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11. 发明授权

US07288436B2 Semiconductor chip package manufacturing method including screen printing process 失效
标题翻译：半导体芯片封装制造方法包括丝网印刷工艺
公开(公告)号：US07288436B2
公开(公告)日：2007-10-30
申请号：US11003378
申请日：2004-12-06
申请人： Sang-Young Kim , Gil-Beag Kim , Yong-Jin Jung , Jun-Soo Han , Hyun-Ik Hwang
发明人： Sang-Young Kim , Gil-Beag Kim , Yong-Jin Jung , Jun-Soo Han , Hyun-Ik Hwang
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L23/52 , H01L23/48 , H01L21/20
CPC分类号： H01L24/83 , H01L24/27 , H01L24/29 , H01L2224/2919 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2224/83192 , H01L2224/83194 , H01L2224/83855 , H01L2224/83856 , H01L2224/92147 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/30105 , H01L2924/00
摘要： A method for manufacturing a semiconductor chip package may include screen printing an adhesive on a substrate using a screen printing mask. The adhesive may be heated during a first curing process. A semiconductor chip may be attached to the adhesive on the substrate. The adhesive may be heated during a second curing process. The physical property of the adhesive may be transformed before and after a screen printing process to improve the operational performance and/or quality of the adhesive.
摘要翻译：用于制造半导体芯片封装的方法可以包括使用丝网印刷掩模在基板上丝网印刷粘合剂。粘合剂可以在第一固化过程中被加热。半导体芯片可以附着在基板上的粘合剂上。粘合剂可以在第二固化过程中被加热。粘合剂的物理性能可以在丝网印刷过程之前和之后转化，以改善粘合剂的操作性能和/或质量。

12. 发明申请

US20060102996A1 Stack package using anisotropic conductive film (ACF) and method of making same 有权
标题翻译：使用各向异性导电膜（ACF）的堆叠封装及其制作方法
公开(公告)号：US20060102996A1
公开(公告)日：2006-05-18
申请号：US11133317
申请日：2005-05-20
申请人： Jun-Soo Han , Gil-Beag Kim , Sang-Young Kim , Yong-Jin Jung , Hyun-Ik Hwang
发明人： Jun-Soo Han , Gil-Beag Kim , Sang-Young Kim , Yong-Jin Jung , Hyun-Ik Hwang
IPC分类号： H01L23/02
CPC分类号： H01L25/105 , H01L2224/06136 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2225/1023 , H01L2225/1058 , H01L2924/01079 , H01L2924/3511 , H01L2924/00 , H01L2924/00012
摘要： Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.
摘要翻译：提供了一种使用各向异性导电膜（ACF）的堆叠封装，用于在从多个CSP初始制造堆叠封装期间减少施加在芯片级封装（CSP）上的热应力，并且用于促进堆叠封装的修复和/或返工， CSP同时减少对CSP的损害的可能性。在包括使用ACF堆叠的多个CSP的堆叠封装中，每个CSP通常将包括安装在电路板上并电连接到电路板的电路板，半导体芯片，以及将半导体芯片布置在外围设备上的焊球或其它导电结构电路板区域。还提供了用于初始生产这种堆叠包装的方法以及用于这种堆叠包装的修理和返工的补充方法。

