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11. 发明公开

EP4439103A1 A MONITORING UNIT COMPRISING AN INTEGRATED MAGNETIC FIELD SENSOR 审中-公开
公开(公告)号：EP4439103A1
公开(公告)日：2024-10-02
申请号：EP23165577.0
申请日：2023-03-30
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： SCHULZ, Gernot , STAHR, Johannes , KRIVEC, Thomas
IPC分类号： G01R33/05 , G01R33/00
CPC分类号： G01R33/05 , G01R33/0011
摘要： A monitoring unit comprises an integrated magnetic field sensor (1). Said sensor (1) comprises at least one excitation coil (2) and at least one sensor coil (3). Both coils (2, 3) are provided on one side of a first magnetic structure (6). The monitoring unit further comprises a sensed element (7), which is associated with said integrated magnetic field sensor (1), with said sensed element (7) being suitable to alter the magnetic field of the integrated magnetic field sensor (1).

12. 发明公开

EP4383121A1 CONTROLLING AND MINIMIZING WARPAGE OF PRINTED CIRCUIT BOARDS, SUCH AS ASYMMETRIC EMBEDDED COMPONENT PCBS 审中-公开
公开(公告)号：EP4383121A1
公开(公告)日：2024-06-12
申请号：EP22211498.5
申请日：2022-12-05
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： FREWEIN, Markus , ZUENDEL, Julia , SCHULZ, Gernot
IPC分类号： G06F30/398 , G06F30/20 , G06F30/23 , G06F115/12 , G06F119/08
CPC分类号： G06F30/398 , G06F30/20 , G06F2115/1220200101 , G06F2119/0820200101 , H05K1/0271 , H05K3/0005 , H05K3/4602 , H05K1/185
摘要： A method of minimizing a warpage of a printed circuit board (1) having at least two layers (2, 3) stacked-up to a panel. The method comprises: providing a simulation model of the panel, in which first geometrical properties of said layers (2, 3) and of their constituent parts made of different materials are fixed, wherein second geometrical properties and physical and chemical properties of different materials used in each of said layers (2, 3) are independent variables in a parameter space of the simulation model; and wherein the simulation model is configured to receive input data including at least one point in the parameter space and at least one parameter of processing the panel and is configured to output data indicative of a geometric shape of the resulting panel. The method further comprises selecting a starting point in the parameter space; running a simulation beginning at the starting point; calculating a value of an objective function indicative of the panel warpage as a function of the output data of the simulation model; and iteratively optimizing the point in the parameter space of the simulation model and repeating the simulation so as to reduce the calculated value of the objective function until a minimum of the objective function value is achieved.

13. 发明公开

EP3111733A1 HEAT SPREADER IN MULTILAYER BUILD UPS 审中-公开
标题翻译： WÄRMEVERTEILER在MEHRSCHICHTIGENWÄRMEAUFBAUTEN
公开(公告)号：EP3111733A1
公开(公告)日：2017-01-04
申请号：EP15707148.1
申请日：2015-03-02
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： SCHULZ, Gernot , KREUTZWIESNER, Elisabeth
IPC分类号： H05K1/02 , H05K1/03
CPC分类号： H05K1/0207 , H05K1/0203 , H05K1/0206 , H05K1/0271 , H05K1/036 , H05K1/115 , H05K1/183 , H05K3/4673 , H05K2201/0175 , H05K2201/0195 , H05K2201/0323 , H05K2201/068
摘要： Connection system (1) for electronic components, the connection system (1) comprising at least one electrically insulating layer (4a', 4a'', 4b', 4b'') and at least one electrically conductive layer (3a, 6a, 3b, 6b), wherein the connection system (1) further comprises a heat distributing layer (5a, 5b) arranged within the at least one electrically insulating layer (4a', 4a'', 4b', 4b''), wherein the at least one heat distributing layer (5a, 5b) is made of thermally conductive, and electrically insulating, matrix-free material.
摘要翻译：所述连接系统（1）包括至少一个电绝缘层（4a'，4a“，4b”，4b“）和至少一个导电层（3a，6a，3b，6b）），其中所述连接系统（1）还包括布置在所述至少一个电绝缘层（4a'，4a“，4b'，4b”）内的散热层（5a，5b），其中所述至少一个散热层层（5a，5b）由导热和电绝缘的无基质材料制成。

