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11. 发明申请

US20130042992A1 METHOD FOR SURFACE TREATMENT OF A DIE-CASTING DIE 审中-公开
标题翻译：用于表面处理模具的方法
公开(公告)号：US20130042992A1
公开(公告)日：2013-02-21
申请号：US13634679
申请日：2011-05-11
申请人： Yasushi Hiraoka , Yuji Kobayashi
发明人： Yasushi Hiraoka , Yuji Kobayashi
IPC分类号： B22C9/12 , B22D17/22
CPC分类号： C23C8/80 , C23C8/24 , C23C8/26 , C23C8/28 , C23C8/30 , C23C8/32 , C23C8/34 , C23C8/36 , C23C8/38
摘要： The present invention is to provide a method for surface treatment that substantially provides no nitride compound layer that causes heat checks and abrasion to a die, while nitride is introduced in large quantities into the die internally, and as a result a die-casting die with excellent heat check resistance and excellent abrasion resistance can be produced. The method comprises a step of a nitriding process for forming on an aesthetic surface of the die-casting die a nitrided layer that includes at least a compound layer composed of a nitrogen compound by introducing gas containing at least ammonia gas to a heating furnace, a step of decomposing the compound by exhausting the ammonia gas from the heating furnace and for introducing ambient gas to the heating furnace, to carry out a thermal process to decompose the nitrogen compound, and a step of processing a shot peening process on the aesthetic surface of the die. The thickness of the compound layer contained in the nitrogen layer that is formed in the step of nitriding process is within the range of from 2∫m to 7∫m.
摘要翻译：本发明提供一种用于表面处理的方法，其基本上不提供对模具进行热检查和磨损的氮化物化合物层，而氮化物在内部大量引入模具中，因此具有可以产生优异的耐热检查性和优异的耐磨性。该方法包括氮化过程的步骤，用于在压铸模的美观表面上形成氮化层，该氮化层至少包括由氮化合物构成的化合物层，通过将至少含有氨气的气体引入加热炉，通过从加热炉排出氨气并将环境气体引入加热炉来分解化合物的步骤，进行热处理以分解氮化合物，以及在美观表面上处理喷丸处理步骤死了在氮化工序中形成的氮层中所含的化合物层的厚度为2μm〜7μm的范围。

12. 发明授权

US08286923B2 Holding tool for elongated member 有权
标题翻译：拉长件的夹持工具
公开(公告)号：US08286923B2
公开(公告)日：2012-10-16
申请号：US11204038
申请日：2005-08-16
申请人： Yuji Kobayashi , Yasuo Yamamoto
发明人： Yuji Kobayashi , Yasuo Yamamoto
IPC分类号： F16L3/08 , F16L3/16
CPC分类号： F16L3/12 , B60G2204/202 , B60R16/0215 , F16L3/1075 , Y10T24/44641
摘要： A holding tool for an elongated member includes a connecting member to be attached to an attachment member, a first holding part for holding the elongated member comparatively tightly, and a second holding part for holding the elongated member with a prescribed space therearound. A gap is formed between the first and second holding parts so that the elongated member can move from the first holding part to the second holding part.
摘要翻译：用于细长构件的保持工具包括附接到附接构件的连接构件，用于相对紧固地保持细长构件的第一保持部和用于将细长构件保持在其周围的规定空间的第二保持部。在第一和第二保持部之间形成间隙，使得细长构件能够从第一保持部移动到第二保持部。

