专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

KR102008985B1 도전성 페이스트를 충진시켜서 회로기판을 제작하는 방법과 그 방법에 의하여 제작된 회로기판 有权
公开(公告)号：KR102008985B1
公开(公告)日：2019-08-08
申请号：KR1020120104021
申请日：2012-09-19
申请人： 성낙훈 , 김정식
发明人： 성낙훈 , 김정식
IPC分类号： H05K1/09 , H05K1/02 , G03F7/12 , H05K3/46 , H01B1/22 , H01B1/02

12. 发明授权

KR102008984B1 마스크를 사용하여 기둥부를 구성한 인쇄전자회로 기판의 제조방법과 그에 의한 인쇄전자회로 기판 有权
公开(公告)号：KR102008984B1
公开(公告)日：2019-08-08
申请号：KR1020120103400
申请日：2012-09-18
申请人： 김정식 , 성낙훈
发明人： 김정식 , 성낙훈
IPC分类号： B41F15/00 , H05K3/12 , H05K1/02 , H05K1/03

13. 发明授权

KR102008982B1 테두리 전극부를 형성한 투명유리판의 제조방법과 그에 의하여 제작된 투명유리판 有权
公开(公告)号：KR102008982B1
公开(公告)日：2019-08-08
申请号：KR1020110140313
申请日：2011-12-22
申请人： 김정식 , 성낙훈 , 황춘섭
发明人： 김정식 , 성낙훈 , 황춘섭
IPC分类号： H01B13/00 , H01B5/14 , G06F3/041 , H05K3/10

14. 发明公开

KR1020150044684A 투명부에 공기배출 홀이 형성된 패턴필름과 이를 이용한 노광기 审中-实审
标题翻译：透明部分释放空气和曝光机使用相同
公开(公告)号：KR1020150044684A
公开(公告)日：2015-04-27
申请号：KR1020130124038
申请日：2013-10-17
申请人： 김정식 , 성낙훈
发明人： 김정식 , 성낙훈
IPC分类号： G03F1/38 , G03F7/20
CPC分类号： G03F7/2002 , G03F7/002 , G03F7/0032 , G03F7/095 , G03F7/11 , G03F7/7055 , G03F7/70983
摘要： 본발명은투명부에공기를방출하는공기배출홀이형성된패턴필름과이를이용한노광기에대한것이다. 본발명에서사용이되는패털필름은투명부와불투명부로구성된다. 상기투명부에는공기를방출하는공기배출홀이형성된것을특징이다. 본발명의노광기는투명부와불투명부로구성된패턴필름의투명부에는공기를방출하는공기배출홀이형성된패턴필름을사용하다. 상기공기배출홀이형성된패턴필름은탄성부가형성된압착롤러에감광층또는감광층을보호하고있는보호필름에압착된다. 상기공기배출홀이형성된패턴필름이감광층또는감광층을보호하고있는보호필름에압착되는과정에서, 상기공기배출홀이형성된패턴필름과감광층또는감광층을보호하고있는보호필름사이의공기를공기배출홀에의하여외부로방출되게하는것을특징으로한다. 탄성부를가지는압착롤러를상기광원장치의앞에설치한다. 압착롤러가회전하여지나가면서패턴필름을감광층또는보호필름에압착시킨다. 압착롤러의후단부에는광원장치가연이어따라가면서노광작업을실시한다. 압착롤러의이송과연동하여광원장치가이송되면서노광작업이실시가된다.
摘要翻译：本发明涉及一种图案膜，其包括形成在透明单元上以排出空气的排气孔和其台阶。本发明中使用的图案膜包括透明单元和不透明单元。空气排出孔形成在透明单元上以排出空气。步进器使用上述图案胶片。具有排气孔的图案膜通过包括弹性单元的压辊被压在感光膜或保护感光膜的保护膜上。在将空气排出孔的图案膜压在感光膜上或保护感光膜的保护膜的过程中，压在一起的膜之间的空气可以通过排气孔排出到外部。具有弹性单元的压辊安装在光源装置的前面。当压辊通过时，图案膜被按压感光膜或保护膜。当光源装置跟随压辊的后端时，执行曝光操作。当根据压辊的转印传送光源装置时，执行曝光操作。

