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11. 发明授权

US07449907B2 Test unit to test a board having an area array package mounted thereon 失效
标题翻译：测试单元测试其上安装有面阵列封装的板
公开(公告)号：US07449907B2
公开(公告)日：2008-11-11
申请号：US11316826
申请日：2005-12-27
申请人： Se-young Jang , Masaharu Tsukue , Young-jun Moon
发明人： Se-young Jang , Masaharu Tsukue , Young-jun Moon
IPC分类号： G01R31/02
CPC分类号： G01R1/0483
摘要： A test unit to test a board having an area array package mounted therein includes the board, the area array package having an electronic component, a plurality of package pins including a plurality of contact pins connected with the electronic component and a plurality of no-contact pins not connected with the electronic component, and a plurality of contact members respectively provided on the plurality of contact pins and the plurality of no-contact pins to connect the plurality of package pins with the board, a plurality of board contact parts provided on the board and connected with the plurality of contact members to be connected with the plurality of package pins, at least one first connection part provided in the area array package to electrically connect the plurality of no-contact pins with each other in pairs, at least one second connection part provided on the board to electrically connect the plurality of board contact parts with each other in pairs to form a circuit line arranged alternately with the first connection part through the plurality of contact members, and at least one test point provided at opposite ends of the circuit line to measure a resistance between the first and second connection parts. Thus, the test unit can test a connection state of the plurality of contact members without difficulty.
摘要翻译：用于测试其中安装有区域阵列封装的板的测试单元包括板，具有电子部件的区域阵列封装，包括与电子部件连接的多个触针的多个封装引脚和多个不接触分别设置在多个接触销和多个非接触引脚上以将多个封装引脚与该板连接的多个接触构件，设置在电子部件上的多个接触部件，与所述多个接触构件连接以与所述多个封装销连接;至少一个第一连接部，设置在所述区域阵列封装中，以将所述多个非接触引脚成对地电连接至少一个第二连接部，设置在所述板上，用于将所述多个板接触部彼此成对地电连接以形成电路线a 通过多个接触构件与第一连接部分交替地摆动，以及设置在电路线的相对端的至少一个测试点，以测量第一和第二连接部分之间的电阻。因此，测试单元可以毫无困难地测试多个接触构件的连接状态。

12. 发明申请

US20080198567A1 MULTILAYER PRINTED CIRCUIT BOARD 有权
标题翻译：多层印刷电路板
公开(公告)号：US20080198567A1
公开(公告)日：2008-08-21
申请号：US11970051
申请日：2008-01-07
申请人： Hark Byeong PARK , Byong Su Seol , Hyung Geun Kim , Hyun Ho Park , Jong Sung Lee , Hyung Seok Lee , Young Jun Moon
发明人： Hark Byeong PARK , Byong Su Seol , Hyung Geun Kim , Hyun Ho Park , Jong Sung Lee , Hyung Seok Lee , Young Jun Moon
IPC分类号： H05K1/02 , H05K7/00
CPC分类号： H05K1/0234 , H05K1/162 , H05K1/167 , H05K2201/09309 , H05K2201/09336
摘要： Disclosed is a multilayer printed circuit board. The multilayer printed circuit board includes a power source surface to provide power to each component disposed on the power source surface, a ground surface having a reference voltage, a strip line which passes through the power source surface and/or the ground surface so as to transmit signals between components, an antenna installed in proximity to a sectional region of the power source surface and the ground surface, and an electromagnetic wave reduction member which is provided between the power source surface and the ground surface to effectively reduce an electromagnetic wave generated from the strip line.
摘要翻译：公开了一种多层印刷电路板。多层印刷电路板包括用于向设置在电源表面上的每个部件提供电力的电源表面，具有参考电压的接地表面，通过电源表面和/或接地表面的带状线，以便在部件之间传输信号，安装在电源表面和地表面的截面区域附近的天线以及设置在电源表面和地表之间的电磁波减少部件，以有效地减少由电源表面和地面之间产生的电磁波带状线。