13. 发明申请

US20120252327A1 MACHINE FOR BLASTING ABRASIVES 有权
标题翻译：喷砂机
公开(公告)号：US20120252327A1
公开(公告)日：2012-10-04
申请号：US13499355
申请日：2010-11-22
申请人： Yuji Kobayashi , Takeyoshi Nakata
发明人： Yuji Kobayashi , Takeyoshi Nakata
IPC分类号： B24C9/00
CPC分类号： B24C9/00 , B24C3/22
摘要： The object of the present invention is to provide a machine for blasting abrasives that has a simple structure and that solves the problem of abrasives falling when the door for the gateway for the work is opened or closed. The machine for blasting abrasives comprises a chamber 11 for processing, a nozzle 13 that is provided within the chamber 11 for shooting the abrasives (shots) S onto the work W, and a jig 15 for holding the work W at a position facing the nozzle 13. A gateway 17 with a door 19 is formed in the ceiling 11a of the chamber 11. The size of the gateway 17 enables the work W to protrude from the chamber 11 by means of the jig 15 at a position corresponding to the jig 15 that is linearly moving up and down. The door 19 is provided within the chamber 11 so as to seal the gateway by linearly moving up and down and so as to create a vacant plane on the gateway for passing the work by horizontally moving.
摘要翻译：本发明的目的是提供一种具有简单结构的用于喷砂的磨料机，并且解决了当打开或关闭作业用的门的门时磨损物掉落的问题。用于喷砂研磨机的机器包括用于加工的腔室11，设置在腔室11内用于将磨料（射击）S射到工件W上的喷嘴13以及用于将工件W保持在面对喷嘴的位置的夹具15 具有门19的网关17形成在室11的顶板11a中。网关17的尺寸使得工件W能够通过夹具15在与夹具15相对应的位置处从室11突出这是线性上下移动。门19设置在腔室11内，以便通过线性地上下移动来密封网关，以便在网关上创建一个空的平面以通过水平移动使工作通过。

14. 发明授权

US08015700B2 Method of fabricating wiring board and method of fabricating semiconductor device 有权
标题翻译：制造布线板的方法和制造半导体器件的方法
公开(公告)号：US08015700B2
公开(公告)日：2011-09-13
申请号：US11419887
申请日：2006-05-23
申请人： Junichi Nakamura , Yuji Kobayashi
发明人： Junichi Nakamura , Yuji Kobayashi
IPC分类号： H05K3/36 , H05K3/34 , H05K3/02 , H05K3/10 , H01K3/10
CPC分类号： H05K1/115 , H01L21/4857 , H01L21/563 , H01L21/6835 , H01L23/49816 , H01L24/16 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/97 , H01L2221/68345 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73204 , H01L2224/73265 , H01L2224/81001 , H01L2224/81192 , H01L2224/81801 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H05K1/116 , H05K3/205 , H05K3/28 , H05K3/3473 , H05K3/4007 , H05K3/421 , H05K3/423 , H05K3/4644 , H05K2201/0376 , H05K2201/09481 , H05K2201/0949 , H05K2201/09509 , H05K2203/0338 , H05K2203/0361 , H05K2203/1536 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of fabricating a wiring board includes forming a resist layer, such as a solder or plating resist layer, defining an opening portion on a support board such that a portion of the support board is exposed. An electrode is formed directly on the support board within the opening portion, and the plating resist layer, when used, is removed. An insulating layer is formed on the electrode, as well as the support board or solder resist layer, and a wiring portion connected to the electrode at the insulating layer is also formed. A solder resist layer having an opening portion is then formed on the wiring portion, and the support board is removed to expose a surface of the electrode or a surface of the electrode and insulating layer. Another solder resist layer having an opening portion may then be formed on the exposed surface of the insulating layer.
摘要翻译：制造布线板的方法包括在支撑板上形成限定开口部分的焊料或电镀抗蚀剂层的抗蚀剂层，使得支撑板的一部分露出。电极直接形成在开口部内的支撑板上，当使用时，电镀抗蚀剂层被去除。在电极以及支撑板或阻焊层上形成绝缘层，并且还形成连接到绝缘层处的电极的布线部分。然后在布线部分上形成具有开口部分的阻焊层，并且去除支撑板以暴露电极的表面或电极和绝缘层的表面。然后可以在绝缘层的暴露表面上形成具有开口部分的另一阻焊层。

