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11. 发明授权

US07423335B2 Sensor module package structure and method of the same 有权
标题翻译：传感器模块的封装结构和方法相同
公开(公告)号：US07423335B2
公开(公告)日：2008-09-09
申请号：US11954087
申请日：2007-12-11
申请人： Wen-Kun Yang , Jui-Hsien Chang
发明人： Wen-Kun Yang , Jui-Hsien Chang
IPC分类号： H01L23/02 , H01L29/22 , H01L29/227 , H01L33/00 , H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L27/14618 , H01L24/24 , H01L27/14634 , H01L27/14683 , H01L2224/04105 , H01L2224/12105 , H01L2224/32225 , H01L2224/73267 , H01L2924/014 , H01L2924/14 , H04N5/2251 , H04N5/2257 , H01L2924/00
摘要： An image sensor multi-chips package structure, includes a first package including a first chip with image sensors having first bonding pads and micro lens on a first active surface, a first die receiving window and first conductive inter-connecting through holes penetrated from a first upper contact pads on a first upper surface of the first chip to a first lower contact pads on a first lower surface of the first chip, wherein a first upper build up layer on the active surface of the first chip coupling from the first bonding pads to the first upper contact pads; a second package comprising a second chip having second bonding pads on a second active surface, a second die receiving window and second conductive inter-connecting through holes penetrated from a second upper contact pads of a second upper surface of the second chip to a second lower contact pads on a second lower surface of the second chip, wherein a second upper build up layers on the second upper surface for coupling from the second bonding pads to the second upper contact pads, and second lower build up layers under the second lower surface for coupling from the second lower contact pads to terminal pads located under the second lower surface; and inter-connecting structures coupled between the first lower contact pads to the second upper contact pads.
摘要翻译：一种图像传感器多芯片封装结构，包括第一封装，其包括具有第一焊盘和第一有源表面上的微透镜的图像传感器的第一芯片，第一裸片接收窗和第一导电互连通孔，所述第一芯片的第一上表面上的上接触焊盘到所述第一芯片的第一下表面上的第一下接触焊盘，其中所述第一芯片的所述有源表面上的第一上层叠层从所述第一焊盘耦合到第一个上接触垫; 第二封装，包括具有在第二有源表面上的第二接合焊盘的第二芯片，第二管芯接收窗口和从第二芯片的第二上表面的第二上接触焊盘穿入的第二导电互连通孔，所述第二芯片的第二下表面上的接触焊盘，其中在所述第二上表面上的用于从所述第二接合焊盘耦合到所述第二上触点焊盘的第二上层叠层，以及在所述第二下表面下方的第二下堆积层，从所述第二下接触焊盘耦合到位于所述第二下表面下方的端子焊盘; 以及耦合在所述第一下接触焊盘与所述第二上接触焊盘之间的连接结构。

12. 发明申请

US20080157398A1 Semiconductor device package having pseudo chips 审中-公开
标题翻译：具有伪芯片的半导体器件封装
公开(公告)号：US20080157398A1
公开(公告)日：2008-07-03
申请号：US11819193
申请日：2007-06-26
申请人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee , Wen-Ping Yang
发明人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee , Wen-Ping Yang
IPC分类号： H01L23/48
CPC分类号： H01L25/50 , H01L21/6835 , H01L23/3128 , H01L23/49827 , H01L23/5389 , H01L24/06 , H01L24/24 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/82 , H01L24/96 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2221/68345 , H01L2224/0401 , H01L2224/05553 , H01L2224/05599 , H01L2224/24 , H01L2224/24137 , H01L2224/24227 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48157 , H01L2224/48227 , H01L2224/484 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/19107 , H01L2224/45099 , H01L2924/00 , H01L2924/01026 , H01L2924/00012
摘要： The present invention provides a semiconductor device package having pseudo chips structure comprising a first substrate with die receiving through holes formed thereon; a first die having first bonding pads and a second die having second bonding pads disposed within the die receiving through holes, respectively; an adhesion material formed in the gap between the first and second die and sidewalls of the die receiving though holes of the first substrate; redistribution lines formed to couple the first contact pads formed on the first substrate to the first bonding pads and the second bonding pads, respectively; and a protection layer formed on the redistribution lines, the first die, the second die and the first substrate.
摘要翻译：本发明提供了一种具有伪芯片结构的半导体器件封装，包括：第一衬底，其具有形成在其上的通孔; 具有第一接合焊盘的第一管芯和分别设置在所述管芯内的第二接合焊盘的第二管芯，形成在所述第一和第二管芯之间的间隙中的粘合材料和所述第一基板的贯穿孔的所述管芯的侧壁; 再分配线被形成为分别将形成在第一基板上的第一接触焊盘耦合到第一接合焊盘和第二接合焊盘; 以及形成在再分配线上的保护层，第一管芯，第二管芯和第一基板。

