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11. 发明授权

US08490265B2 Method and apparatus for manufacturing brake, and method and apparatus for inspecting brake 有权
标题翻译：制动器的制造方法和装置以及用于检查制动器的方法和装置
公开(公告)号：US08490265B2
公开(公告)日：2013-07-23
申请号：US12484448
申请日：2009-06-15
申请人： Yukio Hashimoto , Masayoshi Kojima , Katsunori Kinno , Mitsuru Sato
发明人： Yukio Hashimoto , Masayoshi Kojima , Katsunori Kinno , Mitsuru Sato
IPC分类号： B23Q17/00
CPC分类号： B23P19/084 , F16D65/0043 , F16D65/18 , F16D2121/02 , Y10T29/49771 , Y10T29/49776 , Y10T29/49863 , Y10T29/4987 , Y10T29/53657
摘要： A brake includes an annular boot which can be expanded and contracted according to movements of a piston and is assembled to an opening part of a cylinder and to an annular groove on an outer peripheral face of the piston. The boot is assembled by: engaging one end of the boot with the opening part of the cylinder in a state where the piston is contained in the cylinder; moving the piston so that at least a part of the piston is withdrawn from the cylinder and that the other end of the boot is pressed by a pressing face of the piston; and fitting the other end of the boot into the annular groove of the piston, while a movable range of the other end of the boot is restricted by an expanding allowance of the boot whose one end is engaged with the opening part of the cylinder.
摘要翻译：制动器包括可根据活塞的运动而膨胀和收缩的环形护罩，并组装到气缸的开口部分和活塞的外周面上的环形槽。靴子通过以下方式组装：在活塞被容纳在气缸中的状态下，将靴子的一端与气缸的开口部分接合; 移动所述活塞使得所述活塞的至少一部分从所述气缸中退出，并且所述护罩的另一端被所述活塞的按压面按压; 并且将靴子的另一端装配到活塞的环形槽中，同时，靴的另一端的可移动范围通过一端与缸的开口部接合的靴的扩张容限来限制。

12. 发明授权

US08321827B2 Power supply design 失效
标题翻译：电源设计
公开(公告)号：US08321827B2
公开(公告)日：2012-11-27
申请号：US12693439
申请日：2010-01-25
申请人： Mitsuru Sato
发明人： Mitsuru Sato
IPC分类号： G06F17/50
CPC分类号： G06F17/50 , G06F2217/78
摘要： In one embodiment, there is provided a method for a computer aiding a design of a power supply that includes extracting data of one of a plurality of power supplies of an apparatus from product data about the apparatus, extracting data of a power supply system from power supply system data, the one of the plurality power supplies system is not allocated to any of the plurality of power supplies of the apparatus and associating the extracted data of the power supply with the extracted data of the power supply system in power supply allocation result data.
摘要翻译：在一个实施例中，提供了一种用于计算机辅助电源设计的方法，该方法包括从关于该设备的产品数据提取设备的多个电源中的一个电源的数据，从电力提取电源系统的数据供电系统数据，多个电力供应系统中的一个不分配给设备的多个电源中的任一个，并且将提取的电源数据与电源系统的提取数据在电源分配结果数据中相关联。

13. 发明授权

US08171439B2 Warning device and warning method 有权
标题翻译：警告装置和警告方法
公开(公告)号：US08171439B2
公开(公告)日：2012-05-01
申请号：US12396722
申请日：2009-03-03
申请人： Mitsuru Sato
发明人： Mitsuru Sato
IPC分类号： G06F9/455 , G06F17/50
CPC分类号： G06F17/5081
摘要： A warning device checks for errors in design object data and issues a warning for detected errors by storing allowance information, which allows issuance of warning prevention, cancel information, which cancels relevant allowance information to permit issuance of warning for each error identification, and instruction identification, which identifies an edit command for editing generated design object data for error identification. When said edit command is accepted, the error identification for the instruction identification of edit command is acquired. Cancel information can be registered for error identification. Respective errors corresponding to error identifications are checked, when an operation for checking the design object data is accepted, and when a type of an error is identified, whether to issue a warning based on the allowance information and cancel information for relevant error identification is determined.
摘要翻译：警告装置检查设计对象数据中的错误，并通过存储允许信息发出警告，发出警告预防，取消信息，取消相关津贴信息，以便发出每个错误标识的警告，并指示识别，其标识用于编辑用于错误识别的生成的设计对象数据的编辑命令。当接受编辑命令时，获取编辑命令的指令识别的错误识别。可以注册取消信息进行错误识别。检查对应于错误识别的各个错误，当接受用于检查设计对象数据的操作时，并且当识别出类型的错误时，确定是否基于允许信息发出警告和相关错误识别的取消信息。

