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11. 发明专利

TWI469993B 修復軟骨損傷之外科移植物有权
简体标题：修复软骨损伤之外科移植物
公开(公告)号：TWI469993B
公开(公告)日：2015-01-21
申请号：TW099119088
申请日：2010-06-11
申请人：劉華昌 , LIU, HWA CHANG , 林峰輝 , LIN, FENG HUEI , 李幸懋 , LEE, SHING MOU , 顏君哲 , YEN, CHUN CHE
发明人：劉華昌 , LIU, HWA CHANG , 林峰輝 , LIN, FENG HUEI , 李幸懋 , LEE, SHING MOU , 顏君哲 , YEN, CHUN CHE
IPC分类号： C07K14/78 , C12N5/077 , C12N5/0775
CPC分类号： A61L27/3817 , A61L27/24 , A61L27/3852

12. 发明申请

WO0146684A9 IN-SITU METALIZATION MONITORING USING EDDY CURRENT MEASUREMENTS AND OPTICAL MEASUREMENTS 审中-公开
标题翻译：使用EDDY电流测量和光学测量的现场金属化监测
公开(公告)号：WO0146684A9
公开(公告)日：2002-05-23
申请号：PCT/US0035358
申请日：2000-12-22
申请人： KLA TENCOR CORP , LEHMAN KURT R , LEE SHING M , JOHNSON WALT , FIELDEN JOHN , ZHAO GUOHENG , NIKOONAHAD MEHRDAD
发明人： LEHMAN KURT R , LEE SHING M , JOHNSON WALT , FIELDEN JOHN , ZHAO GUOHENG , NIKOONAHAD MEHRDAD
IPC分类号： G01B7/06 , B24B37/013 , B24B49/10 , G01B7/00 , G01B11/06 , G01N27/72
CPC分类号： B24B37/013 , B24B49/105 , G01N27/72
摘要： Disclosed is a method of obtaining information in-situ regarding a film of a sample using an eddy probe during a process for removing the film. The eddy probe has at least one sensing coil. An AC voltage is applied to the sensing coil(s) of the eddy probe. One or more first signals are measured in the sensing coil(s) of the eddy probe when the sensing coil(s) are positioned proximate the film of the sample. One or more second signals are measured in the sensing coil(s) of the eddy probe when the sensing coil(s) are positioned proximate to a reference material having a fixed composition and/or distance from the sensing coil. The first signals are calibrated based on the second signals so that undesired gain and/or phase changes within the first signals are corrected. A property value of the film is determined based on the calibrated first signals. An apparatus for performing the above described method is also disclosed. Additionally, a chemical mechanical polishing (CMP) system for polishing a sample with a polishing agent and monitoring the sample is disclosed. The CMP system includes a polishing table, a sample carrier arranged to hold the sample over the polishing table, and an eddy probe.
摘要翻译：公开了一种在除去膜的过程中使用涡流探针在原位获取样品的膜的方法。涡流探头具有至少一个感测线圈。交流电压被施加到涡流探头的感测线圈上。当感测线圈靠近样品的膜定位时，在涡流探针的感测线圈中测量一个或多个第一信号。当感测线圈靠近具有与感测线圈的固定成分和/或距离的参考材料定位时，在涡流探针的感测线圈中测量一个或多个第二信号。第一信号基于第二信号进行校准，从而校正第一信号内的不期望的增益和/或相位变化。基于校准的第一信号确定胶片的属性值。还公开了一种用于执行上述方法的装置。此外，公开了一种用抛光剂抛光样品并监测样品的化学机械抛光（CMP）系统。 CMP系统包括抛光台，布置成将样品保持在抛光台上的样品载体和涡流探针。

13. 发明申请

WO2005114148A3 SYSTEMS AND METHODS FOR MEASUREMENT OR ANALYSIS OF A SPECIMEN 审中-公开
公开(公告)号：WO2005114148A3
公开(公告)日：2005-12-01
申请号：PCT/US2005/016843
申请日：2005-05-13
申请人： KLA-TENCOR TECHNOLOGIES CORP. , FIELDEN, John , JANIK, Gary , LEE, Shing , ZHAO, Qiang , KAACK, Torsten , YOO, Sungchul , TAN, Zhengquan
发明人： FIELDEN, John , JANIK, Gary , LEE, Shing , ZHAO, Qiang , KAACK, Torsten , YOO, Sungchul , TAN, Zhengquan
IPC分类号： G01J4/00
摘要： Various systems for measurement or analysis of a specimen are provided. One system includes a first optical subsystem, which is disposed within a purged environment (224). The purged environment (224) may be provided by a differential purging subsystem. The first optical subsystem performs measurements using vacuum ultraviolet light. This system also includes a second optical subsystem, which is disposed within a non-purged environment. The second optical subsystem performs measurements using non-vacuum ultraviolet light. Another system includes two or more optical subsystems configured to perform measurements of a specimen using vacuum ultraviolet light. The system also includes a purging subsystem configured to maintain a purged environment around the two or more optical subsystems. The purging subsystem is also configured to maintain the same level of purging in both optical subsystems. Some systems also include a cleaning subsystem configured to remove contaminants from a portion of a specimen prior to measurements at vacuum ultraviolet wavelengths.

14. 外观设计

USD473130S1 Cable clamp with grounding connection 失效
标题翻译：电缆夹具接地连接
公开(公告)号：USD473130S1
公开(公告)日：2003-04-15
申请号：US29147298
申请日：2001-08-28
申请人： Lee Shing Leung
设计人： Lee Shing Leung

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