13. 发明申请

US20080157312A1 Semiconductor image device package with die receiving through-hole and method of the same 有权
标题翻译：具有裸片接收通孔的半导体图像器件封装及其方法
公开(公告)号：US20080157312A1
公开(公告)日：2008-07-03
申请号：US11647217
申请日：2006-12-29
申请人： Wen-Kun Yang , Jui-Hsien Chang , Tung-Chuan Wang
发明人： Wen-Kun Yang , Jui-Hsien Chang , Tung-Chuan Wang
IPC分类号： H01L23/02
CPC分类号： H01L27/14618 , H01L24/24 , H01L24/82 , H01L24/97 , H01L27/14627 , H01L27/14685 , H01L2224/04105 , H01L2224/12105 , H01L2224/24227 , H01L2924/01019 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/00
摘要： The present invention discloses a structure of package comprising: a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad; a die having micro lens area disposed within the die receiving through hole; a transparent cover covers the micro lens area; a surrounding material formed under the die and filled in the gap between the die and sidewall of the die receiving though hole; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the first contact pad; a protection layer formed over the RDL; and a second contact pad formed at the lower surface of the substrate and under the connecting through hole structure.
摘要翻译：本发明公开了一种包装结构，包括：具有模具接收通孔的基板，连接通孔结构和第一接触垫; 具有设置在模具接收通孔内的微透镜区域的模具; 透明盖覆盖微透镜区域; 形成在模具下方并填充在模具和模具的侧壁之间的间隙中的周围材料; 形成在所述管芯和所述基板上的电介质层; 形成在电介质层上并耦合到第一接触焊盘的再分布层（RDL）; 形成在RDL上的保护层; 以及第二接触焊盘，其形成在所述基板的下表面和所述连接通孔结构的下方。

14. 发明授权

US08606987B2 Data writing method for flash memory and controller using the same 有权
标题翻译： Flash存储器的数据写入方法及使用其的控制器
公开(公告)号：US08606987B2
公开(公告)日：2013-12-10
申请号：US12052348
申请日：2008-03-20
申请人： Jiunn-Yeong Yang , Jui-Hsien Chang , Chien-Hua Chu , Jian-Yo Su , Chih-Kang Yeh
发明人： Jiunn-Yeong Yang , Jui-Hsien Chang , Chien-Hua Chu , Jian-Yo Su , Chih-Kang Yeh
IPC分类号： G06F12/00 , G06F13/00 , G06F13/28
CPC分类号： G06F12/0246 , G06F2212/7203
摘要： A data writing method for a flash memory is provided. The data writing method includes: dividing a new data into at lease one sub-data by the size of a writing unit; selecting one of a plurality of spare blocks from the flash memory as a substitute block for substituting a data block, wherein the new data is to be written into the data block; sequentially writing the sub-data having the size of the writing unit into the substitute block in the writing unit; and storing the sub-data not having the size of the writing unit into a temporary area. The writing efficiency of the flash memory can be improved by temporarily storing the sub-data not having the size of the writing unit into the temporary area and then writing the sub-data not having the size of the writing unit with subsequent data into the substitute block.
摘要翻译：提供了一种用于闪速存储器的数据写入方法。数据写入方法包括：按照写入单元的大小将新数据划分为至少一个子数据; 从闪存中选择多个备用块中的一个作为用于替换数据块的替代块，其中新数据将被写入数据块; 将具有写入单元的大小的子数据顺序地写入写入单元中的替代块; 并将不具有写入单元大小的子数据存储在临时区域中。通过将不具有写入单元的大小的子数据临时存储到临时区域中，然后将不具有后续数据的具有写入单元的大小的子数据写入替代物，可以提高闪速存储器的写入效率块。

