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11. 发明授权

US08252419B2 Adhesive for bonding circuit members, circuit board and process for its production 有权
公开(公告)号：US08252419B2
公开(公告)日：2012-08-28
申请号：US13166577
申请日：2011-06-22
申请人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： B32B27/38
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

12. 发明申请

US20090314533A1 ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION 审中-公开
标题翻译：联系电路会员，电路板及其生产工艺
公开(公告)号：US20090314533A1
公开(公告)日：2009-12-24
申请号：US12549909
申请日：2009-08-28
申请人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： B32B27/38 , H05K13/04 , B32B37/00 , B32B7/02 , C08L67/00 , H05K1/02
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.
摘要翻译：一种用于将半导体芯片接合并固定到电路板并电连接两个电极的粘合剂，并且包含粘合剂树脂组合物和无机填料，其含量为10至200重量份，100重量份的100重量份粘合剂树脂组合物。

13. 发明申请

US20100003771A1 PRODUCTION METHOD OF SEMICONDUCTOR DEVICE AND BONDING FILM 有权
标题翻译：半导体器件和粘结膜的生产方法
公开(公告)号：US20100003771A1
公开(公告)日：2010-01-07
申请号：US12306285
申请日：2007-06-20
申请人： Akira Nagai , Masaaki Yasuda , Keiichi Hatakeyama , Tetsuya Enomoto
发明人： Akira Nagai , Masaaki Yasuda , Keiichi Hatakeyama , Tetsuya Enomoto
IPC分类号： H01L21/60 , H01L21/301 , H01L21/683 , C08L63/00
CPC分类号： H01L21/6835 , H01L21/67092 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/90 , H01L2221/6834 , H01L2223/54426 , H01L2223/54473 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13144 , H01L2224/16225 , H01L2224/274 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81121 , H01L2224/81191 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/83191 , H01L2224/838 , H01L2224/83851 , H01L2224/83885 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01052 , H01L2924/01058 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07811 , H01L2924/15788 , H01L2924/00 , H01L2924/3512 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered product 60 in which a dicing tape 9, an adhesive layer 3, and a semiconductor wafer 6 are stacked in this order so that a circuit surface 6a of the semiconductor wafer 6 may face the dicing tape 9 side. A cutting position is recognized by recognizing a circuit pattern P in the circuit surface 6a from a rear surface 6b of the semiconductor wafer 6. At least the semiconductor wafer 6 and the adhesive layer 3 are cut in the thickness direction of the layered product 60. The dicing tape 9 is cured to peel off the dicing tape 9 and the adhesive layer 3. A projection electrode 4 of a semiconductor chip 26 is aligned with a wiring 12 of a wiring substrate 40. The wiring substrate 40 and the semiconductor chip 26 are bonded via an adhesive layer 23 so that the wiring 12 and the projection electrode 4 may be electrically connected to each other.
摘要翻译：为了提供一种制造半导体器件的方法，该方法能够有效地获得附着有粘合剂的单片半导体芯片，并且还能够将半导体芯片优良地接合到布线基板，并且提供粘合膜。依次层叠有切割带9，粘合层3和半导体晶片6的层叠体60，使半导体晶片6的电路面6a面向切割带9侧。通过从半导体晶片6的后表面6b识别电路表面6a中的电路图案P来识别切割位置。至少半导体晶片6和粘合剂层3在层叠体60的厚度方向上被切割。将切割胶带9固化以剥离切割胶带9和粘合剂层3.半导体芯片26的投影电极4与布线基板40的布线12对准。布线基板40和半导体芯片26是通过粘合剂层23粘合，使得布线12和突起电极4可以彼此电连接。

14. 发明授权

US07692296B2 Semiconductor device and multilayer substrate therefor 失效
标题翻译：半导体装置及其多层基板
公开(公告)号：US07692296B2
公开(公告)日：2010-04-06
申请号：US11085520
申请日：2005-03-22
申请人： Naotaka Tanaka , Kenya Kawano , Akira Nagai , Koji Tasaki , Masaaki Yasuda
发明人： Naotaka Tanaka , Kenya Kawano , Akira Nagai , Koji Tasaki , Masaaki Yasuda
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/83 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/90 , H01L25/0657 , H01L25/50 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/274 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/83191 , H01L2224/83192 , H01L2224/838 , H01L2224/85203 , H01L2224/85205 , H01L2225/06513 , H01L2225/06517 , H01L2225/06558 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/45099
摘要： A semiconductor device is provided with connection reliability between a bump electrode and a substrate electrode. An elastic modulus of an adhesive material used to electrically connect a metal bump and an interconnect pattern, and sealing the circuit surface of an LSI chip, after thermosetting is Ea; an elastic modulus of an insulating material of a packaging substrate surface layer after thermosetting is Eb; an elastic modulus of a core material, if used, is Ec, and the following rational expression is satisfied at normal temperature or a thermal contact bonding temperature of the adhesive material: at least Ea
摘要翻译：半导体器件在凸起电极和衬底电极之间具有连接可靠性。用于电连接金属凸块和互连图案的粘合材料的弹性模量，并且在热固化之后密封LSI芯片的电路表面是Ea; 热固化后的封装基材表面层的绝缘材料的弹性模量为Eb; 如果使用的话，芯材的弹性模量为Ec，在粘接材料的常温或热接触粘合温度下满足以下有理表达式：至少Ea

