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    • 11. 发明申请
    • Present giving system, present giving server system, present giving program, and present giving method
    • 现在给予系统,现在给予服务器系统,给出程序和现在给予方法
    • US20050097002A1
    • 2005-05-05
    • US10951657
    • 2004-09-29
    • Shinichi Araki
    • Shinichi Araki
    • G06Q30/06G06Q50/00G06F17/60
    • G06Q30/06G06Q30/0641
    • A present giving system gives a present corresponding to a category within an estimated cost on an occasion for presents and allows a present receiver to accept or reject the present selected by a present sender. A server conducting the electronic commercial transaction requests input of information of a date, information uniquely specifying a second client device, and selection items associated with the date information from a first client device, and reminds the first client device of an the date and details of the selection items associated with the date information at a proper date and time before the input date. Then, the server device notifies the second client device of the selected items in accordance with the selected items selected by the first client, notifies the first client device of an item selected by the second client device, and allows the first client device to determine acceptance and rejection of the selected item.
    • 礼物赠送系统在呈现的场合给出与估计成本内的类别对应的礼物,并且允许现在的接收者接受或拒绝由当前发送者选择的礼物。 执行电子商业交易的服务器请求输入日期的信息,唯一地指定第二客户端设备的信息,以及来自第一客户端设备的与日期信息相关联的选择项目,并且提醒第一客户端设备的日期和细节 在输入日期之前的适当日期和时间与日期信息相关联的选择项目。 然后,服务器装置根据由第一客户端选择的所选择的项目通知第二客户端设备,向第一客户端设备通知由第二客户端设备选择的项目,并允许第一客户端设备确定接受 并拒绝所选项目。
    • 13. 发明申请
    • Method and apparatus for wafer to wafer bonding
    • 用于晶片到晶片接合的方法和装置
    • US20060163698A1
    • 2006-07-27
    • US11043748
    • 2005-01-25
    • Shinichi Araki
    • Shinichi Araki
    • H01L23/544
    • B81C3/001H01L25/50H01L2224/274H01L2225/06575
    • Inter-wafer structures are formed using semiconductor fabrication methods so as to provide precise, uniform distance between die on a bottom wafer and die on a top wafer. An inter-wafer structure layer is patterned to form one or more inter-wafer structures surrounding an active circuit area on a bottom die, or over an active circuit area on the bottom die, or both. The inter-wafer structures are formed as straight line shapes or as angled shapes. An adhesive layer is patterned to form an adhesive portion over the inter-wafer structures. The adhesive portion over the inter-wafer structures bonds a top die to the inter-wafer structures. The die include, for example, CMOS circuits and MEMS devices.
    • 使用半导体制造方法形成晶片间结构,以便在底部晶片上的管芯和顶部晶片上的管芯之间提供精确均匀的距离。 图案化晶片间结构层以形成围绕底模上的有源电路区域或底模上的有源电路区域或两者的一个或多个晶片间结构。 晶片间结构形成为直线形状或成角度的形状。 图案化粘合剂层以在晶片间结构之上形成粘合剂部分。 晶片间结构之上的粘合部分将顶模与晶片间结构结合。 芯片包括例如CMOS电路和MEMS器件。
    • 14. 发明授权
    • Method of manufacturing semiconductor devices
    • 制造半导体器件的方法
    • US5356825A
    • 1994-10-18
    • US752592
    • 1991-09-26
    • Hiroki HozumiShinichi Araki
    • Hiroki HozumiShinichi Araki
    • H01L27/04H01L21/331H01L21/822H01L21/8222H01L27/06H01L29/73H01L29/732H01L21/70
    • H01L27/0688Y10S148/136Y10S438/909
    • A resistor (45) of semiconductor material is formed on an insulating layer (42), then a silicon nitride film (46) is deposited on the entire surface including the resistor (45), and a silicon dioxide film (47) is sequentially deposited thereon, and thereafter electrodes (49A) and (49B)of the resistor (45) are formed, thereby preventing the fragility of the insulating layer (51) at step portions of the resistor (45), preventing the breakage of the electrodes and interconnections, and improving a withstand voltage between the resistor (45) and the interconnections crossing over it to thereby improve yield of a semiconductor device. An impurity (64) is introduced into a semiconductor film (63) to be a resistor by the ion implantation technique to thereby change the state of the film into an amorphous state, semiconductor film (63a) is heated in atmosphere including hydrogen compound gas and/or hydrogen gas, and then heated to activate it to thereby form a resistor (67), so that a resistance value of the resistor (67) at a region where the impurity is highly dosed can be decreased progressively.