15. 发明授权

US07829833B2 Arranging and/or supporting an image pickup device in an image pickup apparatus 有权
标题翻译：在图像拾取装置中布置和/或支撑图像拾取装置
公开(公告)号：US07829833B2
公开(公告)日：2010-11-09
申请号：US11440214
申请日：2006-05-23
申请人： Yuji Kobayashi , Mitsuhiro Taira
发明人： Yuji Kobayashi , Mitsuhiro Taira
IPC分类号： H01L27/00
CPC分类号： H01L27/14625 , H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： An image pickup apparatus includes: an image pickup device comprising a bare chip and having an image pickup area and a mount area on the same face; an electric board having the image pickup device mounted thereon; and a support having an opening. The support is disposed on the rear face of the mount surface of the image pickup device such that the rear face of the image pickup device is opposed to and exposed through the opening. The opening is supplied with an adhesive to fix the support to the image pickup device. Thus, the image pickup apparatus to which the support can be fixed with a sufficient adhesive strength can be provided.
摘要翻译：一种图像拾取装置包括：图像拾取装置，包括裸芯片，并且具有图像拾取区域和同一面上的安装区域; 其上安装有图像拾取装置的电子板; 和具有开口的支撑件。支撑件设置在图像拾取装置的安装表面的后表面上，使得图像拾取装置的后表面与开口相对并暴露。开口被提供有粘合剂以将支撑件固定到图像拾取装置。因此，可以提供能够以足够的粘合强度固定支撑件的图像拾取装置。

16. 发明申请

US20100159617A1 SEMICONDUCTOR-DEVICE MANUFACTURING METHOD AND EXPOSURE METHOD 有权
标题翻译：半导体器件制造方法和曝光方法
公开(公告)号：US20100159617A1
公开(公告)日：2010-06-24
申请号：US12533592
申请日：2009-07-31
申请人： Yuji KOBAYASHI
发明人： Yuji KOBAYASHI
IPC分类号： H01L21/66 , G03F7/20
CPC分类号： H01L22/12 , H01L22/20
摘要： A semiconductor-device manufacturing method includes steps of performing a sidewall fabrication thereby forming a first pattern structure; measuring an amount of displacement of line portions of the first pattern structure; correcting an overlay specification for an overlay of the first pattern structure and a second pattern structure dynamically based on the amount of displacement; and determining whether an error in the overlay of the first pattern structure and the second pattern structure meets the corrected overlay specification.
摘要翻译：半导体器件制造方法包括以下步骤：执行侧壁制造，从而形成第一图案结构; 测量所述第一图案结构的线部分的位移量; 基于位移量来动态地修正第一图案结构和第二图案结构的覆盖层的叠加规格; 以及确定所述第一图案结构和所述第二图案结构的叠加中的错误是否满足所述修正的覆盖规范。

17. 发明授权

US07679246B2 Actuator 失效
标题翻译：执行器
公开(公告)号：US07679246B2
公开(公告)日：2010-03-16
申请号：US10575681
申请日：2004-07-08
申请人： Masaaki Yamakata , Yuji Kobayashi , Kiyoshi Akiyama
发明人： Masaaki Yamakata , Yuji Kobayashi , Kiyoshi Akiyama
IPC分类号： H02K7/09
CPC分类号： H02K7/09 , F16C32/04 , F16C2360/45 , H02K1/148 , H02K1/185
摘要： A case (100), a rotor (200) that is freely rotatably supported in the case (100), and stators (110) for rotating the rotor by magnetic force are provided. The stator (110) contains a core (111) mounted at the outside of the case (100), and a magnetic coil (112) wound around the core (111). An end face of the core (111) constituting a magnetic pole is formed of at least non-laminate ferromagnetic substance, and exposed to the inner surface of the case (100) so as to form a part of the inner wall of the case (100).
摘要翻译：提供一种壳体（100），可自由旋转地支撑在壳体（100）中的转子（200）和用于通过磁力使转子旋转的定子（110）。定子（110）包括安装在壳体（100）外部的芯体（111）和缠绕在芯体（111）上的电磁线圈（112）。构成磁极的芯体（111）的端面由至少非叠层铁磁性物质形成，露出于壳体（100）的内表面，形成壳体的内壁的一部分（ 100）。

18. 发明申请

US20090254813A1 DOCUMENT PROCESSING APPARATUS AND DOCUMENT PROCESSING METHOD 有权
标题翻译：文件处理装置和文件处理方法
公开(公告)号：US20090254813A1
公开(公告)日：2009-10-08
申请号：US12414049
申请日：2009-03-30
申请人： Yuji Kobayashi
发明人： Yuji Kobayashi
IPC分类号： G06F17/00
CPC分类号： H04N1/387 , G06F17/248 , G06T11/60 , H04N1/32101 , H04N2201/3242 , H04N2201/3245 , H04N2201/3274
摘要： A document processing apparatus accepts input of image information which represents a document, separates the image information as content of the document into regions, associates the image information separated as content into regions with information used to lay out the content, and holds the associated information as learning information. Subsequently, the document processing apparatus lays out the content of the inputted document based on the held learning information and outputs a document in which the content is laid out.
摘要翻译：文档处理装置接收表示文档的图像信息的输入，将作为文档内容的图像信息分离成区域，将作为内容分离的图像信息与具有用于布局内容的信息相关联，并将相关信息保存为学习信息。随后，文档处理装置基于所保持的学习信息来布置输入的文档的内容，并输出其中布置内容的文档。