15. 发明授权

US08034659B2 Production method of semiconductor device and bonding film 有权
标题翻译：半导体器件和接合膜的制造方法
公开(公告)号：US08034659B2
公开(公告)日：2011-10-11
申请号：US12306285
申请日：2007-06-20
申请人： Akira Nagai , Masaaki Yasuda , Keiichi Hatakeyama , Tetsuya Enomoto
发明人： Akira Nagai , Masaaki Yasuda , Keiichi Hatakeyama , Tetsuya Enomoto
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , H01L21/67092 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/90 , H01L2221/6834 , H01L2223/54426 , H01L2223/54473 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13144 , H01L2224/16225 , H01L2224/274 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81121 , H01L2224/81191 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/83191 , H01L2224/838 , H01L2224/83851 , H01L2224/83885 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01052 , H01L2924/01058 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07811 , H01L2924/15788 , H01L2924/00 , H01L2924/3512 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered product 60 in which a dicing tape 9, an adhesive layer 3, and a semiconductor wafer 6 are stacked in this order so that a circuit surface 6a of the semiconductor wafer 6 may face the dicing tape 9 side. A cutting position is recognized by recognizing a circuit pattern P in the circuit surface 6a from a rear surface 6b of the semiconductor wafer 6. At least the semiconductor wafer 6 and the adhesive layer 3 are cut in the thickness direction of the layered product 60. The dicing tape 9 is cured to peel off the dicing tape 9 and the adhesive layer 3. A projection electrode 4 of a semiconductor chip 26 is aligned with a wiring 12 of a wiring substrate 40. The wiring substrate 40 and the semiconductor chip 26 are bonded via an adhesive layer 23 so that the wiring 12 and the projection electrode 4 may be electrically connected to each other.
摘要翻译：为了提供一种制造半导体器件的方法，该方法能够有效地获得附着有粘合剂的单片半导体芯片，并且还能够将半导体芯片优良地接合到布线基板，并且提供粘合膜。依次层叠有切割带9，粘合层3和半导体晶片6的层叠体60，使半导体晶片6的电路面6a面向切割带9侧。通过从半导体晶片6的后表面6b识别电路表面6a中的电路图案P来识别切割位置。至少半导体晶片6和粘合剂层3在层叠体60的厚度方向上被切割。将切割胶带9固化以剥离切割胶带9和粘合剂层3.半导体芯片26的投影电极4与布线基板40的布线12对准。布线基板40和半导体芯片26是通过粘合剂层23粘合，使得布线12和突起电极4可以彼此电连接。

16. 发明申请

US20050230826A1 Semiconductor device and multilayer substrate therefor 失效
标题翻译：半导体装置及其多层基板
公开(公告)号：US20050230826A1
公开(公告)日：2005-10-20
申请号：US11085520
申请日：2005-03-22
申请人： Naotaka Tanaka , Kenya Kawano , Akira Nagai , Koji Tasaki , Masaaki Yasuda
发明人： Naotaka Tanaka , Kenya Kawano , Akira Nagai , Koji Tasaki , Masaaki Yasuda
IPC分类号： H01L23/29 , H01L21/00 , H01L21/58 , H01L21/60 , H01L21/607 , H01L21/98 , H01L23/12 , H01L23/31 , H01L25/065 , H01L29/40
CPC分类号： H01L24/83 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/90 , H01L25/0657 , H01L25/50 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/274 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/83191 , H01L2224/83192 , H01L2224/838 , H01L2224/85203 , H01L2224/85205 , H01L2225/06513 , H01L2225/06517 , H01L2225/06558 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/45099
摘要： An object of the present invention is to manufacture a semiconductor device improved in the connection reliability between a bump electrode and a substrate electrode. Supposing that an elastic modulus of an adhesive material, which is used for the purpose of electrically connecting a metal bump and an interconnect pattern and sealing the circuit surface of LSI of an LSI chip, after thermosetting is Ea; an elastic modulus of an insulating material constituting the surface layer of a packaging substrate after thermosetting is Eb; and an elastic modulus of a core material, if the substrate is a multilayer substrate having a core layer, is Ec, the material system of the present invention satisfies the following rational expression at normal temperature or a thermal contact bonding temperature of the adhesive material: at least Ea
摘要翻译：本发明的目的是制造改善凸起电极和衬底电极之间的连接可靠性的半导体器件。假设用于电连接金属凸块和互连图案并且密封LSI芯片的LSI的电路表面在热固化之后的粘合材料的弹性模量为Ea; 构成热固化后的封装基板的表层的绝缘材料的弹性模量为Eb; 以及芯材的弹性模量，如果基板是具有芯层的多层基板，则为Ec，本发明的材料体系在常温或粘接材料的热接触接合温度下满足以下有理表达式：至少Ea