14. 发明授权

US08034175B2 Apparatus and method for manufacturing semiconductor device, and electronic apparatus 有权
标题翻译：半导体装置的制造方法及电子设备
公开(公告)号：US08034175B2
公开(公告)日：2011-10-11
申请号：US11389079
申请日：2006-03-27
申请人： Sumio Utsunomiya , Mitsuru Sato
发明人： Sumio Utsunomiya , Mitsuru Sato
IPC分类号： C23C16/00
CPC分类号： H01L21/02667 , F27B17/0025 , H01L21/2022 , H01L21/67103 , H01L27/1214 , H01L29/66757
摘要： A method for manufacturing a semiconductor device, comprises providing a semiconductor layer deposited on a substrate with heat treatment by using a flame of a gas burner fueled by a hydrogen-and-oxygen mixed gas as a heat source.
摘要翻译：一种制造半导体器件的方法，包括通过使用由氢氧混合气体燃烧的气体燃烧器的火焰作为热源，将沉积在基板上的半导体层提供热处理。

15. 发明授权

US07995374B2 Semiconductor memory device, method of manufacturing the same, and method of screening the same 有权
标题翻译：半导体存储器件及其制造方法及其筛选方法
公开(公告)号：US07995374B2
公开(公告)日：2011-08-09
申请号：US12618122
申请日：2009-11-13
申请人： Masanori Komura , Mitsuru Sato , Kenichi Murooka , Motoya Kishida
发明人： Masanori Komura , Mitsuru Sato , Kenichi Murooka , Motoya Kishida
IPC分类号： G11C11/00 , G11C11/36 , G11C17/00 , G11C29/00
CPC分类号： G11C13/0007 , G11C13/0004 , G11C13/004 , G11C2213/31 , G11C2213/71 , G11C2213/72 , H01L27/2409 , H01L27/2463 , H01L27/2481 , H01L45/085 , H01L45/1233 , H01L45/146 , H01L45/147 , H01L45/1616 , H01L45/1625 , H01L45/1675
摘要： A memory cell comprises a variable resistance film; a first conductive film having one surface contacted with one surface of the variable resistance film; and a second conductive film having one surface contacted with another surface of the variable resistance film. A width of the first conductive film or the second conductive film in a direction orthogonal to a direction that a current flows in the first conductive film or the second conductive film is smaller than a width of the variable resistance film in a direction orthogonal to a direction that a current flows in the variable resistance film. The width of the first conductive film and the second conductive film is smaller than a width of the first line and the second line in a direction orthogonal to a direction that a current flows in the first line and the second line.
摘要翻译：存储单元包括可变电阻膜; 具有与所述可变电阻膜的一个表面接触的一个表面的第一导电膜; 以及具有与可变电阻膜的另一表面接触的一个表面的第二导电膜。第一导电膜或第二导电膜在与第一导电膜或第二导电膜中的电流方向正交的方向上的宽度小于在与方向正交的方向上的可变电阻膜的宽度电流在可变电阻膜中流动。第一导电膜和第二导电膜的宽度小于与第一线和第二线中的电流方向正交的方向上的第一线和第二线的宽度。

16. 发明授权

US07963435B2 Method of forming bonded body and bonded body 有权
标题翻译：形成粘结体和粘结体的方法
公开(公告)号：US07963435B2
公开(公告)日：2011-06-21
申请号：US12358689
申请日：2009-01-23
申请人： Mitsuru Sato , Takatoshi Yamamoto
发明人： Mitsuru Sato , Takatoshi Yamamoto
IPC分类号： B23K31/02
CPC分类号： B32B37/00 , B23K20/02 , B23K2101/40 , B32B7/04 , B32B7/12 , B32B15/043 , B32B15/08 , B32B27/08 , B32B27/283 , B32B38/0008 , B32B2038/0092 , B32B2255/06 , B32B2255/10 , B32B2255/205 , B32B2255/28 , B32B2307/202 , B32B2307/302 , B32B2307/308 , B32B2307/54 , B32B2310/14 , B32B2457/00 , B32B2457/18 , B32B2457/202 , B32B2457/206 , C23C16/18 , C23C16/30 , Y10T428/265
摘要： A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding film are constituted of copper and an organic component, and an amount of copper contained in each of the first bonding film and the second bonding film is 90 atom % or higher but lower than 99 atom % at an atomic ratio. The method is comprised of: forming the first bonding film on the first base member by using a chemical vapor-film formation method; forming the second bonding film on the second base member by using a chemical vapor-film formation method; bringing the first bonding film formed on the first base member into contact with the second bonding film formed on the second base member so that the first bonding film faces the second bonding film; and applying a compressive force to the first base member and the second base member so that the first bonding film and the second bonding film are bonded together to thereby obtain the bonded body. Two base members can be firmly and efficiently bonded together with high dimensional accuracy at a low temperature, and the two base members can be efficiently separated (peeled off) to each other after use of the bonded body. Further, a bonded body is also provided.
摘要翻译：提供一种形成由第一基底构件，第二基底构件和第一接合膜构成的接合体的方法和设置在第一基底构件和第二基底构件之间的第二接合薄膜。第一接合膜和第二接合膜由铜和有机成分构成，并且在第一接合膜和第二接合膜中的每一个中的铜量为90原子％以上且低于99原子％原子比。该方法包括：通过使用化学气相成膜法在第一基底构件上形成第一接合膜; 通过使用化学气相成膜法在第二基底构件上形成第二接合膜; 使形成在第一基底构件上的第一接合膜与形成在第二基底构件上的第二接合膜接触，使得第一接合膜面向第二接合膜; 并且向第一基底构件和第二基底构件施加压缩力，使得第一接合膜和第二接合膜接合在一起，从而获得接合体。两个基底构件可以在低温下以高尺寸精度牢固有效地粘合在一起，并且在使用粘合体之后可以将两个基底构件彼此有效地分离（剥离）。此外，还提供了粘合体。

