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11. 发明申请

WO2012106720A1 HIGH DENSITY METAL-INSULATOR-METAL TRENCH CAPACITOR WITH CONCAVE SURFACES 审中-公开
标题翻译：高密度金属绝缘体 - 金属电镀电容器
公开(公告)号：WO2012106720A1
公开(公告)日：2012-08-09
申请号：PCT/US2012/023999
申请日：2012-02-06
申请人： QUALCOMM INCORPORATED , LAN, Je-Hsiung , NOWAK, Matthew, Michael , GOUSEV, Evgeni, P. , KIM, Jonghae , CHUI, Clarence
发明人： LAN, Je-Hsiung , NOWAK, Matthew, Michael , GOUSEV, Evgeni, P. , KIM, Jonghae , CHUI, Clarence
IPC分类号： H01L21/02 , H01L29/94 , H01G4/012 , H01L23/522 , H01L23/64
CPC分类号： H01L28/82 , H01G4/012 , H01G4/10 , H01L23/5223 , H01L23/642 , H01L28/87 , H01L29/945 , H01L2224/16225 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311
摘要： Higher capacitance density is achieved by increasing a surface area of a capacitor. A larger surface area may be obtained by forming isotropic ball shapes (a concave surface) in the trenches on the semiconductor die. The concave surfaces are fabricated by depositing bilayers of amorphous-silicon and silicon oxide. Openings are patterned in the silicon oxide hard mask for trenches. The openings are transferred to the amorphous-silicon layers through isotropic etching to form concave surfaces. Conducting, insulating, and conducting layers are deposited on the concave surfaces of the trenches by atomic layer deposition.
摘要翻译：通过增加电容器的表面积来实现更高的电容密度。可以通过在半导体管芯上的沟槽中形成各向同性球形（凹面）来获得更大的表面积。通过沉积非晶硅和氧化硅的双层来制造凹面。在用于沟槽的氧化硅硬掩模中图案化开口。通过各向同性蚀刻将开口转移到非晶硅层以形成凹面。导电，绝缘和导电层通过原子层沉积沉积在沟槽的凹面上。

12. 发明申请

WO2010008985A3 ENCAPSULATION METHODS FOR INTERFERO-METRIC MODULATOR AND MEMS DEVICES 审中-公开
公开(公告)号：WO2010008985A3
公开(公告)日：2010-01-21
申请号：PCT/US2009/049964
申请日：2009-07-08
申请人： QUALCOMM MEMS TECHNOLOGIES, INC. , LAN, Je-Hsiung
发明人： LAN, Je-Hsiung
IPC分类号： B81C1/00
摘要： Methods and devices used for the encapsulation of MEMS devices, such as an interferometric modulator, are disclosed. Encapsulation is provided to MEMS devices to protect the devices from such environmental hazards as moisture and mechanical shock. In addition to the encapsulation layer (300) providing protection from environmental hazards, the encapsulation layer (300) is additionally planarized so as to function as a substrate for additional circuit elements formed above the encapsulation layer (300).

13. 发明申请

WO2006060519A3 CIRCUITS INCLUDING SWITCHES FOR ELECTRONIC DEVICES AND METHODS OF USING THE ELECTRONIC DEVICES 审中-公开
公开(公告)号：WO2006060519A3
公开(公告)日：2006-06-08
申请号：PCT/US2005/043386
申请日：2005-11-30
申请人： E.I. DUPONT DE NEMOURS AND COMPANY , LAN, Je-hsiung , YU, Gang
发明人： LAN, Je-hsiung , YU, Gang
IPC分类号： G09G3/32
摘要： A circuit for an electronic device includes a select unit, a data holder unit, an electronic component, a transistor, and a switch. The control terminal of the switch is coupled to a first select line, the first terminal of the switch is connected to a first electrode of the electronic component, and the second terminal of the switch is connected to a reference voltage line. A method of using an electronic component that includes such a circuit includes writing data to a pixel and driving the electronic component. The select unit and the switch are configured to turn on at substantially a same time, and the select unit and the switch are configured to turn off at substantially a same time during writing and driving, respectively.

14. 发明申请

WO2012087942A3 METHOD OF FABRICATION AND RESULTANT ENCAPSULATED ELECTROMECHANICAL DEVICE 审中-公开
标题翻译：制造和结果封装机电装置的方法
公开(公告)号：WO2012087942A3
公开(公告)日：2012-10-26
申请号：PCT/US2011065864
申请日：2011-12-19
申请人： QUALCOMM MEMS TECHNOLOGIES INC , HE RIHUI , YAN XIAOMING , LAN JE-HSIUNG
发明人： HE RIHUI , YAN XIAOMING , LAN JE-HSIUNG
IPC分类号： B81C1/00
CPC分类号： B81C1/00333 , B81C2203/0136 , B81C2203/0145
摘要： This disclosure provides systems, methods, and apparatus for encapsulated electromechanical systems. In one aspect, a release path includes a release hole through an encapsulation layer. The release path exposes a portion of a first sacrificial layer that extends beyond a second sacrificial layer in a horizontal direction. This allows the first sacrificial layer and the second sacrificial layer to later be etched through the release path. The corresponding electromechanical system device includes a shell layer encapsulating a mechanical layer. A conformal layer seals a release hole that extends through a shell layer. A portion of the conformal layer blocks the opening of the release passage within the release hole. The release passage has substantially the same vertical height as a gap that defines the spacing between the mechanical layer and a substrate.
摘要翻译：本公开提供了用于封装机电系统的系统，方法和设备。在一个方面，释放路径包括穿过封装层的释放孔。释放路径暴露沿水平方向延伸超出第二牺牲层的第一牺牲层的一部分。这允许第一牺牲层和第二牺牲层稍后通过释放路径被蚀刻。相应的机电系统装置包括封装机械层的壳层。保形层密封延伸穿过壳层的释放孔。共形层的一部分阻塞释放孔内释放通道的打开。释放通道具有与限定机械层和衬底之间的间隔的间隙基本相同的垂直高度。