17. 发明授权

US08578592B2 Method of manufacturing laminated rotor core 有权
标题翻译：层叠转子铁心的制造方法
公开(公告)号：US08578592B2
公开(公告)日：2013-11-12
申请号：US13509190
申请日：2011-04-01
申请人： Akira Nagai , Mei Arazoe , Go Kato
发明人： Akira Nagai , Mei Arazoe , Go Kato
IPC分类号： H02K15/03 , H02K1/27
CPC分类号： H02K15/03 , H02K1/276
摘要： A method of manufacturing a laminated rotor core, includes a first process of placing segment dummy plates between an iron core and a die, each of each segment dummy plates covering one or more of plural magnet insertion portions and including a resin injection hole communicating to the one or more of the magnet insertion portions; a second process of injecting a resin from resin reservoir parts formed in any one of an upper die and a lower die holding the iron core through the resin injection hole of each segment dummy plate to the corresponding one or more of the magnet insertion portions; and a third process of detaching the segment dummy plates together with excess resin after the resin injected to the one or more of the magnet insertion portions is cured.
摘要翻译：一种叠层转子铁芯的制造方法，其特征在于，包括：在铁芯和模具之间配置分段虚拟板的第一工序，各个虚拟板各自覆盖多个磁体插入部的一个或多个，一个或多个磁体插入部分; 将形成在保持铁芯的上模和下模中的任一个中的树脂储存部分注入树脂的第二过程通过每个段虚拟板的树脂注入孔到相应的一个或多个磁体插入部分; 以及在注入到所述一个或多个所述磁体插入部分中的树脂被固化之后，将多个模板与多余的树脂一起分离的第三过程。

18. 发明授权

US08044524B2 Adhesive for connection of circuit member and semiconductor device using the same 失效
标题翻译：用于连接电路元件和使用其的半导体器件的粘合剂
公开(公告)号：US08044524B2
公开(公告)日：2011-10-25
申请号：US12500114
申请日：2009-07-09
申请人： Akira Nagai
发明人： Akira Nagai
IPC分类号： H01L29/40 , H01L23/29
CPC分类号： C09J11/04 , C08K3/08 , C08K3/22 , C08L2666/28 , C09J163/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/90 , H01L2224/05111 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0558 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13144 , H01L2224/16238 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29369 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81903 , H01L2224/83101 , H01L2224/83191 , H01L2224/83851 , H01L2224/90 , H01L2224/9211 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H01L2924/00011 , H01L2224/16225 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/0665 , H01L2224/81 , H01L2224/83
摘要： An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.
摘要翻译：一种用于连接电路部件的粘合剂，其被插入在具有突出连接端子的半导体芯片和形成在其上的布线图案的板之间，用于将连接端子和彼此面对的布线图案电连接，并通过施加压力来接合半导体芯片和板 /热，含有含有热可塑性树脂的树脂组合物，交联性树脂和用于形成交联性树脂的交联结构的硬化剂; 和分散在树脂组合物中的复合氧化物颗粒。

19. 发明申请

US20110127667A1 ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME 审中-公开
标题翻译：用于连接电路部件和使用其的半导体器件的粘合剂
公开(公告)号：US20110127667A1
公开(公告)日：2011-06-02
申请号：US13023195
申请日：2011-02-08
申请人： Akira Nagai
发明人： Akira Nagai
IPC分类号： H01L23/48 , C08K3/18 , C08K3/34 , C08K3/38 , C09J163/00 , H01B1/20
CPC分类号： C09J11/04 , C08K3/08 , C08K3/22 , C08L2666/28 , C09J163/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/90 , H01L2224/05111 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0558 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13144 , H01L2224/16238 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29369 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81903 , H01L2224/83101 , H01L2224/83191 , H01L2224/83851 , H01L2224/90 , H01L2224/9211 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H01L2924/00011 , H01L2224/16225 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/0665 , H01L2224/81 , H01L2224/83
摘要： An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.
摘要翻译：一种用于连接电路部件的粘合剂，其被插入在具有突出连接端子的半导体芯片和形成在其上的布线图案的板之间，用于将连接端子和彼此面对的布线图案电连接，并通过施加压力来接合半导体芯片和板 /热，含有含有热可塑性树脂的树脂组合物，交联性树脂和用于形成交联性树脂的交联结构的硬化剂; 和分散在树脂组合物中的复合氧化物颗粒。

20. 发明申请

US20110121447A1 ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME 审中-公开
公开(公告)号：US20110121447A1
公开(公告)日：2011-05-26
申请号：US13023208
申请日：2011-02-08
申请人： Akira Nagai
发明人： Akira Nagai
IPC分类号： H01L23/48 , C08K3/22 , C08K3/38 , C08K3/34 , C09J163/00 , H01B1/14
CPC分类号： C09J11/04 , C08K3/08 , C08K3/22 , C08L2666/28 , C09J163/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/90 , H01L2224/05111 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0558 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13144 , H01L2224/16238 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29369 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81903 , H01L2224/83101 , H01L2224/83191 , H01L2224/83851 , H01L2224/90 , H01L2224/9211 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H01L2924/00011 , H01L2224/16225 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/0665 , H01L2224/81 , H01L2224/83
摘要： An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.

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