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11. 发明申请

US20150097203A1 DIE EMITTING WHITE LIGHT 有权
标题翻译： DIE发光白光
公开(公告)号：US20150097203A1
公开(公告)日：2015-04-09
申请号：US14046644
申请日：2013-10-04
申请人： BRIDGELUX, INC.
发明人： Babak Imangholi , Khashayar Phil Oliaei , Scott West
IPC分类号： H01L33/50
CPC分类号： H01L33/502 , H01L33/0095 , H01L33/50 , H01L33/56 , H01L33/62 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
摘要： Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.
摘要翻译：公开了各种方法和装置。一种方法可以包括将至少一个管芯设置在载体衬底上的位置上，在至少一个管芯中的每一个上形成至少一个柱形突起，在至少一个柱形突起和至少一个管芯上形成磷光体层，去除荧光体层的顶部以暴露所述至少一个柱形突起，以及去除位于两个相邻裸片之间的磷光体层的侧部。装置可以包括包括顶部，底部和侧面的模具。荧光体层可以设置在模具的顶部，底部和侧面上。荧光体层可以在模具的顶表面和侧表面上具有基本相等的厚度，以及设置在模具的顶表面上的一个或多个柱形凸块。

12. 发明授权

US10714533B2 Substrate free LED package 有权
公开(公告)号：US10714533B2
公开(公告)日：2020-07-14
申请号：US15453856
申请日：2017-03-08
申请人： BRIDGELUX, INC.
发明人： Mike Kwon , Gerry Keller , Scott West , Tao Tong , Babak Imangholi
IPC分类号： H01L33/00 , H01L27/15 , H01L33/52 , H01L33/58 , H01L23/00 , H01L33/48 , H01L33/60 , H01L33/54 , H01L21/56
摘要： A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.

13. 发明申请

US20190371975A1 DIE EMITTING WHITE LIGHT 审中-公开
公开(公告)号：US20190371975A1
公开(公告)日：2019-12-05
申请号：US16377583
申请日：2019-04-08
申请人： BRIDGELUX, INC.
发明人： Babak Imangholi , Khashayar Phil Oliaei , Scott West
IPC分类号： H01L33/50 , H01L33/00 , H01L33/56 , H01L33/62
摘要： Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.

14. 发明申请

US20170244008A1 SUBSTRATE FREE LED PACKAGE 审中-公开
公开(公告)号：US20170244008A1
公开(公告)日：2017-08-24
申请号：US15453856
申请日：2017-03-08
申请人： BRIDGELUX, INC.
发明人： Mike Kwon , Gerry Keller , Scott West , Tao Tong , Babak Imangholi
IPC分类号： H01L33/48 , H01L33/54 , H01L33/60 , H01L33/00
摘要： A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.

15. 发明申请

US20160255690A1 LED Array Member and Integrated Control Module Assembly with Built-In Switching Converter 有权
公开(公告)号：US20160255690A1
公开(公告)日：2016-09-01
申请号：US15136926
申请日：2016-04-23
申请人： Bridgelux, Inc.
发明人： Michael Neal Gershowitz , Babak Imangholi
IPC分类号： H05B33/08 , F21V29/70 , H01L33/48
CPC分类号： H05B33/0815 , F21K9/20 , F21V23/006 , F21V23/02 , F21V29/70 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/181 , H05B33/0824 , H05B33/0827 , H05B33/083 , H05B33/0842 , H05B33/0845 , H05B33/0884 , H05B33/089 , H05B37/0272 , H05K1/142 , H05K3/0061 , H05K2201/10106 , H01L2924/00014 , H01L2924/00012
摘要： A LAM/ICM assembly comprises an integrated control module (ICM) and an LED array member (LAM). The ICM includes interconnect through which power from outside the assembly is received. In a first novel aspect, active circuitry is embedded in the ICM. In one example, the circuitry monitors LED operation, controls and supplies power to the LEDs, and communicates information into and out of the assembly. In a second novel aspect, a lighting system comprises an AC-to-DC converter and a LAM/ICM assembly. The AC-to-DC converter outputs a substantially constant current or voltage. The magnitude of the current or voltage is adjusted by a signal output from the LAM/ICM. In a third novel aspect, the ICM includes a built-in switching DC-to-DC converter. An AC-to-DC power supply supplies a roughly regulated supply voltage. The switching converter within the LAM/ICM receives the roughly regulated voltage and supplies a regulated LED drive current to its LEDs.