15. 发明申请

WO2011075366A1 TWO-TERMINAL VARIABLE CAPACITANCE MEMS DEVICE 审中-公开
标题翻译：双端可变电容MEMS器件
公开(公告)号：WO2011075366A1
公开(公告)日：2011-06-23
申请号：PCT/US2010/059512
申请日：2010-12-08
申请人： QUALCOMM MEMS TECHNOLOGIES, INC. , LAN, Je-Hsiung , GOUSEV, Evgeni , OZAKI, Ernest, Tadashi
发明人： LAN, Je-Hsiung , GOUSEV, Evgeni , OZAKI, Ernest, Tadashi
IPC分类号： H01G5/16 , G02B26/00 , G09G3/34
CPC分类号： H01G5/16 , G02B26/001
摘要： A two-terminal, variable capacitance device is described that is constructed by connecting multiple MEMS devices having different actuation or "pull in" voltages in parallel.
摘要翻译：描述了通过并联具有不同驱动或“拉入”电压的多个MEMS器件构成的两端可变电容器件。

16. 发明申请

WO2010008985A2 ENCAPSULATION METHODS FOR INTERFERO-METRIC MODULATOR AND MEMS DEVICES 审中-公开
标题翻译：干涉尺度调制器和MEMS器件的封装方法
公开(公告)号：WO2010008985A2
公开(公告)日：2010-01-21
申请号：PCT/US2009049964
申请日：2009-07-08
申请人： QUALCOMM MEMS TECHNOLOGIES INC , LAN JE-HSIUNG
发明人： LAN JE-HSIUNG
IPC分类号： B81C1/00
CPC分类号： B81C1/0023 , B81B2201/047 , B81B2207/095 , B81C2203/0136 , B81C2203/0145
摘要： Methods and devices used for the encapsulation of MEMS devices, such as an interferometric modulator, are disclosed. Encapsulation is provided to MEMS devices to protect the devices from such environmental hazards as moisture and mechanical shock. In addition to the encapsulation layer (300) providing protection from environmental hazards, the encapsulation layer (300) is additionally planarized so as to function as a substrate for additional circuit elements formed above the encapsulation layer (300).
摘要翻译：公开了用于封装诸如干涉式调制器之类的MEMS器件的方法和器件。为MEMS器件提供封装以保护器件免受湿气和机械冲击等环境危害。除了提供免受环境危害的封装层（300）之外，封装层（300）被附加地平坦化，从而用作形成在封装层（300）上方的附加电路元件的衬底。

17. 发明申请

WO2006060519A2 CIRCUITS INCLUDING SWITCHES FOR ELECTRONIC DEVICES AND METHODS OF USING THE ELECTRONIC DEVICES 审中-公开
标题翻译：包括电子设备开关的电路和使用电子设备的方法
公开(公告)号：WO2006060519A2
公开(公告)日：2006-06-08
申请号：PCT/US2005043386
申请日：2005-11-30
申请人： DU PONT , LAN JE-HSIUNG , YU GANG
发明人： LAN JE-HSIUNG , YU GANG
IPC分类号： G09G3/32
CPC分类号： G09G3/3233 , G09G3/2022 , G09G2300/0426 , G09G2300/0819 , G09G2300/0842 , G09G2300/0861 , G09G2320/043 , G09G2330/021
摘要： A circuit for an electronic device includes a select unit, a data holder unit, an electronic component, a transistor, and a switch. The control terminal of the switch is coupled to a first select line, the first terminal of the switch is connected to a first electrode of the electronic component, and the second terminal of the switch is connected to a reference voltage line. A method of using an electronic component that includes such a circuit includes writing data to a pixel and driving the electronic component. The select unit and the switch are configured to turn on at substantially a same time, and the select unit and the switch are configured to turn off at substantially a same time during writing and driving, respectively.
摘要翻译：用于电子设备的电路包括选择单元，数据保持单元，电子组件，晶体管和开关。开关的控制端连接至第一选择线，开关的第一端连接电子元件的第一电极，开关的第二端连接参考电压线。使用包括这种电路的电子部件的方法包括将数据写入像素并驱动电子部件。选择单元和开关被配置为基本上同时开启，并且选择单元和开关被配置为分别在写入和驱动期间基本上同时关闭。

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