13. 发明申请

US20080157326A1 IC PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译： IC封装及其制造方法
公开(公告)号：US20080157326A1
公开(公告)日：2008-07-03
申请号：US11872810
申请日：2007-10-16
申请人： Hyun Joo HAN , Tao Sang Park , Se Yeong Jang , Young Jun Moon , Jung Hyeon Kim , Sung Wook Kang
发明人： Hyun Joo HAN , Tao Sang Park , Se Yeong Jang , Young Jun Moon , Jung Hyeon Kim , Sung Wook Kang
IPC分类号： H01L23/538 , H01L21/60
CPC分类号： H05K3/3436 , H01L23/3128 , H01L24/73 , H01L25/105 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/1023 , H01L2225/107 , H01L2924/14 , H01L2924/15311 , H05K2201/10378 , H05K2201/10424 , H05K2201/10515 , Y02P70/613 , H01L2924/00 , H01L2924/00012
摘要： An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.
摘要翻译：一种包括堆叠在印刷电路板上的多个BGA IC封装的IC封装及其制造方法。 IC封装包括印刷电路板，第一BGA IC封装，具有堆叠在印刷电路板上的多个第一焊球，第二BGA IC封装，具有堆叠在第一BGA IC上的多个第二焊球封装件和具有多个通孔的插入件，其以熔融状态被第二焊球填充，使得第二焊球的长度增加，而第二焊球硬化，插入件接合到第一个BGA IC封装。

14. 发明申请

US20070007322A1 Board assembly apparatus having electronic components disposed in a space between circuit boards and a manufacturing method thereof 审中-公开
标题翻译：具有设置在电路板之间的空间中的电子部件的板组装装置及其制造方法
公开(公告)号：US20070007322A1
公开(公告)日：2007-01-11
申请号：US11325308
申请日：2006-01-05
申请人： Jong-sung Lee , Yoon-sung Kim , Young-jun Moon , Se-young Jang
发明人： Jong-sung Lee , Yoon-sung Kim , Young-jun Moon , Se-young Jang
IPC分类号： B23K31/02 , B23K31/00
CPC分类号： H05K1/141 , H05K3/3415 , H05K3/3436 , H05K3/3484 , H05K2201/10515 , H05K2203/1572 , Y02P70/613
摘要： A board assembly apparatus and a manufacturing method includes applying solder paste onto a first surface of a first board, arranging electronic components on the first surface of the first board on which the solder paste is applied, arranging a second board above the electronic components and the first surface of the first board, and curing the solder paste.
摘要翻译：板组装设备和制造方法包括将焊膏涂覆到第一板的第一表面上，将电子部件布置在其上施加焊膏的第一板的第一表面上，在电子部件上方布置第二板，第一板的第一表面，并固化焊膏。

15. 发明申请

US20060139043A1 Test unit to test a board having an area array package mounted thereon 失效
标题翻译：测试单元测试其上安装有面阵列封装的板
公开(公告)号：US20060139043A1
公开(公告)日：2006-06-29
申请号：US11316826
申请日：2005-12-27
申请人： Se-young Jang , Masaharu Tsukue , Young-jun Moon
发明人： Se-young Jang , Masaharu Tsukue , Young-jun Moon
IPC分类号： G01R31/02
CPC分类号： G01R1/0483
摘要： A test unit to test a board having an area array package mounted therein includes the board, the area array package having an electronic component, a plurality of package pins including a plurality of contact pins connected with the electronic component and a plurality of no-contact pins not connected with the electronic component, and a plurality of contact members respectively provided on the plurality of contact pins and the plurality of no-contact pins to connect the plurality of package pins with the board, a plurality of board contact parts provided on the board and connected with the plurality of contact members to be connected with the plurality of package pins, at least one first connection part provided in the area array package to electrically connect the plurality of no-contact pins with each other in pairs, at least one second connection part provided on the board to electrically connect the plurality of board contact parts with each other in pairs to form a circuit line arranged alternately with the first connection part through the plurality of contact members, and at least one test point provided at opposite ends of the circuit line to measure a resistance between the first and second connection parts. Thus, the test unit can test a connection state of the plurality of contact members without difficulty.
摘要翻译：用于测试其中安装有区域阵列封装的板的测试单元包括板，具有电子部件的区域阵列封装，包括与电子部件连接的多个触针的多个封装引脚和多个不接触分别设置在多个接触销和多个非接触引脚上以将多个封装引脚与该板连接的多个接触构件，设置在电子部件上的多个接触部件，与所述多个接触构件连接以与所述多个封装销连接;至少一个第一连接部，设置在所述区域阵列封装中，以将所述多个非接触引脚成对地电连接至少一个第二连接部，设置在所述板上，用于将所述多个板接触部彼此成对地电连接以形成电路线a 通过多个接触构件与第一连接部分交替地摆动，以及设置在电路线的相对端的至少一个测试点，以测量第一和第二连接部分之间的电阻。因此，测试单元可以毫无困难地测试多个接触构件的连接状态。