16. 发明申请

US20160254419A1 DIE EMITTING WHITE LIGHT 有权
公开(公告)号：US20160254419A1
公开(公告)日：2016-09-01
申请号：US15151407
申请日：2016-05-10
申请人： BRIDGELUX, INC.
发明人： Babak Imangholi , Khashayar Phil Oliaei , Scott West
IPC分类号： H01L33/50 , H01L33/62 , H01L33/56
CPC分类号： H01L33/502 , H01L33/0095 , H01L33/50 , H01L33/56 , H01L33/62 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
摘要： Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.

17. 发明申请

US20150002023A1 Using An LED Die To Measure Temperature Inside Silicone That Encapsulates An LED Array 有权
公开(公告)号：US20150002023A1
公开(公告)日：2015-01-01
申请号：US13930672
申请日：2013-06-28
申请人： Bridgelux, Inc.
发明人： Babak Imangholi , Michael Neal Gershowitz , R. Scott West
IPC分类号： H05B33/08 , G01K7/00
CPC分类号： G01K7/00 , G01K7/01 , H01L27/156 , H01L33/32 , H01L33/502 , H01L2224/48091 , H01L2224/48137 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H05B33/0851 , H05B37/02 , H01L2924/00014 , H01L2924/00012
摘要： A light-emitting diode (LED) device includes first and second LED dies with the same structure and that are both encapsulated by the same silicone layer. The first LED is supplied with sufficient drive current to illuminate the LED. Control circuitry supplies the second LED with a constant current, determines the voltage across the second LED, and calculates the temperature of the second LED based on the voltage across the second LED. The constant current has a maximum magnitude that never exceeds the maximum magnitude of the drive current. The LED device is able to calculate the temperature of a diode with a gallium-nitride layer (GaN or GaInN) that is receiving a large drive current and emitting blue light by determining the voltage across an adjacent similar diode with a gallium-nitride layer through which a small constant current is flowing. Preferably, the band gap of the LEDs exceeds two electron volts.

18. 发明申请

US20140197430A1 SUBSTRATE FREE LED PACKAGE 有权
标题翻译：基板免费LED封装
公开(公告)号：US20140197430A1
公开(公告)日：2014-07-17
申请号：US14214202
申请日：2014-03-14
申请人： BRIDGELUX, INC.
发明人： Mike Kwon , Gerry Keller , Scott West , Tao Tong , Babak Imangholi
IPC分类号： H01L27/15 , H01L33/58 , H01L33/60 , H01L33/52
CPC分类号： H01L27/156 , H01L21/568 , H01L24/18 , H01L24/19 , H01L24/24 , H01L24/82 , H01L33/0095 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/58 , H01L33/60 , H01L2224/04105 , H01L2224/24137 , H01L2224/96 , H01L2924/12041 , H01L2924/12042 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2924/00
摘要： A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.
摘要翻译：一种制造无衬底发光二极管（LED）的方法，包括将LED管芯布置在带上以形成LED晶片组件，在LED晶片组件的第一侧上的至少一个LED管芯上模制封装结构，去除所述带，在所述LED晶片组件的第二侧上形成电介质层，在所述电介质层上形成过大的接触区域，以形成虚拟LED晶片组件，以及将所述虚拟LED晶片组件分成包括至少一个LED的预定区域。胶带可以是载带或锯条。在将虚拟LED晶片组件分成包括在电耦合的LED管芯之间的预定区域之前，几个LED管芯也可以电耦合。

19. 发明授权

US11637224B2 Die emitting white light 有权
公开(公告)号：US11637224B2
公开(公告)日：2023-04-25
申请号：US17032547
申请日：2020-09-25
申请人： BRIDGELUX, INC.
发明人： Babak Imangholi , Khashayar Phil Oliaei , Scott West
IPC分类号： H01L33/50 , H01L33/00 , H01L33/56 , H01L33/62
摘要： Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.

20. 发明申请

US20180166613A1 DIE EMITTING WHITE LIGHT 审中-公开
公开(公告)号：US20180166613A1
公开(公告)日：2018-06-14
申请号：US15714975
申请日：2017-09-25
申请人： BRIDGELUX, INC.
发明人： Babak Imangholi , Khashayar Phil Oliaei , Scott West
IPC分类号： H01L33/50 , H01L33/56 , H01L33/62 , H01L33/00
CPC分类号： H01L33/502 , H01L33/0095 , H01L33/50 , H01L33/56 , H01L33/62 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
摘要： Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.

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