会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 20. 发明申请
    • Method of forming an in-situ recessed structure
    • 形成原位凹陷结构的方法
    • US20060063277A1
    • 2006-03-23
    • US10946565
    • 2004-09-21
    • David VidusekSidlgata SreenivasanDavid Wang
    • David VidusekSidlgata SreenivasanDavid Wang
    • B44C1/22H01L21/00
    • B81C1/00626
    • The present invention features a method of patterning a substrate that includes forming from a first material, disposed on the substrate, a first film having an original pattern that includes a plurality of projections. The projections extend from a nadir surface terminating in an apex surface defining a height therebetween. A portion of the first film in superimposition with the nadir surface defines a nadir portion. The nadir portion is removed to expose a region of the substrate in superimposition therewith, defining a plurality of recessions. A second material is disposed upon the first film to form a second film having a surface spaced-apart from the apex surface of the plurality of projections and filling the plurality of recessions to form a multi-film stack. The first film and portions of the second film are removed to create a plurality of spaced-apart projections of the second material on the substrate.
    • 本发明的特征在于一种图案化衬底的方法,其包括由设置在衬底上的第一材料形成具有包括多个突起的原始图案的第一膜。 突起从最终的表面延伸,终止于限定其间的高度的顶点表面。 第一膜中与最低点表面重叠的部分限定最低点部分。 去除最低点部分以暴露衬底的区域,从而限定多个凹陷。 第二材料设置在第一膜上以形成具有与多个突起的顶点表面间隔开的表面并填充多个凹陷以形成多层叠层的第二膜。 去除第一膜和第二膜的部分以在基板上产生多个间隔开的第二材料的突出部分。