15. 发明公开

KR1020140038147A 선광원 발생장치를 구비한 노광기 审中-实审
标题翻译：线型曝光装置
公开(公告)号：KR1020140038147A
公开(公告)日：2014-03-28
申请号：KR1020120104511
申请日：2012-09-20
申请人： 성낙훈 , 김정식
发明人： 성낙훈 , 김정식
IPC分类号： H01L21/027 , G03F7/20
CPC分类号： H01L21/0274 , G03B21/602 , G03F7/70283 , G03F7/70708 , H01L21/268
摘要： The present invention relates to a line type light exposure apparatus. More particularly, the line type light exposure apparatus includes a light source and a convex lenticular. According to the embodiment of the present invention, the line type light exposure apparatus includes a light source and a convex lenticular combination. The line type light exposure apparatus includes at least one pressure roller, at least on sub roller, a pattern film, a table located in a substrate, and a pushing unit.
摘要翻译：线型曝光装置技术领域本发明涉及一种线型曝光装置。更具体地，线型曝光装置包括光源和凸透镜。根据本发明的实施例，线型曝光装置包括光源和凸透镜组合。线型曝光装置包括至少一个加压辊，至少在副辊，图案膜，位于基板中的台和推动单元。

16. 发明公开

KR1020140031640A 기둥부와 전도성 회로부가 일체로 결합된 극미세 회로기판의 제조방법과 그 방법에 의하여 제조된 극미세 회로기판 审中-实审
标题翻译：极致微结构电路板
公开(公告)号：KR1020140031640A
公开(公告)日：2014-03-13
申请号：KR1020120098198
申请日：2012-09-05
申请人： 김정식 , 성낙훈
发明人： 김정식 , 성낙훈
IPC分类号： G03F7/20 , H05K3/18
摘要： The present invention relates to a microstructure circuit board in which a conductive circuit part and a pillar part are integrally combined. The microstructure circuit board in which a conductive circuit part and a pillar part are integrally combined comprises the pillar part and conductive circuit part integrally formed on one surface of a nonconductive support plate. The pillar part is formed between the circuits of the conductive circuit part. The pillar part and conductive circuit part are attached through the conductive support plate and an adhesive material. A manufacturing method for the microstructure circuit board in which a conductive circuit part and a pillar part are integrally combined of the present invention comprises: a sensitizer coating process of coating a conductive substrate with a sensitizer; an exposure process of forming a pillar part and non-pillar part by irradiating light through a film in which a pattern is formed on the sensitizer; a space part formation process of forming a space part by removing the non-pillar part; a circuit part formation part of forming a conductive circuit part in the space part through a coating process; a nonconductive support plate adhesion process of attaching the pillar part and the conductive circuit part to the conductive support plate; and a conductive substrate removal process of removing the conductive substrate.
摘要翻译：本发明涉及导电电路部分和柱部分整体组合的微结构电路板。其中导电电路部分和柱部分整体组合的微结构电路板包括整体形成在非导电支撑板的一个表面上的柱部分和导电电路部分。该柱部分形成在导电电路部分的电路之间。支柱部分和导电电路部分通过导电支撑板和粘合材料附着。导电电路部分和柱部分与本发明整体组合的微结构电路板的制造方法包括：使敏化剂涂覆导电性基材的敏化剂涂布方法; 通过在敏化剂上形成图案的膜照射光而形成柱部和非柱部的曝光处理; 通过去除非柱部分形成空间部分的空间部分形成过程; 电路部件形成部，其通过涂布工序在所述空间部中形成导电电路部; 将支柱部分和导电电路部分附接到导电支撑板的非导电支撑板粘附工艺; 以及去除导电性基板的导电性基板除去工序。

17. 发明公开

KR1020130086831A 선도금과 후에칭방법에 의한 극미세 회로를 가지는 기판의 제조방법과 그에 의하여 제작된 극미세 회로기판 审中-实审
标题翻译：通过预处理和后蚀刻方法和由分类方法制造的极端分钟电路板的基板的制造方法
公开(公告)号：KR1020130086831A
公开(公告)日：2013-08-05
申请号：KR1020120007835
申请日：2012-01-26
申请人： 김정식 , 성낙훈
发明人： 김정식 , 성낙훈
IPC分类号： H05K3/18 , H05K3/06
摘要： PURPOSE: A method of a substrate having an ultra-fine circuit by pre-plating and after etching methods and an ultra-fine circuit board manufactured using the same are provided to improve precision by easily controlling the thickness of a circuit unit. CONSTITUTION: A sputtering metal layer (2) is formed on the substrate (1). A sensitive material is spread on the top of the sputtering metal layer. A light exposure unit and a light non-exposure unit are formed on the sensitive material. A space unit is formed between the light exposure units. A plating circuit unit (7) is formed in the space unit.
摘要翻译：目的：提供一种通过预镀和蚀刻方法具有超细电路的基板和使用其制造的超细电路板的方法，以通过容易地控制电路单元的厚度来提高精度。构成：在基板（1）上形成溅射金属层（2）。敏感材料铺展在溅射金属层的顶部。在敏感材料上形成曝光单元和光不曝光单元。在曝光单元之间形成空间单元。电镀电路单元（7）形成在空间单元中。

