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    • 11. 发明申请
    • CORNER DOMINATED TRIGATE FIELD EFFECT TRANSISTOR
    • 角陶瓷触发场效应晶体管
    • US20070108537A1
    • 2007-05-17
    • US11164216
    • 2005-11-15
    • Brent AndersonAndres BryantJeffrey JohnsonEdward Nowak
    • Brent AndersonAndres BryantJeffrey JohnsonEdward Nowak
    • H01L21/8244
    • H01L29/785H01L29/42384H01L29/66795
    • Disclosed are embodiments of a trigate field effect transistor that comprises a fin-shaped semiconductor body with a channel region and source/drain regions on either side of the channel region. Thick gate dielectric layers separate the top surface and opposing sidewalls of the channel region from the gate conductor in order to suppress conductivity in the channel planes. A thin gate dielectric layer separates the upper corners of the channel region from the gate conductor in order to optimize conductivity in the channel corners. To further emphasize the current flow in the channel corners, the source/drain regions can be formed in the upper corners of the semiconductor body alone. Alternatively, source/drain extension regions can be formed only in the upper corners of the semiconductor body adjacent to the gate conductor and deep source/drain diffusion regions can be formed in the ends of the semiconductor body.
    • 公开了一种触发场效应晶体管的实施例,其包括具有沟道区的鳍状半导体本体和沟道区两侧的源极/漏极区。 厚栅电介质层将沟道区的顶表面和相对的侧壁与栅极导体分开,以便抑制沟道平面中的导电性。 薄栅极电介质层将沟道区的上角与栅极导体分开,以便优化沟道角中的导电性。 为了进一步强调通道角中的电流流动,源极/漏极区域可以单独形成在半导体主体的上角部。 或者,源极/漏极延伸区域仅可以形成在与栅极导体相邻的半导体本体的上角处,并且可以在半导体本体的端部形成深的源极/漏极扩散区域。
    • 13. 发明申请
    • Double-gate FETs (Field Effect Transistors)
    • 双栅极FET(场效应晶体管)
    • US20060267111A1
    • 2006-11-30
    • US11436480
    • 2006-05-18
    • Brent AndersonAndres BryantEdward Nowak
    • Brent AndersonAndres BryantEdward Nowak
    • H01L29/76H01L21/336
    • H01L29/785H01L29/42384H01L29/66795
    • A semiconductor structure and method for forming the same. The structure includes multiple fin regions disposed between first and second source/drain (S/D) regions. The structure further includes multiple front gates and back gates, each of which is sandwiched between two adjacent fin regions such that the front gates and back gates are alternating (i.e., one front gate then one back gate and then one front gate, and so on). The widths of the front gates are greater than the widths of the back gates. The capacitances of between the front gates and the S/D regions are smaller than the capacitances of between the back gates and the S/D regions. The distances between the front gates and the S/D regions are greater than the distances between the back gates and the S/D regions.
    • 一种半导体结构及其形成方法。 该结构包括设置在第一和第二源极/漏极(S / D)区域之间的多个鳍片区域。 该结构还包括多个前门和后门,每个前门和后门夹在两个相邻鳍片区域之间,使得前门和后门交替(即,一个前门,然后一个后门,然后一个前门,等等 )。 前门的宽度大于后门的宽度。 前门和S / D区之间的电容小于后门和S / D区之间的电容。 前门和S / D区之间的距离大于后门和S / D区之间的距离。
    • 14. 发明申请
    • FINFET WITH LOW GATE CAPACITANCE AND LOW EXTRINSIC RESISTANCE
    • 具有低门电容和低极限电阻的FINFET
    • US20060043616A1
    • 2006-03-02
    • US10711170
    • 2004-08-30
    • Brent AndersonAndres BryantEdward Nowak
    • Brent AndersonAndres BryantEdward Nowak
    • H01L31/109
    • H01L29/785H01L29/42384H01L29/66795Y10S257/90
    • A FinFET device and a method of lowering a gate capacitance and extrinsic resistance in a field effect transistor, wherein the method comprises forming an isolation layer comprising a BOX layer over a substrate, configuring source/drain regions above the isolation layer, forming a fin structure over the isolation layer, configuring a first gate electrode adjacent to the fin structure, disposing a gate insulator between the first gate electrode and the fin structure, positioning a second gate electrode transverse to the first gate electrode, and depositing a third gate electrode on the fin structure, the first gate electrode, and the second gate electrode, wherein the isolation layer is formed beneath the insulator, the first gate electrode, and the fin structure. The method further comprises sandwiching the second gate electrode with a dielectric material. The fin structure is formed by depositing an oxide layer over a silicon layer.
    • FinFET器件和降低场效应晶体管中的栅极电容和非固有电阻的方法,其中所述方法包括在衬底上形成包括BOX层的隔离层,在隔离层上方构成源/漏区,形成鳍结构 在所述隔离层上方配置与所述鳍结构相邻的第一栅电极,在所述第一栅电极和所述鳍结构之间设置栅极绝缘体,将第二栅电极定位成横向于所述第一栅电极,以及将第三栅电极 鳍结构,第一栅电极和第二栅电极,其中隔离层形成在绝缘体下方,第一栅电极和鳍结构之下。 该方法还包括用电介质材料夹住第二栅电极。 翅片结构通过在硅层上沉积氧化物层而形成。