    • PCT No.PCT / JP90 / 01698 Sec。 371日期1991年9月26日 102(e)1991年9月26日PCT PCT 1990年12月26日PCT公布。 出版物WO91 / 10262 日期:1991年7月11日。在绝缘层(42)上形成半导体材料的电阻器(45),然后在包括电阻器(45)的整个表面上沉积氮化硅膜(46),并且将二氧化硅 薄膜(47)依次沉积在其上,然后形成电阻器(45)的电极(49A)和(49B),从而防止在电阻器(45)的台阶处绝缘层(51)的脆弱性,从而防止 电极和互连的断裂,以及改善电阻器(45)和与其交叉的互连之间的耐受电压,从而提高半导体器件的产量。 通过离子注入技术将杂质(64)引入到半导体膜(63)中作为电阻器,从而将膜的状态改变为非晶态,半导体膜(63a)在包含氢化合物气体的气氛中被加热, /或氢气,然后加热以使其激活,从而形成电阻器(67),使得电阻器(67)在杂质浓度高的区域的电阻值可以逐渐降低。
    • 16. 发明授权
    • Fabrication of MEMS zoom lens structure
    • 制造MEMS变焦镜头结构
    • US07242541B2
    • 2007-07-10
    • US11072068
    • 2005-03-03
    • Shinichi Araki
    • Shinichi Araki
    • G02B7/02
    • G02B26/0875G02B7/102G02B26/0841
    • A method for fabricating a MEMS zoom lens device. The device is formed substantially on a silicon substrate and includes control circuitry formed on the substrate, multiple actuators having charge areas for creating electrostatic fields, a flexible support for flexibly coupling a lens to the substrate, an electrostatic layer coupled to the lens. The charge areas act in response to the control circuitry to apply an electrostatic force to the electrostatic layer to move the lens with respect to the substrate and optical sensors or detectors. In a preferred embodiment, the flexible support is formed in a serpentine shape from silicon nitride. A stop support is formed to underlie the flexible support to prevent damage to the flexible support in a rest (i.e., non-zoomed) position.
    • 一种制造MEMS变焦透镜装置的方法。 该器件基本上形成在硅衬底上,并且包括形成在衬底上的控制电路,具有用于产生静电场的电荷区域的多个致动器,用于将透镜柔性耦合到衬底的柔性支撑件,耦合到透镜的静电层。 充电区域响应于控制电路而起作用以向静电层施加静电力以使透镜相对于基板和光学传感器或检测器移动。 在优选实施例中,柔性支撑件由氮化硅形成为蛇形。 形成止动支撑件作为柔性支撑件的下面,以防止在休息(即非放大)位置中损坏柔性支撑件。
    • 17. 发明申请
    • System method and program for purchasing merchandise
    • 用于购买商品的系统方法和程序
    • US20050258239A1
    • 2005-11-24
    • US10951591
    • 2004-09-29
    • Shinichi Araki
    • Shinichi Araki
    • G06Q10/00G06K15/00G06Q20/00G06Q20/32G06Q30/06G06Q50/00
    • G06Q20/32G06Q20/12G06Q20/325G06Q30/06
    • The present invention provides a system, method and program for purchasing merchandise which one desires to purchase anonymously from a mobile terminal such as a mobile phone, via a campaign, and without using troublesome purchase methods. A user ID stored in a user information storage can be referred to in accordance with access by the mobile phone. In addition, the merchandise code of a purchase target can be specified by referring to a master information storage, and campaign money provided by others can be accepted. A campaign status storage stores content accepted by the campaign, the merchandise costs and the amount of money that needs to be collected. A server specifies the merchandise code of the desired merchandise from the campaign status storage, updates the amount of money that needs to be collected in accordance with the amount of money collected in the campaign, and purchases the merchandise when the amount of money collected reaches the cost of the merchandise.
    • 本发明提供一种用于购买希望通过移动电话等移动终端匿名购买的商品的系统,方法和程序,并且不使用麻烦的购买方法。 存储在用户信息存储器中的用户ID可以根据移动电话的访问来参考。 此外,可以通过参照主信息存储来指定购买目标的商品代码,并且可以接受由他人提供的活动资金。 活动状态存储存储广告活动接受的内容,商品成本和需要收集的金额。 服务器从活动状态存储器中指定所需商品的商品代码,根据活动中收集的金额来更新需要收集的金额,并且当收到的金额达到 商品成本。
    • 20. 发明授权
    • Microelectromechanical speaker
    • 微机电扬声器
    • US07570775B2
    • 2009-08-04
    • US11072048
    • 2005-03-03
    • Shinichi Araki
    • Shinichi Araki
    • H04R25/00
    • H04R23/00
    • Disclosed is a microelectromechanical (MEM) speaker device. In one embodiment, the MEM speaker device includes: (i) a base layer; (ii) a device controller; (iii) a coil layer connected to magnetic material; (iv) an oscillator connected to a spring and the magnetic material; (v) a spring between the oscillator and a support layer; (vi) a protective layer over the oscillator; and (vii) a support post connected to the oscillator, the base layer, the protective layer, and the coil layer. Embodiments of the invention can provide a MEM speaker device where control of the oscillator by electromagnetic force produces sound energy.
    • 公开了一种微机电(MEM)扬声器装置。 在一个实施例中,MEM扬声器装置包括:(i)基底层; (ii)设备控制器; (iii)连接到磁性材料的线圈层; (iv)连接到弹簧和磁性材料的振荡器; (v)振荡器和支撑层之间的弹簧; (vi)振荡器上的保护层; 和(vii)连接到振荡器,基极层,保护层和线圈层的支撑柱。 本发明的实施例可以提供一种MEM扬声器装置,其中通过电磁力控制振荡器产生声能。