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12. 发明授权

US06675450B1 Method of manufacturing and mounting electronic devices to limit the effects of parasitics 有权
标题翻译：制造和安装电子设备以限制寄生效应的方法
公开(公告)号：US06675450B1
公开(公告)日：2004-01-13
申请号：US09698175
申请日：2000-10-30
申请人： Linus Albert Fetter , Yiu-Huen Wong , Michael George Zierdt
发明人： Linus Albert Fetter , Yiu-Huen Wong , Michael George Zierdt
IPC分类号： H04R1700
CPC分类号： H03H9/172 , G01R31/2824 , H01L24/81 , H01L2224/8121 , H01L2224/81815 , H01L2924/01019 , H01L2924/14 , H03H3/02 , H03H9/02125 , Y10T29/42 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , H01L2924/00
摘要： A method of producing and mounting electronic devices to negate the effects of parasitics on device performance. In one aspect, the substrate surface of the device is coated with a thin, etch-resistant film during fabrication that acts as a barrier to allow removal of substrate material beneath the film, creating a suspended structure upon which the remaining layers of circuitry rest. Alternatively the device is made with a film that is integral to the device, and that acts as the supporting membrane. To mount the device on a carrier or package, solder bumps are applied near the ends of the conductors of the device, and the die is then secured to a carrier or package, and positioned so that leads extending from the conductors mate up with bonding strips on the carrier or package. The solder bumps are then reflowed or melted to establish electrical connection between leads of the device and corresponding bonding strips of the carrier. The resultant electronic device is essentially immune to the effects or parasitic capacitanaces and parasitic inductances, with the device as mounted being further configured so as to tune out any residual parasitics which may still exist after fabrication.
摘要翻译：一种制造和安装电子设备以消除寄生效应对设备性能的方法。在一个方面，在制造期间，器件的衬底表面涂覆有薄的耐蚀刻膜，其用作屏障以允许去除膜下方的衬底材料，产生悬挂结构，剩余的电路层在其上休息。或者，该装置由与装置成一体的膜制成，并且用作支撑膜。为了将器件安装在载体或封装上，在器件的导体的端部附近施加焊料凸块，然后将管芯固定到载体或封装上，并将其定位成使得从导体延伸的引线与接合条配合在载体或包装上。焊料凸块然后被回流或熔化，以在器件的引线和载体的相应接合条之间建立电连接。所得到的电子器件基本上免受影响或寄生电容和寄生电感的影响，安装的器件被进一步配置以便调出在制造之后仍然存在的任何残留寄生效应。

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