17. 发明申请

US20100201735A1 BONDING METHOD OF SILICON BASE MEMBERS, DROPLET EJECTION HEAD, DROPLET EJECTION APPARATUS, AND ELECTRONIC DEVICE 审中-公开
标题翻译：硅基部件的结合方法，喷射喷头，喷射喷射装置和电子装置
公开(公告)号：US20100201735A1
公开(公告)日：2010-08-12
申请号：US12665284
申请日：2008-06-16
申请人： Mitsuru Sato , Yoshiaki Mori
发明人： Mitsuru Sato , Yoshiaki Mori
IPC分类号： B41J2/015 , H01L21/30
CPC分类号： B41J2/1634 , B41J2/161 , B41J2/1623 , B81C3/001 , B81C2203/036 , H01L21/187 , H01L21/2007 , H01L2224/48091 , H01L2224/48227 , H01L2924/1461 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A bonding method of silicon base members is provided. The bonding method of silicon base members comprises: applying an energy to a surface of a first silicon base member having Si—H bonds on the surface to selectively cut the Si—H bonds so that dangling bonds of the silicon (Si) is exposed on the surface of the first silicon base member; and bonding the surface of the first silicon base member, on which the dangling bonds of the silicon has been exposed, and a surface of a second silicon base member on which dangling bonds of silicon are exposed so that the surface of the first silicon base member and the surface of the second silicon base member are bonded together through their dangling bonds.
摘要翻译：提供硅基部件的接合方法。硅基部件的接合方法包括：向表面上具有Si-H键的第一硅基部件的表面施加能量以选择性地切割Si-H键，使得硅（Si）的悬挂键暴露在第一硅基部件的表面; 并且将暴露了硅的悬挂键的第一硅基部件的表面与硅的悬垂键露出的第二硅基部件的表面接合，使得第一硅基部件的表面并且第二硅基材的表面通过它们的悬挂键结合在一起。

18. 发明申请

US20100183885A1 BONDING METHOD OF SILICON BASE MEMBERS, DROPLET EJECTION HEAD, DROPLET EJECTION APPARATUS, AND ELECTRONIC DEVICE 审中-公开
标题翻译：硅基部件的结合方法，喷射喷头，喷射喷射装置和电子装置
公开(公告)号：US20100183885A1
公开(公告)日：2010-07-22
申请号：US12665028
申请日：2008-06-16
申请人： Mitsuru Sato , Yoshiaki Mori
发明人： Mitsuru Sato , Yoshiaki Mori
IPC分类号： B32B37/02 , B32B38/00 , B05B1/00 , B32B9/04
CPC分类号： C09J5/02 , B23K26/0624 , B23K26/244 , B23K26/26 , B23K2101/42 , B23K2103/56 , B41J2/161 , B41J2/1623 , B41J2/1626 , B41J2/1634 , B81B2201/052 , B81C3/001 , B81C2203/036 , C09J2400/146 , H01L21/187 , H01L25/50 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2225/0651 , H01L2924/10253 , H01L2924/1461 , H01L2924/15311 , H01L2924/181 , Y10T156/10 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A bonding method of silicon base members is provided. The bonding method of silicon base members comprises: applying an energy to a first silicon base member including Si—H bonds to selectively cut the Si—H bonds so that the first silicon base member is cleaved and divided to one silicon base member and the other silicon base member, and the one silicon base member having a cleavage surface and dangling bonds of silicon obtained by cutting the Si—H bonds; and bonding the cleavage surface of the one silicon base member and a surface of a second silicon base member on which dangling bonds of silicon are exposed to thereby bond the cleavage surface and the surface together through their dangling bonds.
摘要翻译：提供硅基部件的接合方法。硅基部件的接合方法包括：向包括Si-H键的第一硅基部件施加能量以选择性地切割Si-H键，使得第一硅基部件被切割并分成一个硅基部件，而另一个硅基部件硅基部件和具有通过切割Si-H键获得的硅的断裂面和悬挂键的一个硅基部件; 并且将一个硅基部件的解理面和硅的悬挂键露出的第二硅基部件的表面接合，从而通过其悬挂键将解理面和表面结合在一起。