16. 发明授权

US09197026B2 Molding method of printed circuit board assembly 有权
标题翻译：印刷电路板组装成型方法
公开(公告)号：US09197026B2
公开(公告)日：2015-11-24
申请号：US13211652
申请日：2011-08-17
申请人： Hyun Tae Kim , Tae Sang Park , Young Jun Moon , Soon Min Hong
发明人： Hyun Tae Kim , Tae Sang Park , Young Jun Moon , Soon Min Hong
IPC分类号： H01R43/00 , H05K13/00 , H01R43/24
CPC分类号： H01R43/24 , Y10T29/49147
摘要： Disclosed is a printed circuit board assembly PBA on which a connector for electrical connection to an external connection element is mounted. Such an assembly may be formed with a molding method of a PBA which includes applying a polymer resin to the PBA to mold the PBA in order to offer stiffness thereto. The foregoing method of molding the PBA according to the present disclosure is a molding method of a PBA including a PCB and a connector mounted on the PCB to electrically connect the same to an external connection element. The method includes combining the connector with a connector cover, applying a resin to the PBA combined with the connector cover to execute molding of the PBA, and separating the connector cover from the molded PBA to expose the electrode terminal for an external connection element.
摘要翻译：公开了一种印刷电路板组件PBA，其上安装有用于与外部连接元件电连接的连接器。这种组件可以用PBA的模制方法形成，其包括将聚合物树脂施加到PBA以模制PBA以便提供刚度。根据本公开的上述PBA成型方法是包括PCB和连接在PCB上以将其与外部连接元件电连接的连接器的PBA的成型方法。该方法包括将连接器与连接器盖组合，将树脂施加到与连接器盖结合的PBA上，以执行PBA的成型，以及将连接器盖与模制的PBA分离，以露出用于外部连接元件的电极端子。

17. 发明授权

US08971047B2 Printed circuit board assembly 有权
标题翻译：印刷电路板组装
公开(公告)号：US08971047B2
公开(公告)日：2015-03-03
申请号：US13610145
申请日：2012-09-11
申请人： Yong Won Lee , Tae Sang Park , Hyo Young Shin , Ji Young Jang , Young Jun Moon , Soon Min Hong
发明人： Yong Won Lee , Tae Sang Park , Hyo Young Shin , Ji Young Jang , Young Jun Moon , Soon Min Hong
IPC分类号： H05K1/00 , H05K1/14 , H05K3/28 , H05K3/36 , H05K5/06 , H05K1/18 , H05K3/32
CPC分类号： H05K1/147 , H01L2224/16225 , H01L2924/181 , H05K1/148 , H05K1/189 , H05K3/284 , H05K3/323 , H05K3/361 , H05K5/065 , H05K2201/055 , H05K2203/1316 , H01L2924/00012
摘要： A printed circuit board assembly capable of having an electronic component mounted at a wafer level by using a wafer itself as a printed circuit board, the printed circuit board assembly including a plurality of electronic components, a printed circuit board having the plurality of electronic components mounted thereon, a protection body configured to entirely cover the printed circuit board, and a connection unit having one end that is exposed to an outside of the protection body for the printed circuit board to be electrically connected to a sub board, wherein the printed circuit board comprises a wafer printed circuit board formed with a wafer.
摘要翻译：一种印刷电路板组件，其能够通过使用晶片本身作为印刷电路板而具有安装在晶片级的电子部件，所述印刷电路板组件包括多个电子部件，安装有多个电子部件的印刷电路板其上配置有完全覆盖印刷电路板的保护体，以及连接单元，该连接单元的一端暴露于用于印刷电路板的保护体的外部，以与电路板电连接，其中印刷电路板包括形成有晶片的晶片印刷电路板。

