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    • 16. 发明授权
    • Process for preparing polyamideimide resins by direct polymerization
    • 通过直接聚合制备聚酰胺酰亚胺树脂的方法
    • US5955568A
    • 1999-09-21
    • US956923
    • 1997-10-23
    • Kil-Yeong ChoiDong-Hack SuhMi-Hie YiYoung-Taik HongMoon-Young Jin
    • Kil-Yeong ChoiDong-Hack SuhMi-Hie YiYoung-Taik HongMoon-Young Jin
    • C08G73/14C08G69/28
    • C08G73/14
    • The disclosure describes a process for preparing a polyamideimide resin having high molecular weight in a simple manner wherein major problems of the prior processes such as low heat resistance and low melt flowability are improved. The process comprises condensation of an aromatic tricarboxylic acid anhydride and an aromatic diamine in a polar solvent, subjecting the resulting diimidedicarboxylic acid to acyl halogenating agent treatment to give an intermediate having good reactivity at low temperature, and then subjecting the latter to direct polymerization by using diamine as a nucleophilic agent to give a polyamideimide resin having high molecular weight. The polyamideimide resin prepared by the present invention can be used as major heat resistant structural material in advanced industries and as paint, sheet, adhesives, sliding material, fiber and film having heat resistance.
    • 本公开内容描述了以简单的方式制备具有高分子量的聚酰胺酰亚胺树脂的方法,其中诸如低耐热性和低熔融流动性的现有方法的主要问题得到改善。 该方法包括在极性溶剂中将芳族三羧酸酐和芳族二胺缩合,将所得二酰亚胺二羧酸进行酰卤处理,得到在低温下具有良好反应性的中间体,然后使用后者通过使用 二胺作为亲核剂,得到具有高分子量的聚酰胺酰亚胺树脂。 本发明制备的聚酰胺酰亚胺树脂可用作先进工业中的主要耐热结构材料,可用作具有耐热性的油漆,片材,粘合剂,滑动材料,纤维和薄膜。