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    • 16. 发明授权
    • Display modules
    • 显示模块
    • US08568184B2
    • 2013-10-29
    • US12608928
    • 2009-10-29
    • Christopher D. PrestStephen P. ZadeskyDavid A. Pakula
    • Christopher D. PrestStephen P. ZadeskyDavid A. Pakula
    • H01J9/26
    • H01L51/5237H01L51/5243H01L51/5246
    • An electronic device may have a display. The display may have active components such as display pixels formed on a display substrate layer. The display substrate layer may be formed from a glass substrate layer. Thin-film transistors and other components for the display pixels may be formed on the glass substrate. An encapsulation glass layer may be bonded to the glass substrate using a ring-shaped bond structure. The ring-shaped bond structure may extend around the periphery of the encapsulation glass layer and the substrate glass layer. The bond structure may be formed from a glass frit, a solid glass ring, integral raised glass portions of the glass layers, meltable metal alloys, or other bond materials. Chemical and physical processing operations may be used to temper the glass layers, to perform annealing operations, to preheat the glass layers, and to promote adhesion.
    • 电子设备可以具有显示器。 显示器可以具有诸如形成在显示基板层上的显示像素的有源部件。 显示基板层可以由玻璃基板层形成。 可以在玻璃基板上形成用于显示像素的薄膜晶体管和其它部件。 可以使用环形粘结结构将包封玻璃层结合到玻璃基板。 环形结合结构可以围绕封装玻璃层和基板玻璃层的周边延伸。 粘结结构可以由玻璃料,固体玻璃环,玻璃层的一体凸起玻璃部分,可熔融金属合金或其它粘结材料形成。 可以使用化学和物理加工操作来回火玻璃层,进行退火操作,以预热玻璃层并促进粘附。
    • 17. 发明申请
    • DISPLAY MODULES
    • 显示模块
    • US20110012873A1
    • 2011-01-20
    • US12608928
    • 2009-10-29
    • Christopher D. PrestStephen P. ZadeskyDavid A. Pakula
    • Christopher D. PrestStephen P. ZadeskyDavid A. Pakula
    • G09G5/00B60S1/60H01J9/26H01L21/00
    • H01L51/5237H01L51/5243H01L51/5246
    • An electronic device may have a display. The display may have active components such as display pixels formed on a display substrate layer. The display substrate layer may be formed from a glass substrate layer. Thin-film transistors and other components for the display pixels may be formed on the glass substrate. An encapsulation glass layer may be bonded to the glass substrate using a ring-shaped bond structure. The ring-shaped bond structure may extend around the periphery of the encapsulation glass layer and the substrate glass layer. The bond structure may be formed from a glass frit, a solid glass ring, integral raised glass portions of the glass layers, meltable metal alloys, or other bond materials. Chemical and physical processing operations may be used to temper the glass layers, to perform annealing operations, to preheat the glass layers, and to promote adhesion.
    • 电子设备可以具有显示器。 显示器可以具有诸如形成在显示基板层上的显示像素的有源部件。 显示基板层可以由玻璃基板层形成。 可以在玻璃基板上形成用于显示像素的薄膜晶体管和其它部件。 可以使用环形粘结结构将包封玻璃层结合到玻璃基板。 环形结合结构可以围绕封装玻璃层和基板玻璃层的周边延伸。 粘结结构可以由玻璃料,固体玻璃环,玻璃层的一体凸起玻璃部分,可熔融金属合金或其它粘结材料形成。 可以使用化学和物理加工操作来回火玻璃层,进行退火操作,以预热玻璃层并促进粘附。
    • 18. 发明授权
    • Insert molded cowling structures
    • 插入模制整流罩结构
    • US08927881B2
    • 2015-01-06
    • US13607440
    • 2012-09-07
    • Michael B. WittenbergSawyer I. CohenJared M. KoleShayan MalekDavid A. PakulaAshutosh Y. Shukla
    • Michael B. WittenbergSawyer I. CohenJared M. KoleShayan MalekDavid A. PakulaAshutosh Y. Shukla
    • H05K7/14
    • H01Q1/243
    • Electronic devices may be provided with electronic components and cowling structures that secure the electronic components. A cowling structure may include a metal portion and an insulating portion that has been insert-molded onto the metal portion. The metal portion and the insert-molded insulating portion may each have an opening that receives a screw. The screws may pass through the respective opening and attach to a substrate. The substrate may be a transparent cover layer for a device display. The cowling structure may press the electronic components against the transparent substrate layer. The device may include an antenna. The insert-molded insulating portion may extend from an edge of the metal portion in the direction of the antenna. The insert-molded insulating portion may prevent one of the screws from forming an electrical connection with the metal portion.
    • 电子设备可以设置有固定电子部件的电子部件和整流罩结构。 整流罩结构可以包括已经插入模制到金属部分上的金属部分和绝缘部分。 金属部分和嵌入成型的绝缘部分可以各自具有容纳螺钉的开口。 螺钉可以穿过相应的开口并附着到基底上。 衬底可以是用于器件显示的透明覆盖层。 整流罩结构可以将电子部件压靠在透明基板层上。 该装置可以包括天线。 插入成型的绝缘部分可以沿着天线的方向从金属部分的边缘延伸。 插入成型的绝缘部分可以防止其中一个螺钉与金属部分形成电连接。