19. 发明授权

US07569403B2 Pattern evaluation method, manufacturing method of semiconductor device, correction method of mask pattern and manufacturing method of exposure mask 失效
标题翻译：图案评价方法，半导体装置的制造方法，掩模图案的校正方法以及曝光掩模的制造方法
公开(公告)号：US07569403B2
公开(公告)日：2009-08-04
申请号：US11132397
申请日：2005-05-19
申请人： Yuji Kobayashi
发明人： Yuji Kobayashi
IPC分类号： G01R31/26
CPC分类号： H01L22/14 , H01L2924/0002 , H01L2924/00
摘要： A pattern evaluation method using a circuit arrangement provided with N (N is a natural number of 2 or greater) circuit groups having wiring whose widths are different to each other, each circuit group including first to Mth circuits having first to Mth (M is a natural number of 2 or greater) wiring formed of a conductive layer, respectively, each of the first to the Mth wiring having the same width that is electrically measurable, the pattern evaluation method includes:arranging patterns to be evaluated so that the Mth wiring or a layer in the vicinity thereof is locally removed; electrically calculating a first characteristic value indicating a characteristic of the first circuit including at least the wiring width of the first wiring; electrically calculating an Mth characteristic value which is a value indicating the characteristic of the Mth circuit and dependent on a geometric relationship between the pattern to be evaluated and the Mth wiring; and evaluating the characteristic of the pattern to be evaluated based on the first characteristic value to the Mth characteristic value obtained for at least two circuit groups of the N circuit groups.
摘要翻译：使用具有N（N为2以上的自然数）个电路组的电路装置的模式评估方法，所述电路组具有宽度彼此不同的布线，每个电路组包括具有第一至第M个的第一至第M电路（M为分别由导电层形成的自然数为2或更大的布线，第一至第M布线中的每一个具有可电测量的相同宽度，图案评估方法包括：布置要评估的图案，使得第M布线或其附近的层被局部去除; 电计算表示第一电路的特性的第一特征值，该第一特性值至少包括第一布线的布线宽度; 电计算第M特性值，其是表示第M个电路的特性并取决于待评估的图案与第M布线之间的几何关系的值; 以及基于所述N个电路组的至少两个电路组获得的所述第一特征值与所述第M特性值来评估要评估的图案的特性。

20. 发明申请

US20080202183A1 Shot-Peening Process 有权
标题翻译：喷丸处理
公开(公告)号：US20080202183A1
公开(公告)日：2008-08-28
申请号：US11921928
申请日：2006-06-12
申请人： Yuji Kobayashi
发明人： Yuji Kobayashi
IPC分类号： C21D7/06
CPC分类号： B24C1/10 , B24C11/00 , Y10T29/479
摘要： A method of shot peening in which with respect to a carburized and quenched metal part, only its surface abnormal layer detrimental to the fatigue strength thereof is scraped without scraping of the martensitic structure underlying the surface abnormal layer, namely, in which the fatigue strength can be rendered stable and enhanced without surface cracking. As bombardment shot, use is made of a shot with hardness higher than that (first hardness) of the surface abnormal layer occurring at a surface layer portion of metal part prior to shot peening but lower than that (second hardness) of the martensitic structure.
摘要翻译：一种喷丸硬化方法，其中相对于渗碳淬火的金属部件，只有其不利于其疲劳强度的表面异常层被刮去，而不会刮擦表面异常层下面的马氏体结构，即其中疲劳强度可以使之稳定和增强，无表面开裂。作为轰击射击，使用硬度高于在喷丸硬化之前在金属部件的表面层部分发生但低于马氏体结构的（第二硬度）的表面异常层的（第一硬度）的喷丸。

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