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    • 13. 发明申请
    • ENCAPSULATION SYSTEM AND ENCAPSULATION METHOD
    • 封装系统和封装方法
    • US20160300769A1
    • 2016-10-13
    • US14777596
    • 2015-03-17
    • BOE TECHNOLOGY GROUP CO., LTD.BEIJING BOE OPTOELCTRONICS TECHNOLOGY CO., LTD.
    • Jiuxia YANGFeng BAILiang ZHANGXu CHENAng XIAO
    • H01L21/66H01L51/52H01L51/56
    • H01L22/26B23K26/206G01B11/0616G01B21/02H01L22/10H01L22/12H01L27/32H01L51/5246H01L51/5253H01L51/56H01L2251/558
    • The present disclosure discloses an encapsulation system and an encapsulation method, the encapsulation system comprising a thickness detection unit, an output control unit and an energy output unit, the thickness detection unit being connected with the output control unit, and the output control unit being connected with the energy output unit. The thickness detection unit is configured to detect a thickness of an encapsulant at a to-be-heated location in a component to be encapsulated and generate corresponding thickness information. The output control unit is configured to generate corresponding output control information depending on the thickness information. The energy output unit is configured to output, depending on the output control information, to the encapsulant at the to-be-heated location energy for heating the encapsulant. With the technical solution of the present disclosure, the encapsulant can be heated properly based on its actual state such that the encapsulant at the to-be-heated location can all sufficiently melt, which effectively improves the sealing of the product.
    • 本公开公开了一种封装系统和封装方法,所述封装系统包括厚度检测单元,输出控制单元和能量输出单元,所述厚度检测单元与所述输出控制单元连接,并且所述输出控制单元被连接 与能量输出单元。 厚度检测单元被配置为检测要被封装的部件中的被加热位置处的密封剂的厚度,并且生成相应的厚度信息。 输出控制单元被配置为根据厚度信息产生相应的输出控制信息。 能量输出单元被配置为根据输出控制信息将密封剂输送到加热位置处的密封剂用于加热密封剂的能量。 利用本公开的技术方案,可以基于其实际状态适当地加热密封剂,使得待加热位置处的密封剂可以充分熔化,这有效地改善了产品的密封。
    • 20. 发明申请
    • SUBSTRATE FITTING PROCESS AND SUBSTRATE ASSEMBLY TO BE FITTED
    • 基板接合工艺和基板组件装配
    • US20150293386A1
    • 2015-10-15
    • US14488134
    • 2014-09-16
    • BOE TECHNOLOGY GROUP CO., LTD.BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    • Ang XIAOSunghun SONGXu CHEN
    • G02F1/1339G02F1/1333B32B3/02
    • G02F1/1339B32B3/02B32B3/085B32B2307/558B32B2307/714B32B2457/202G02F2001/133354G02F2001/133388
    • The present invention provides a substrate fitting process and a substrate assembly to be fitted, wherein the substrate assembly to be fitted of the present invention, a periphery mold frame is disposed on a surface of a substrate, a cell mold frame is disposed inside said periphery mold frame, the height of said cell mold frame is larger than the height of said periphery mold frame. A substrate fitting process of the present invention comprises: providing a cell mold frame on a surface of a first substrate, providing a cell mold frame inside the periphery mold frame for sealing liquid crystal, the height of said cell mold frame is larger than the height of the periphery mold frame; extracting the air between the first substrate and the second substrate; making the first substrate fit with the second substrate preliminarily; filling the air between the first substrate and the second substrate; making the first substrate further fit with the second substrate. With the technical solution of the present invention, the puncture caused by the impact of the in-cell liquid crystal onto the cell mold frame is prevented, and the time and the costs of the process is decreased, meanwhile the probability of the circuit metal wire and the component switch on the liquid crystal panel suffering corrode of the thinning acid is decreased.
    • 本发明提供了一种基板装配工艺和一种待安装的基板组件,其中本发明的待安装的基板组件,一个周边模架被设置在基板的表面上,一个单元模架被设置在所述周边 模具框架,所述单元模具框架的高度大于所述周边模架的高度。 本发明的基板装配工艺包括:在第一基板的表面上设置电池模架,在周边模架内设置用于密封液晶的电池模架,所述电池模架的高度大于高度 的周边模架; 提取第一基板和第二基板之间的空气; 使第一衬底预先与第二衬底配合; 填充第一基板和第二基板之间的空气; 使得第一衬底进一步与第二衬底配合。 利用本发明的技术方案,可以防止由于单元内液晶冲击到电池模架而造成的穿孔,并且降低了处理的时间和成本,同时电路金属线的概率 并且在薄化酸腐蚀的液晶面板上的部件开关减少。