13. 发明申请

US20120043253A1 SEMICONDUCTOR PACKAGE TRANSFERRING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME 有权
标题翻译：半导体封装传输装置及其制造半导体器件的方法
公开(公告)号：US20120043253A1
公开(公告)日：2012-02-23
申请号：US13193527
申请日：2011-07-28
申请人： Hyeck-Jin Jeong , Yong-Ki Park , Yong-Jin Jung , Heul-Seog Kim
发明人： Hyeck-Jin Jeong , Yong-Ki Park , Yong-Jin Jung , Heul-Seog Kim
IPC分类号： B65D85/00
CPC分类号： H01L21/67333
摘要： A semiconductor package transferring apparatus is disclosed. The apparatus includes a tray that includes a front side and a rear side opposite the front side, the rear side including a plurality of package covering portions that each correspond to the shape of a semiconductor package and that are arranged to align with corresponding package loading portions on a front side of another tray. Each package covering portion has a surface configured to cover a semiconductor chip disposed below the surface. The apparatus further includes an anti-attachment portion disposed on the surface of one or more of the package covering portions. For each package covering portion on which an anti-attachment portion is disposed, the anti-attachment portion protrudes beyond the surface of the package covering portion.
摘要翻译：公开了半导体封装传送装置。该装置包括一个托盘，该托盘包括前侧和与前侧相对的后侧，后侧包括多个封装覆盖部分，每个封装覆盖部分对应于半导体封装的形状，并且被布置成与相应的封装装载部分在另一个托盘的正面。每个封装覆盖部分具有覆盖设置在表面下方的半导体芯片的表面。该装置还包括设置在一个或多个包装覆盖部分的表面上的防附着部分。对于其上设置防附着部分的每个包装覆盖部分，防附着部分突出超过包装覆盖部分的表面。

14. 发明申请

US20090166879A1 SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：半导体封装
公开(公告)号：US20090166879A1
公开(公告)日：2009-07-02
申请号：US12343716
申请日：2008-12-24
申请人： Kun-Ho Song , Yong-Jin Jung , Hyun-Ik Hwang
发明人： Kun-Ho Song , Yong-Jin Jung , Hyun-Ik Hwang
IPC分类号： H01L23/528
CPC分类号： H01L23/13 , H01L24/45 , H01L24/48 , H01L2224/32225 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45169 , H01L2224/4824 , H01L2224/73215 , H01L2224/92147 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/15311 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package includes a semiconductor chip, a package substrate, a first attaching member, a second attaching member, a connecting member and a molding member. The package substrate has a central region and an edge region. The first attaching member attaches the semiconductor chip to the central region of the package substrate. The second attaching member is arranged in the edge region of the package substrate. The second attaching member includes first attaching patterns extending in a first direction, and second attaching patterns extending in a second direction. The connecting member electrically connects the semiconductor chip to the package substrate. The molding member is attached to the package substrate using the second attaching member to molding the semiconductor chip.
摘要翻译：半导体封装包括半导体芯片，封装基板，第一安装构件，第二安装构件，连接构件和模制构件。封装衬底具有中心区域和边缘区域。第一附接构件将半导体芯片附接到封装基板的中心区域。第二安装构件布置在封装衬底的边缘区域中。第二附接构件包括沿第一方向延伸的第一附接图案和沿第二方向延伸的第二附接图案。连接构件将半导体芯片电连接到封装基板。使用第二安装构件将模制构件附接到封装衬底以模制半导体芯片。

15. 发明申请

US20050287708A1 Semiconductor chip package manufacturing method including screen printing process 失效
标题翻译：半导体芯片封装制造方法包括丝网印刷工艺
公开(公告)号：US20050287708A1
公开(公告)日：2005-12-29
申请号：US11003378
申请日：2004-12-06
申请人： Sang-Young Kim , Gil-Beag Kim , Yong-Jin Jung , Jun-Soo Han
发明人： Sang-Young Kim , Gil-Beag Kim , Yong-Jin Jung , Jun-Soo Han
IPC分类号： H05K3/34 , H01L21/44 , H01L21/52 , H01L21/58 , H05K3/12
CPC分类号： H01L24/83 , H01L24/27 , H01L24/29 , H01L2224/2919 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2224/83192 , H01L2224/83194 , H01L2224/83855 , H01L2224/83856 , H01L2224/92147 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/30105 , H01L2924/00
摘要： A method for manufacturing a semiconductor chip package may include screen printing an adhesive on a substrate using a screen printing mask. The adhesive may be heated during a first curing process. A semiconductor chip may be attached to the adhesive on the substrate. The adhesive may be heated during a second curing process. The physical property of the adhesive may be transformed before and after a screen printing process to improve the operational performance and/or quality of the adhesive.
摘要翻译：用于制造半导体芯片封装的方法可以包括使用丝网印刷掩模将粘合剂丝网印刷在基板上。粘合剂可以在第一固化过程中被加热。半导体芯片可以附着在基板上的粘合剂上。粘合剂可以在第二固化过程中被加热。粘合剂的物理性能可以在丝网印刷过程之前和之后转化，以改善粘合剂的操作性能和/或质量。