18. 发明申请

US20130077265A1 PRINTED CIRCUIT BOARD ASSEMBLY 有权
标题翻译：印刷电路板组装
公开(公告)号：US20130077265A1
公开(公告)日：2013-03-28
申请号：US13610145
申请日：2012-09-11
申请人： Yong Won Lee , Tae Sang Park , Hvo Young Shin , Ji Young Jang , Young Jun Moon , Soon Min Hong
发明人： Yong Won Lee , Tae Sang Park , Hvo Young Shin , Ji Young Jang , Young Jun Moon , Soon Min Hong
IPC分类号： H05K1/18
CPC分类号： H05K1/147 , H01L2224/16225 , H01L2924/181 , H05K1/148 , H05K1/189 , H05K3/284 , H05K3/323 , H05K3/361 , H05K5/065 , H05K2201/055 , H05K2203/1316 , H01L2924/00012
摘要： A printed circuit board assembly capable of having an electronic component mounted at a wafer level by using a wafer itself as a printed circuit board, the printed circuit board assembly including a plurality of electronic components, a printed circuit board having the plurality of electronic components mounted thereon, a protection body configured to entirely cover the printed circuit board, and a connection unit having one end that is exposed to an outside of the protection body for the printed circuit board to be electrically connected to a sub board, wherein the printed circuit board comprises a wafer printed circuit board formed with a wafer.
摘要翻译：一种印刷电路板组件，其能够通过使用晶片本身作为印刷电路板而具有安装在晶片级的电子部件，所述印刷电路板组件包括多个电子部件，安装有多个电子部件的印刷电路板其上配置有完全覆盖印刷电路板的保护体，以及连接单元，该连接单元的一端暴露于用于印刷电路板的保护体的外部，以与电路板电连接，其中印刷电路板包括形成有晶片的晶片印刷电路板。

19. 发明授权

US08350162B2 Connecting structure for circuit board and connecting method using the same 有权
标题翻译：电路板的连接结构及其连接方法
公开(公告)号：US08350162B2
公开(公告)日：2013-01-08
申请号：US12659556
申请日：2010-03-12
申请人： Hyun Tae Kim , Tae Sang Park , Young Jun Moon , Soon Min Hong , Hyo Young Shin
发明人： Hyun Tae Kim , Tae Sang Park , Young Jun Moon , Soon Min Hong , Hyo Young Shin
IPC分类号： H05K1/11
CPC分类号： H05K3/363 , H05K3/3457 , H05K3/3494 , H05K2201/09709 , H05K2201/10666 , H05K2203/0195 , H05K2203/167 , Y10T29/49126 , Y10T29/49213
摘要： Disclosed is a connection structure for a circuit board using a solder bump to arrange circuit boards. The circuit board connection structure includes a solder bump prepared on one of two circuit boards and a perforated part formed at the other of the circuit boards to receive the solder bump. Facing both circuit boards towards each other and inserting the solder bump into the perforated part, the circuit boards are desirably arranged.
摘要翻译：公开了一种使用焊料凸块布置电路板的电路板的连接结构。电路板连接结构包括制备在两个电路板中的一个上的焊料凸块和形成在另一个电路板上的穿孔部分以接收焊料凸块。将两个电路板朝向彼此并将焊料凸块插入穿孔部分中，期望布置电路板。

20. 发明申请

US20060139044A1 Test unit usable with a board having an electronic component 失效
公开(公告)号：US20060139044A1
公开(公告)日：2006-06-29
申请号：US11316930
申请日：2005-12-27
申请人： Tae-sang Park , Jung-soon Kim , Young-jun Moon , Jun-young Lee
发明人： Tae-sang Park , Jung-soon Kim , Young-jun Moon , Jun-young Lee
IPC分类号： G01R31/02
CPC分类号： H05K1/0268 , G01R1/0408 , H05K1/181 , H05K2201/10636 , H05K2201/10734 , Y02P70/611
摘要： A test unit usable with a board having, an electronic component includes at least one testing point provided in each electronic component to test electric properties and a connection state of the plurality of electronic components connected to the board. The test unit usable with a PCB having the electronic component includes a testing point formed on the electronic component, thereby an enhancing high integration of the board.

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