15. 发明授权

US07863105B2 Image sensor package and forming method of the same 有权
标题翻译：图像传感器封装及其形成方法相同
公开(公告)号：US07863105B2
公开(公告)日：2011-01-04
申请号：US12117087
申请日：2008-05-08
申请人： Wen-Kun Yang , Jui-Hsien Chang
发明人： Wen-Kun Yang , Jui-Hsien Chang
IPC分类号： H01L21/44
CPC分类号： H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： An image sensor package comprises a substrate, a chip mounted over the substrate. A molding material is formed surrounding the chip to expose a micron lens area, wherein the molding material includes via structure passing there through. A protection layer is formed on the micro lens area to prevent the micro lens. A redistributed conductive layer is formed over the molding material to connect to a pad of the chip. Metal pads are formed on via structure as connecting points with PCB. A cover layer is formed over the substrate to isolate the metal pads.
摘要翻译：图像传感器封装包括衬底，安装在衬底上的芯片。围绕芯片形成模制材料以暴露微米透镜区域，其中模制材料包括通过其的通孔结构。在微透镜区域上形成保护层以防止微透镜。在模制材料上形成重新分布的导电层以连接到芯片的焊盘。金属焊盘形成在通孔结构上作为与PCB的连接点。覆盖层形成在衬底上以隔离金属焊盘。

16. 发明申请

US20100042774A1 BLOCK MANAGEMENT METHOD FOR FLASH MEMORY, AND STORAGE SYSTEM AND CONTROLLER USING THE SAME 审中-公开
标题翻译：闪存存储器的块管理方法，存储系统和使用该存储器的控制器
公开(公告)号：US20100042774A1
公开(公告)日：2010-02-18
申请号：US12265429
申请日：2008-11-05
申请人： Jiunn-Yeong Yang , Chien-Hua Chu , Chih-Kang Yeh , Kuang-Tung Fang , Jui-Hsien Chang
发明人： Jiunn-Yeong Yang , Chien-Hua Chu , Chih-Kang Yeh , Kuang-Tung Fang , Jui-Hsien Chang
IPC分类号： G06F12/02 , G06F12/00
CPC分类号： G06F12/0246 , G06F2212/7208
摘要： A block management method for a flash memory chip having multiple planes is provided, wherein each plane has a plurality of physical blocks. The method includes disposing a plurality of physical units, wherein each physical unit includes a physical block of each plane, and the physical blocks in the physical unit have a simultaneously-operable relationship. The method also includes writing data in a single plane access mode when a host system does not update all the physical blocks in an updated the physical unit. The method further includes writing the data in a multi-planes access mode when the host system updates all the physical blocks in the updated physical unit, wherein the physical blocks for writing the data have the simultaneously-operable relationship.
摘要翻译：提供了一种具有多个平面的闪存芯片的块管理方法，其中每个平面具有多个物理块。该方法包括布置多个物理单元，其中每个物理单元包括每个平面的物理块，物理单元中的物理块具有同时可操作的关系。该方法还包括当主机系统不更新更新的物理单元中的所有物理块时，以单平面访问模式写入数据。该方法还包括当主机系统更新更新的物理单元中的所有物理块时，以多平面访问模式写入数据，其中用于写入数据的物理块具有同时可操作的关系。