14. 发明授权

EP3066898B1 LEITERPLATTENSTRUKTUR 有权
公开(公告)号：EP3066898B1
公开(公告)日：2017-08-23
申请号：EP14795937.3
申请日：2014-10-09
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： KASPER, Alexander , SCHULZ, Gernot , SHIVARUDRAPPA, Ravi Hanyal , MAIER, Markus
IPC分类号： H05K1/02 , H01R12/52 , H05K3/46
CPC分类号： H05K1/0204 , H05K1/0203 , H05K1/0207 , H05K1/0263 , H05K1/0298 , H05K1/115 , H05K3/4688 , H05K2201/0187 , H05K2201/0209 , H05K2201/026 , H05K2201/0323

15. 发明公开

EP3195704A1 WARPAGE CONTROL WITH INTERMEDIATE MATERIAL 有权
标题翻译：用中间材料进行翘曲控制
公开(公告)号：EP3195704A1
公开(公告)日：2017-07-26
申请号：EP15747797.7
申请日：2015-08-04
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： KREUTZWIESNER, Elisabeth , SCHULZ, Gernot
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： H05K1/0271 , H05K1/0207 , H05K3/12 , H05K3/146 , H05K3/16 , H05K3/4602 , H05K3/4608 , H05K3/4688 , H05K2201/0195 , H05K2201/0323 , H05K2201/068 , H05K2201/09136
摘要： A mounting device for mounting electronic components, wherein the mounting device comprises an electrically conductive structure having a first value of thermal expansion in at least one pre-defined spatial direction, an electrically insulating structure having a second value of thermal expansion in the at least one pre-defined spatial direction being different from the first value and being arranged on the electrically conductive structure, and a thermal expansion adjustment structure having a third value of thermal expansion in the at least one pre-defined spatial direction, wherein the third value is selected and the thermal expansion adjustment structure is located so that thermally induced warpage of the mounting device resulting from a difference between the first value and the second value is at least partially compensated by the thermal expansion adjustment structure.
摘要翻译： 1。一种用于安装电子部件的安装装置（100），其中所述安装装置（100）包括在至少一个预定空间方向上具有第一热膨胀值的导电结构（102），电绝缘结构（104）在所述至少一个预定义的空间方向上具有第二热膨胀值，所述第二热膨胀值不同于所述第一值并且尤其小于所述第一值并且被布置在所述导电结构（102）上;以及热膨胀调节结构（106），特别是在所述导电结构（102）中和/或之上，在所述至少一个预定空间方向上具有第三热膨胀值，其中选择所述第三值并且所述热膨胀调节结构（106）为其位置使得由所述第一值与所述第二值之间的差引起的所述安装装置（100）的热诱导翘曲至少部分地由所述第不适当的膨胀调节结构（106）。

16. 发明公开

EP3066898A1 LEITERPLATTENSTRUKTUR 有权
公开(公告)号：EP3066898A1
公开(公告)日：2016-09-14
申请号：EP14795937.3
申请日：2014-10-09
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： KASPER, Alexander , SCHULZ, Gernot , SHIVARUDRAPPA, Ravi Hanyal , MAIER, Markus
IPC分类号： H05K1/02 , H01R12/52 , H05K3/46
CPC分类号： H05K1/0204 , H05K1/0203 , H05K1/0207 , H05K1/0263 , H05K1/0298 , H05K1/115 , H05K3/4688 , H05K2201/0187 , H05K2201/0209 , H05K2201/026 , H05K2201/0323
摘要： The invention relates to a printed circuit board structure (7) having at least one dielectric insulating layer (2, 5o, 5u) and at least one conducting layer (3, 4, 6o, 6u), wherein within the at least one insulating layer (5a), a layer (5) of a dielectric heat-conductive material is provided, which layer (5) is located in close proximity to or in contact with an inner conductor arrangement (3). In the immediate vicinity of or in contact with the layer (5) made of a dielectric heat-conductive material, a further heat-conductive layer (11), preferably an electrically conductive metal layer, can thereby be provided. Also, an at least heat-conductive, preferably electrically conductive, through-plating (9) can be guided from one conductor section (6om) located externally on the printed circuit board to the inside of the printed circuit board at least close to the layer (5) made of a dielectric heat-conductive material.
摘要翻译：本发明涉及具有至少一个介电绝缘层（2,5o，5u）和至少一个导电层（3,4,6o，6u）的印刷电路板结构（7），其中在所述至少一个绝缘层（5a）中，提供了介电热传导材料的层（5），该层（5）位于紧靠内导体结构（3）或与内导体结构（3）接触。在由介电热传导材料制成的层（5）的紧邻或接触处，由此可以提供另一个导热层（11），优选为导电金属层。而且，至少导热的，优选导电的贯通镀层（9）可以从位于印刷电路板外部的一个导体部分（6om）引导至印刷电路板的内部至少接近层（5）由介电导热材料制成。

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