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    • 16. 发明授权
    • Spill resistant tiltable paint pan
    • 防溅可倾斜油漆盘
    • US08167164B2
    • 2012-05-01
    • US12806713
    • 2010-08-19
    • Mark Peterson
    • Mark Peterson
    • B05C21/00
    • B44D3/126
    • A paint pan has a generally rectangular box shape and an inclined rub plate extends down into the pan from a front wall. A partial roof extends from the top edge of the back wall, and a partial opening is formed generally above the rub plate and between the top edge of the front wall and the partial roof. When the pan is in a “use” position, paint may be poured into the pan through the partial open roof and it will flow to the floor. The pan is dimensioned so that a roller brush may be inserted through the partial opening to the floor of the pan beneath the partial roof. A handle is provided on the front wall and when the pan is lifted by the handle, paint flows into a storage volume defined in part by the floor, a left wall, a right wall, the back wall and partial roof.
    • 油漆盘具有大致矩形的箱形,倾斜的摩擦板从前壁向下延伸到盘中。 部分屋顶从后壁的顶部边缘延伸,并且部分开口通常形成在摩擦板的上方,并且在前壁的顶部边缘和部分屋顶之间。 当锅处于“使用”位置时,油漆可能会通过部分敞开的屋顶倒入锅中,并将流到地板上。 锅的尺寸被设计成使得辊刷可以通过部分开口插入到部分屋顶下方的锅底部。 在前壁上设置有手柄,当手柄由手柄抬起时,油漆流入由地板,左墙壁,右壁,后壁和部分屋顶部分限定的存储容积。
    • 20. 发明授权
    • Integrated transceiver with lightpipe coupler
    • 集成收发器与光管耦合器
    • US07961992B2
    • 2011-06-14
    • US12483699
    • 2009-06-12
    • Peter De DobbelaereThierry PinguetMark PetersonMark Harrison
    • Peter De DobbelaereThierry PinguetMark PetersonMark Harrison
    • G02B6/12G02B6/26H05K1/18
    • H04B10/40G02B6/12004G02B6/3885G02B6/4214G02B6/4246G02B6/4295G02B2006/12121
    • A transceiver on a CMOS chip including optical and optoelectronic devices, and electronic circuitry may be operable to communicate optical signals between the CMOS chip and optical fibers coupled to the CMOS chip via a semiconductor laser and one or more photodetectors. The optical and optoelectronic devices may include waveguides, modulators, multiplexers, switches, and couplers. The photodetector may be integrated in the CMOS chip. The photodetector and the semiconductor laser may be mounted on the CMOS chip. The optical signals may be communicated out of and in to a top surface of the CMOS chip. A transceiver on a CMOS chip including optical and optoelectronic devices, and electronic circuitry, may be operable to communicate optical signals between the CMOS chip and optical fibers coupled to the CMOS chip via grating couplers. The optical signals may be communicated out of and in to a top surface of the CMOS chip.
    • 包括光学和光电子器件的CMOS芯片上的收发器和电子电路可以用于在CMOS芯片和经由半导体激光器和一个或多个光电探测器耦合到CMOS芯片的光纤之间传送光信号。 光学和光电器件可以包括波导,调制器,多路复用器,开关和耦合器。 光电检测器可以集成在CMOS芯片中。 光检测器和半导体激光器可以安装在CMOS芯片上。 光信号可以在CMOS芯片的顶表面之外传送出去。 包括光学和光电子器件以及电子电路的CMOS芯片上的收发器可以用于在CMOS芯片和通过光栅耦合器耦合到CMOS芯片的光纤之间传送光信号。 光信号可以在CMOS芯片的顶表面之外传送出去。