18. 发明公开

KR1020130072759A 테두리 전극부를 형성한 투명유리판의 제조방법과 그에 의하여 제작된 투명유리판 审中-实审
标题翻译：具有外形电极部分透明玻璃板的制造方法和通过制造方法制造的透明玻璃板
公开(公告)号：KR1020130072759A
公开(公告)日：2013-07-02
申请号：KR1020110140313
申请日：2011-12-22
申请人： 김정식 , 성낙훈 , 황춘섭
发明人： 김정식 , 성낙훈 , 황춘섭
IPC分类号： H01B13/00 , H01B5/14 , G06F3/041 , H05K3/10
CPC分类号： G06F3/041 , G06F2203/04103 , H01B5/14 , H01B13/0003 , H05K3/107
摘要： PURPOSE: A manufacturing method of a transparent glass plate with a rim electrode unit and a transparent glass plate manufactured by the same are provided to combine a circuit unit and an exposure part together, thereby improving connectivity. CONSTITUTION: Photoresist is applied on a transparent glass plate. More than one collective circuit unit is designed on a film. An exposure part (8) is formed in the collective circuit unit. Space (12, 13, 14) are formed between the exposure part. A conducting circuit is made of conductive materials (15) in the spaces.
摘要翻译：目的：提供一种具有边缘电极单元和由其制造的透明玻璃板的透明玻璃板的制造方法，以将电路单元和曝光部分组合在一起，从而提高连接性。构成：光刻胶应用在透明玻璃板上。电影上设计了多个集体电路单元。在集体电路单元中形成曝光部分（8）。在曝光部分之间形成空间（12,13,14）。导电电路由空间中的导电材料（15）制成。

19. 发明授权

KR100931739B1 인바 합금 및 그 제조방법 有权
标题翻译： 인바합금및그제조방법
公开(公告)号：KR100931739B1
公开(公告)日：2009-12-14
申请号：KR1020070105457
申请日：2007-10-19
申请人： 성낙훈 , 김정식
发明人： 성낙훈 , 김정식
IPC分类号： C25D3/56
摘要： AN invar alloy and a manufacturing method thereof are provided to reduce the loss of materials and a manufacturing cost. An invar alloy and a manufacturing method thereof comprises: a step preparing the electrolyte including calcium chloride of 38g, ferous chloride of 100g, nickel sulfate of 220g, nickel chloride of 120g, hydrochloric acid of 25g, sodium saccharin of 2g, and sodium lauryl sulfate of 0.2g based on the water 1L; and a step electronically plating in the state where temperature is 45-60°C pH of electrolyte is 0.5-1.5, the electric current density is 50-100mA/cm^2. The sodium lauryl sulfate is added for a surfactant function. The calcium chloride is added for the conductivity improvement of electrolyte.
摘要翻译：提供一种恩戈尔合金及其制造方法，以减少材料损失和制造成本。恩戈尔合金及其制造方法包括：制备电解质的步骤，包括38g氯化钙，100g氯化亚铁，220g硫酸镍，120g氯化镍，25g盐酸，2g糖精钠和2g月桂基硫酸钠基于水1L为0.2g; 在温度为45-60℃的状态下进行电镀步骤，电解液的pH值为0.5-1.5，电流密度为50-100mA /平方公分。加入月桂基硫酸钠用于表面活性剂功能。加入氯化钙以提高电解质的导电性。

20. 发明授权

KR102051117B1 감광재를 활용한, 기둥부를 구비한 인쇄전자회로 기판의 제조방법과 그에 의한 인쇄전자회로 기판 有权
公开(公告)号：KR102051117B1
公开(公告)日：2019-12-02
申请号：KR1020120103401
申请日：2012-09-18
申请人： 김정식 , 성낙훈
发明人： 김정식 , 성낙훈
IPC分类号： H05K3/00 , H05K1/03 , H05K3/24 , H05K1/09 , G03F7/26

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式