16. 发明申请

US20100164101A1 Ball land structure having barrier pattern 审中-公开
标题翻译：具有障碍图案的球场结构
公开(公告)号：US20100164101A1
公开(公告)日：2010-07-01
申请号：US12654477
申请日：2009-12-22
申请人： Wang-Jae Lee , Yong-Jin Jung , Jung-Hyeon Kim
发明人： Wang-Jae Lee , Yong-Jin Jung , Jung-Hyeon Kim
IPC分类号： H01L23/498 , H01R12/04
CPC分类号： H01L23/13 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01047 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K1/111 , H05K3/3452 , H05K2201/0969 , H05K2201/09781 , H05K2201/0989 , H05K2201/099 , Y02P70/611 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed is a ball land structure suitable for use with a semiconductor package. The ball land structure includes a ball land and a barrier on a core. The barrier may be configured to connect to the ball land so as to form a barrier hole between an edge of the ball land and an edge of the barrier thus exposing a portion of the core. A solder mask may be deposited on the ball land and a portion of the core exposed by the barrier hole so as to partially expose the core.
摘要翻译：公开了适用于半导体封装的球面结构。球场结构包括球场和核心上的障碍物。阻挡层可以被构造成连接到球区，以便在球台的边缘和屏障的边缘之间形成阻挡孔，从而暴露出核心的一部分。焊盘可以沉积在球台上，并且芯的一部分由阻挡孔暴露以部分地露出芯。

17. 发明申请

US20090126979A1 SEMICONDUCTOR PACKAGE CIRCUIT BOARD AND METHOD OF FORMING THE SAME 审中-公开
标题翻译：半导体封装电路板及其形成方法
公开(公告)号：US20090126979A1
公开(公告)日：2009-05-21
申请号：US12270591
申请日：2008-11-13
申请人： Ka-Eun CHAE , Wang-Jae LEE , Yong-Jin JUNG , Kun-Ho SONG
发明人： Ka-Eun CHAE , Wang-Jae LEE , Yong-Jin JUNG , Kun-Ho SONG
IPC分类号： H05K1/02 , H05K3/00 , G02B5/12
CPC分类号： H05K1/0269 , H05K3/0052 , H05K3/225 , H05K2201/09927 , H05K2201/09936 , H05K2201/10204 , Y10T29/49124
摘要： A semiconductor package circuit board has an indicator for specifying a location of a defective circuit board unit. The semiconductor package circuit board includes circuit board units arranged in an m-by-n matrix pattern. The indicator has marking areas arranged in an m-by-n matrix pattern so that the marking areas are marked in correspondence to locations of identified defective circuit board units of the circuit board units. An operator can readily put a defective mark on the indicator without any confusion. The operator or a sensor can readily recognize the defective mark. Since the indicator can be formed on the circuit board unit, the integration of the semiconductor package circuit board can be increased, and the productivity can be substantially improved. Furthermore, a pathway of the sensor can be reduced, and interferences that might occur if the sensor moves can be hindered.
摘要翻译：半导体封装电路板具有用于指定有缺陷的电路板单元的位置的指示器。半导体封装电路板包括以逐个矩阵图案排列的电路板单元。指示器具有以逐一矩阵图案排列的标记区域，使得标记区域对应于电路板单元的识别的有缺陷的电路板单元的位置被标记。操作员可以很容易地在指示器上放置有缺陷的标记，而不会有任何混淆。操作员或传感器可以容易地识别缺陷标记。由于可以在电路板单元上形成指示器，因此可以提高半导体封装电路板的集成度，并且可以显着提高生产率。此外，可以减小传感器的路径，并且如果传感器移动可能会发生干扰。

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