法
公开(公告)号：US20120231560A1
公开(公告)日：2012-09-13
申请号：US13478698
申请日：2012-05-23
申请人： Min-Hsun Hsieh , Chih-Chiang Lu , Chien-Yuan Wang , Yen-Wen Chen , Jui-Hung Yeh , Shih-Chin Hung , Yu-Wei Tu , Chun-Yi Wu , Wei-Chih Peng
发明人： Min-Hsun Hsieh , Chih-Chiang Lu , Chien-Yuan Wang , Yen-Wen Chen , Jui-Hung Yeh , Shih-Chin Hung , Yu-Wei Tu , Chun-Yi Wu , Wei-Chih Peng
IPC分类号： H01L21/66
CPC分类号： H01L33/0079 , H01L33/382 , H01L33/387 , H01L33/642
摘要： A semiconductor light-emitting device having a thinned structure comprises a thinned structure formed between a semiconductor light-emitting structure and a carrier. The manufacturing method comprises the steps of forming a semiconductor light-emitting structure above a substrate; attaching the semiconductor light-emitting structure to a support; thinning the substrate to form a thinned structure; forming or attaching a carrier to the thinned substrate; and removing the support.
摘要翻译：具有减薄结构的半导体发光器件包括在半导体发光结构和载体之间形成的薄化结构。该制造方法包括以下步骤：在衬底上形成半导体发光结构; 将半导体发光结构附着到支撑体上; 使衬底变薄以形成薄的结构; 将载体形成或附着到薄化的基底上; 并移除支持。

18. 外观设计

USD700152S1 Light emitting diode 有权
公开(公告)号：USD700152S1
公开(公告)日：2014-02-25
申请号：US29453274
申请日：2013-04-26
申请人： Chia-Liang Hsu , Chun-Yi Wu , Shih-I Chen
设计人： Chia-Liang Hsu , Chun-Yi Wu , Shih-I Chen

19. 发明申请

US20080231439A1 Activity Detection Circuit for a Storage Device 审中-公开
标题翻译：存储设备的活动检测电路
公开(公告)号：US20080231439A1
公开(公告)日：2008-09-25
申请号：US11689731
申请日：2007-03-22
申请人： Chun-Yi Wu
发明人： Chun-Yi Wu
IPC分类号： G08B21/00
CPC分类号： G06F11/325
摘要： An activity detection circuit for a storage device including a sampling module, a logic module, and an indication module. The sampling module is for detecting a state interface of the storage device by a reference signal. The logic module is for determining a state of the storage device according to a detection result generated by the sampling module. The indication module includes a light emitting device, wherein when the storage device is in a connected state, the light emitting device emits constant light, and when the storage device is in a read/write state, the light emitting device emits flickering light. The present invention also provides a storage module including a storage device, a connection port and the activity detection circuit described above.
摘要翻译：一种用于包括采样模块，逻辑模块和指示模块的存储装置的活动检测电路。采样模块用于通过参考信号检测存储设备的状态接口。逻辑模块用于根据由采样模块生成的检测结果来确定存储设备的状态。指示模块包括发光装置，其中当存储装置处于连接状态时，发光装置发出恒定的光，并且当存储装置处于读/写状态时，发光装置发射闪烁的光。本发明还提供了一种存储模块，包括上述存储装置，连接端口和活动检测电路。

20. 发明申请

US20070069959A1 Small size ultra-wideband antenna 有权
标题翻译：小尺寸超宽带天线
公开(公告)号：US20070069959A1
公开(公告)日：2007-03-29
申请号：US11258805
申请日：2005-10-26
申请人： Chun-Yi Wu
发明人： Chun-Yi Wu
IPC分类号： H01Q1/38
CPC分类号： H01Q9/0442 , H01Q5/50
摘要： A small size ultra-wideband (UWB) antenna comprises a radiation element, a dielectric substrate, and a dielectric element. The radiation element includes a radiation conductor, a matching element, and an antenna feeding element. A signal feeding element and a conductor plane are formed on the upper and lower surfaces of the dielectric substrate, respectively. With the matching element on the radiation conductor, the current distribution on the conductor plane is changed so that the antenna achieves a sufficient extension for both high and low impedance bandwidths. The UWB antenna is also suitable for surface-mountable fabrication process, and which effectively reduce the manufacturing cost. The antenna has the advantages of small size, simple structure, and an impedance bandwidth of 7.97 GHz.
摘要翻译：小尺寸超宽带（UWB）天线包括辐射元件，电介质基底和电介质元件。辐射元件包括辐射导体，匹配元件和天线馈送元件。信号馈送元件和导体平面分别形成在电介质基板的上表面和下表面上。通过辐射导体上的匹配元件，改变导体平面上的电流分布，使天线实现高阻抗和低阻抗带宽的充分扩展。 UWB天线也适用于表面贴装制造工艺，有效降低了制造成本。该天线具有体积小，结构简单，阻抗带宽7.97GHz的优点。

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