17. 发明申请

US20090150597A1 DATA WRITING METHOD FOR FLASH MEMORY AND CONTROLLER USING THE SAME 有权
标题翻译：闪存存储器的数据写入方法和使用该存储器的控制器
公开(公告)号：US20090150597A1
公开(公告)日：2009-06-11
申请号：US12052348
申请日：2008-03-20
申请人： Jiunn-Yeong Yang , Jui-Hsien Chang , Chien-Hua Chu , Jian-Yo Su , Chih-Kang Yeh
发明人： Jiunn-Yeong Yang , Jui-Hsien Chang , Chien-Hua Chu , Jian-Yo Su , Chih-Kang Yeh
IPC分类号： G06F12/02
CPC分类号： G06F12/0246 , G06F2212/7203
摘要： A data writing method for a flash memory is provided. The data writing method includes: dividing a new data into at lease one sub-data by the length of a writing unit; selecting one of a plurality of spare blocks from the flash memory as a substitute block for substituting a data block, wherein the new data is to be written into the data block; sequentially writing the sub-data having the length of the writing unit into the substitute block in the writing unit; and storing the sub-data not having the length of the writing unit into a temporary area. The writing efficiency of the flash memory can be improved by temporarily storing the sub-data not having the length of the writing unit into the temporary area and then writing the sub-data not having the length of the writing unit with subsequent data into the substitute block.
摘要翻译：提供了一种用于闪速存储器的数据写入方法。数据写入方法包括：将新数据分割为一个写入单元长度的一个子数据; 从闪存中选择多个备用块中的一个作为用于替换数据块的替代块，其中新数据将被写入数据块; 将具有写入单元的长度的子数据顺序地写入写入单元中的替换块; 以及将不具有写入单元的长度的子数据存储在临时区域中。通过将不具有写入单元的长度的子数据临时存储到临时区域中，然后将不具有写入单元的长度的子数据与后续数据写入替代物，可以提高闪速存储器的写入效率块。

18. 发明授权

US07498556B2 Image sensor module having build-in package cavity and the method of the same 有权
标题翻译：具有内置封装空腔的图像传感器模块及其方法
公开(公告)号：US07498556B2
公开(公告)日：2009-03-03
申请号：US11725041
申请日：2007-03-15
申请人： Wen-Kun Yang , Diann-Fang Lin , Jui-Hsien Chang , Tung-Chuan Wang
发明人： Wen-Kun Yang , Diann-Fang Lin , Jui-Hsien Chang , Tung-Chuan Wang
IPC分类号： H01L27/00
CPC分类号： H01L27/14618 , H01L24/19 , H01L27/14625 , H01L27/14627 , H01L27/14643 , H01L27/14685 , H01L2224/05001 , H01L2224/05026 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05548 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/12105 , H01L2224/73267 , H01L2924/14 , H04N5/2253 , H04N5/2257 , H01L2924/00 , H01L2924/00014 , H01L2924/01029 , H01L2924/01079 , H01L2924/01028 , H01L2924/013
摘要： The present invention provides an image sensor module having build-in package cavity and the Method of the same. An image sensor module structure comprising a substrate with a package receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate, and a package having a die with a micro lens disposed within the package receiving cavity. A dielectric layer is formed on the package and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.
摘要翻译：本发明提供了一种具有内置封装空腔的图像传感器模块及其方法。一种图像传感器模块结构，包括具有形成在所述基板的上表面内的封装容纳腔的衬底和所述衬底内的导电迹线，以及具有设置在所述封装容纳腔内的具有微透镜的裸片的封装。在封装和基板上形成电介质层，在介电层上形成再分配导电层（RDL），其中RDL耦合到管芯，导电迹线和电介质层具有露出微透镜。透镜保持器附接在基板上，并且透镜保持器具有安装在透镜保持器的上部的透镜。滤光片安装在透镜和微透镜之间。该结构还包括在透镜保持器内的衬底的上表面上的无源器件。