19. 发明申请

US20100028622A1 NONTHERMAL TRANSFER SHEET AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：非转移片及其制造方法
公开(公告)号：US20100028622A1
公开(公告)日：2010-02-04
申请号：US12442532
申请日：2007-08-27
申请人： Mitsuru Sato
发明人： Mitsuru Sato
IPC分类号： B44C1/17 , B32B38/14 , B65C9/25 , B32B37/00
CPC分类号： B44C1/1733 , Y10T156/10 , Y10T428/24802
摘要： A nonthermal transfer sheet (11) usable for transfer to various types of objects including daily personal items such as clothing and the like and also human skin. In order to allow transfer to be realized without heating or pressurization, a transfer layer (33), which is or is not provided with a multi-color design layer (32) and is to be a main part of the nonthermal transfer sheet, and an adhesive layer (34) for pasting the transfer layer (33) to a transfer subject (51) are integrated together in advance by heating and pressurization. The transfer layer (33) is formed of a thermoplastic resin containing polyurethane as a main component, and therefore is highly flexible, extendable and transferrable even to human body. The adhesive layer (34) is formed of an adhesive containing an acrylic adhesive, and therefore is not reduced in the adhesive force and can be re-transferred (re-pasted). As a result, a wide range of transfer effects including decoration is provided. In addition, the nonthermal transfer sheet is easily removable and so is easily usable.
摘要翻译：可用于转移到各种物品（包括日常个人物品如衣服等）以及人类皮肤的非热转印片材（11）。为了在没有加热或加压的情况下实现转印，设置或不设置多色设计层（32）并且将成为非热转印片材的主要部分的转印层（33），以及用于将转印层（33）粘贴到转印体（51）上的粘合剂层（34）通过加热和加压预先结合在一起。转印层（33）由含有聚氨酯作为主要成分的热塑性树脂形成，因此即使对人体也具有高度柔性，可延展性和可转印性。粘合剂层（34）由含有丙烯酸粘合剂的粘合剂形成，因此不会降低粘合力并且可以再次转移（重新粘贴）。结果，提供了广泛的转移效果，包括装饰。此外，非热转印片易于拆除，因此易于使用。

20. 发明申请

US20090078976A1 SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THEREOF AS WELL AS DRIVING METHOD OF SOLID-STATE IMAGING DEVICE 有权
标题翻译：固态成像装置及其制造方法以及固态成像装置的驱动方法
公开(公告)号：US20090078976A1
公开(公告)日：2009-03-26
申请号：US12277958
申请日：2008-11-25
申请人： Yoshiaki Kitano , Hideshi Abe , Jun Kuroiwa , Kiyoshi Hirata , Hiroaki Ohki , Nobuhiro Karasawa , Ritsuo Takizawa , Mitsuru Yamashita , Mitsuru Sato , Katsunori Kokubun
发明人： Yoshiaki Kitano , Hideshi Abe , Jun Kuroiwa , Kiyoshi Hirata , Hiroaki Ohki , Nobuhiro Karasawa , Ritsuo Takizawa , Mitsuru Yamashita , Mitsuru Sato , Katsunori Kokubun
IPC分类号： H01L27/146
CPC分类号： H01L27/14601 , H01L27/14689 , H01L27/14806 , H04N5/335
摘要： A solid-state imaging device with a structure such that an electrode for reading a signal charge is provided on one side of a light-receiving sensor portion constituting a pixel; a predetermined voltage signal V is applied to a light-shielding film formed to cover an image pickup area except the light-receiving sensor portion; a second-conductivity-type semiconductor area is formed in the center on the surface of a first-conductivity-type semiconductor area constituting a photo-electric conversion area of the light-receiving sensor portion; and areas containing a lower impurity concentration than that of the second-conductivity-type semiconductor area is formed on the surface of the first-conductivity-type semiconductor area at the end on the side of the electrode and at the opposite end on the side of a pixel-separation area.
摘要翻译：具有这样一种结构的固态成像装置，该结构使得用于读取信号电荷的电极设置在构成像素的光接收传感器部分的一侧; 将预定的电压信号V施加到形成为覆盖除了光接收传感器部分之外的图像拾取区域的遮光膜; 第二导电型半导体区域形成在构成光接收传感器部分的光电转换区域的第一导电型半导体区域的表面上的中心; 并且在第一导电型半导体区域的电极侧的端部的表面上形成比第二导电型半导体区域的杂质浓度低的区域，像素分离区域。

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