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    • 14. 发明公开
    • 감광성 수지 조성물 및 이를 포함하는 감광재
    • 感光树脂组合物和使用它的感光材料
    • KR1020130058191A
    • 2013-06-04
    • KR1020110124063
    • 2011-11-25
    • 주식회사 엘지화학
    • 이건우곽상규이창순김혜현김세희
    • G03F7/004G03F7/027G03F7/028
    • G03F7/0045G03F7/004G03F7/027G03F7/028G03F7/20G03F7/202
    • PURPOSE: A photosensitive resin composition and a photosensitive material using the same are provided to form patterns to be easily re-treated without deteriorating intensity, thermal resistance, and retention rate. CONSTITUTION: A photosensitive resin composition includes a carboxylic group-containing compound represented by chemical formula 1, a binder resin, an ethylenically unsaturated bond-containing polymeric compound, and a photo initiator. In the chemical formula 1: R1, R2, R3, and R4 are respectively hydrogen, a hydroxyl group, a carboxylic group, or a C1-C10 alkyl group; at least one or the R1, R2, R3, and R4 is a carboxylic group; and a, b, c, and d are respectively the integer of 0 to 10. The content of the carboxylic group-containing compound is 0.01-15 weight% based on the total solid part of the photosensitive resin composition.
    • 目的:提供感光性树脂组合物和使用该感光性树脂组合物的感光性材料,以形成难以再次处理的图案,而不会降低强度,耐热性和保持率。 构成:感光性树脂组合物包含由化学式1表示的含羧基的化合物,粘合剂树脂,含烯属不饱和键的聚合物和光引发剂。 在化学式1中,R 1,R 2,R 3和R 4分别是氢,羟基,羧基或C 1 -C 10烷基; 至少一个或R 1,R 2,R 3和R 4为羧基; a,b,c和d分别为0〜10的整数。含羧基化合物的含量相对于感光性树脂组合物的总固体成分为0.01〜15重量%。