19. 发明申请

US20090008729A1 IMAGE SENSOR PACKAGE UTILIZING A REMOVABLE PROTECTION FILM AND METHOD OF MAKING THE SAME 审中-公开
标题翻译：使用可拆卸保护膜的图像传感器包装及其制造方法
公开(公告)号：US20090008729A1
公开(公告)日：2009-01-08
申请号：US11772861
申请日：2007-07-03
申请人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee , Wen-Ping Yang
发明人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee , Wen-Ping Yang
IPC分类号： H01L31/0232 , H01L21/00
CPC分类号： H01L27/14618 , H01L27/14627 , H01L27/14687 , H01L2224/48091 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： The present invention discloses a structure of image sensor package utilizing a removable protection film. The structure comprises a substrate with a die receiving cavity and inter-connecting through holes. Terminal pads are formed under the inter-connecting through holes and metal pads are formed on an upper surface of the substrate. A die is disposed within the die receiving cavity by an adhesion material. Bonding pads are formed on the upper edge of the die. Bonding wires are coupled to the metal pads and the bonding pads. A protection layer is formed on the micro lens area to protect the micro lens from particle contamination. A removable protection film is formed over the protection layer to protect the micro lens from water, oil, dust or temporary impact during the packaging and assembling process.
摘要翻译：本发明公开了利用可移除保护膜的图像传感器封装的结构。该结构包括具有模具接收腔和相互连接的通孔的基板。端子焊盘形成在相互连接的通孔之下，金属焊盘形成在基板的上表面上。模具通过粘合材料设置在模具容纳腔内。接合垫形成在模具的上边缘上。接合线耦合到金属焊盘和焊盘。在微透镜区域上形成保护层以保护微透镜免受颗粒污染。在保护层上形成可移除的保护膜，以在包装和组装过程中保护微透镜免受水，油，灰尘或临时冲击。

20. 发明申请

US20080211075A1 IMAGE SENSOR CHIP SCALE PACKAGE HAVING INTER-ADHESION WITH GAP AND METHOD OF THE SAME 审中-公开
标题翻译：具有间隙的粘合剂的图像传感器芯片尺寸包装及其相同方法
公开(公告)号：US20080211075A1
公开(公告)日：2008-09-04
申请号：US11950921
申请日：2007-12-05
申请人： Wen-Kun Yang , Jui-Hsien Chang , Hsien-Wen Hsu , Diann-Fang Lin
发明人： Wen-Kun Yang , Jui-Hsien Chang , Hsien-Wen Hsu , Diann-Fang Lin
IPC分类号： H01L23/04 , H01L21/71
CPC分类号： H01L27/14618 , H01L27/14643 , H01L27/14683 , H01L27/148 , H01L2224/05001 , H01L2224/05008 , H01L2224/05026 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05548 , H01L2224/05569 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/13 , H01L2924/00014 , H01L2924/01029 , H01L2924/01079 , H01L2924/01028
摘要： A structure of semiconductor device package having inter-adhesion with gap comprising: a chip with bonding pads and a sensor area embedded into a substrate with die window and inter-connecting through holes, wherein a RDL is formed over the substrate for coupling between the bonding pads and the inter-connecting through holes; a multiple rings (dam bar) formed over the substrate, the RDL, and the bonding pads area except the sensor area; an adhesive glues fill into the space of the multiple ring except the sensor area; and a transparency material bonded on the top of the multiple ring and the adhesive glues, wherein the adhesive glues adhesion between the transparency material and the multiple rings.
摘要翻译：一种具有间隙的粘合性的半导体器件封装的结构，包括：具有接合焊盘的芯片和嵌入到具有模具窗口和互连通孔的衬底中的传感器区域，其中，RDL形成在衬底上，用于在接合垫和相互连接的通孔; 形成在基板上的多个环（阻挡条），RDL和除了传感器区域之外的接合焊盘区域; 粘合剂胶水填充到除了传感器区域之外的多个环的空间中; 以及粘合在多个环的顶部上的透明材料和胶粘剂，其中粘合剂胶合透明材料和多个环之间的粘附。

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