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11. 发明授权

US07418992B2 Controller for at least one heater utilized in an injection molding system and an associated method of use 有权
标题翻译：用于注射成型系统中使用的至少一个加热器的控制器和相关联的使用方法
公开(公告)号：US07418992B2
公开(公告)日：2008-09-02
申请号：US11384703
申请日：2006-03-20
申请人： Jim Pilavdzic
发明人： Jim Pilavdzic
IPC分类号： B22C19/04 , B22D17/32 , B29C45/78
CPC分类号： B29C45/78 , B29C45/14598 , B29C45/2737 , B29C2945/7604 , B29C2945/76274 , B29C2945/76518 , B29C2945/76531 , B29C2945/76752 , B29C2945/76996 , G05D23/1917
摘要： A controller for at least one heater utilized in an injection molding system, which includes a regulated voltage supply that is electrically connected to the at least one heater utilized in an injection molding system, at least one sensor operatively associated with at least one heater and utilized in an injection molding system, at least one digital signal processor that is operatively connected to the at least one heater utilized in an injection molding system, the regulated voltage supply and the sensor operatively associated with the at least one heater utilized in an injection molding system based on feedback from the at least one sensor.
摘要翻译：一种用于注塑系统中使用的至少一个加热器的控制器，其包括电连接到在注塑系统中使用的至少一个加热器的调节电压源，至少一个与至少一个加热器可操作地相关联的传感器在注射成型系统中，至少一个数字信号处理器，其可操作地连接到在注射成型系统中使用的至少一个加热器，所述调节电压源和所述传感器可操作地与所述至少一个加热器相关联，所述加热器用于注射成型系统基于来自所述至少一个传感器的反馈。

12. 发明申请

US20070065538A1 Molding system having valve including pump 审中-公开
标题翻译：具有阀门的成型系统包括泵
公开(公告)号：US20070065538A1
公开(公告)日：2007-03-22
申请号：US11228071
申请日：2005-09-16
申请人： Douglas Weatherall , Jim Pilavdzic
发明人： Douglas Weatherall , Jim Pilavdzic
IPC分类号： B29C45/20
CPC分类号： B29C45/52 , B29C2045/528
摘要： Disclosed is a kit of a molding system, a valve of a molding system, and a molding system. Each of the kit and the molding system includes a pump configured to be placed in a valve pathway defined by a valve, wherein the pump is configured to pump, responsive to actuation by a pump actuator, a molding material through the valve pathway and towards a mold cavity defined by complementary mold halves. The valve includes a valve body and a pump configured to be placed in a valve pathway defined by the valve body, wherein the pump is configured to pump, responsive to actuation by a pump actuator, a molding material through the valve pathway and towards a mold cavity defined by complementary mold halves.
摘要翻译：公开了一种成型系统的套件，成型系统的阀和模制系统。每个套件和模制系统包括构造成被放置在由阀限定的阀通道中的泵，其中泵被构造成响应于由泵致动器的致动而被泵送，模制材料通过阀通道并且朝向模具腔由互补半模定义。所述阀包括阀体和泵，所述泵构造成被放置在由所述阀体限定的阀通道中，其中所述泵构造成响应于泵致动器的致动而泵送模制材料，所述模制材料通过所述阀通道并朝向模具由互补半模定义的腔。

13. 发明授权

US06530776B1 Method and apparatus of connection to an electrical film device 失效
标题翻译：连接到电子胶片装置的方法和装置
公开(公告)号：US06530776B1
公开(公告)日：2003-03-11
申请号：US09972166
申请日：2001-10-09
申请人： Jim Pilavdzic , Andrew Booth
发明人： Jim Pilavdzic , Andrew Booth
IPC分类号： B29C4520
CPC分类号： H05B3/46 , B29C45/2737 , B29C2045/2745 , B29C2045/2751 , H05B2203/013 , H05B2203/017
摘要： A method and apparatus for connection of a conductor to a thick film pad is disclosed. Pressure and frictional force are combined to produce a reliable metallurgical bond between the conductor and the thick film pad.
摘要翻译：公开了一种将导体连接到厚膜垫的方法和装置。压力和摩擦力被组合以在导体和厚膜垫之间产生可靠的冶金结合。

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