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11. 发明申请

US20090088496A1 METHOD FOR PRODUCING RUBBER-FILLER COMPOSITE 审中-公开
标题翻译：生产橡胶填料复合材料的方法
公开(公告)号：US20090088496A1
公开(公告)日：2009-04-02
申请号：US12210273
申请日：2008-09-15
申请人： Takashi Miyasaka , Takashi Yuri , Hiroaki Narita , Hirofumi Hayashi
发明人： Takashi Miyasaka , Takashi Yuri , Hiroaki Narita , Hirofumi Hayashi
IPC分类号： C08J3/22
CPC分类号： C08C1/04 , B29B7/7495 , B60C1/0016 , B60C1/0025 , C08J3/226 , C08J2407/00 , C08K3/04
摘要： A rubber-filler composite exhibiting low heat build-up, fatigue resistance and heat aging resistance equal to those of a concentrated natural rubber latex, despite using a field latex of a natural rubber and omitting a concentration step is disclosed. The rubber-filler composite is obtained by jetting a field latex of a natural rubber in a form of a high-speed flow having a flow rate of 500 m/sec or more into a mixing chamber while supplying a filler slurry containing a filler to the mixing chamber, thereby separating and removing protein in the field latex from a rubber component and at the same time, mixing the field latex and the filler slurry.
摘要翻译：公开了尽管使用天然橡胶的现场胶乳并省略了浓缩步骤，但是具有低的发热性，耐疲劳性和耐老化性等于浓缩天然橡胶胶乳的橡胶填料复合材料。通过将具有500m / sec以上流速的高速流动的天然橡胶的现场胶乳喷射到混合室中，同时将含有填料的填料浆料供给到混合室，从而将现场胶乳中的蛋白质从橡胶组分中分离除去，同时混合野外胶乳和填料浆料。

12. 发明授权

US08884447B2 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08884447B2
公开(公告)日：2014-11-11
申请号：US13471895
申请日：2012-05-15
申请人： Hiroaki Narita , Ken Masuta , Toru Makanae
发明人： Hiroaki Narita , Ken Masuta , Toru Makanae
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L21/56 , H01L23/495 , H01L23/31 , H01L23/00
CPC分类号： H01L23/3107 , H01L21/561 , H01L21/568 , H01L23/49541 , H01L23/49548 , H01L23/49582 , H01L24/13 , H01L24/81 , H01L24/97 , H01L2224/0401 , H01L2224/05567 , H01L2224/05573 , H01L2224/05624 , H01L2224/1134 , H01L2224/13022 , H01L2224/13144 , H01L2224/16245 , H01L2224/75745 , H01L2224/81005 , H01L2224/81206 , H01L2224/81207 , H01L2224/81385 , H01L2224/81439 , H01L2224/81444 , H01L2224/94 , H01L2924/00014 , H01L2924/01029 , H01L2924/12042 , H01L2924/181 , H01L2224/11 , H01L2224/03 , H01L2224/05552 , H01L2924/00
摘要： To increase the manufacturing yield of semiconductor devices by improving a joint failure of a bump electrode.In a semiconductor device in which a plurality of boding pads 4 formed on a front surface of a semiconductor chip 3 and a plurality of leads 2 are connected via a plurality of bump electrodes 5, respectively, the upper surface of the leads 2 is formed into a semi-glossy surface having a roughness a maximum height (Ry) of which is in a range greater than 0 μm and not greater than 20 μm (0 μm
摘要翻译：通过改善凸块电极的接合故障来增加半导体器件的制造成品率。在半导体装置中，形成在半导体芯片3的前表面上的多个焊盘4和多个引线2分别经由多个凸块电极5连接，引线2的上表面形成为具有最大高度（Ry）的粗糙度在大于0μm且不大于20μm（0μm<最大高度（Ry）＆nlE;20μm）的范围内的半光泽表面，而不是平面（最大高度（Ry）= 0）。

13. 发明申请

US20130060496A1 WIRELESSLY-POWERED ELECTRICALLY-OPERATED DEVICE 审中-公开
标题翻译：无线电力电气设备
公开(公告)号：US20130060496A1
公开(公告)日：2013-03-07
申请号：US13600202
申请日：2012-08-30
申请人： Hiroaki NARITA
发明人： Hiroaki NARITA
IPC分类号： G06F19/00
CPC分类号： H02J50/20 , H02J7/025 , H02J17/00 , H02J50/15 , H02J50/30 , H02J50/40 , H02J50/60
摘要： An operating period for a driving portion is defined. Prior to entering the operating period, it is defined as a forecasting operating period, the total amount of work of the driving portion for the forecasting operating period and a total required DC electric energy A for the device during the forecasting operating period are forecasted. Prior to entering into the forecasting operating period, a stored DC electric energy B, and an estimated DC electric energy C to be extracted from a wireless electric energy supply between the current time and the time of the end of the forecasting operating period are summed as a supplyable DC electric energy D for the period. The total required DC electric energy A for the forecasting operating period and the supplyable DC electric energy D are compared, and if D
摘要翻译：定义驱动部的操作期间。在进入运营期之前，预测预测运行期间，预测运行期间的驱动部分的总工作量以及设备的预期直流电能量A的预计运行期间。在进入预测运行期间之前，将从当前时刻到预测运行期间结束的时刻之间从无线电能供应提取的存储的直流电能B和估计直流电能C相加为一段可供电的直流电能D。比较预测运行时间和可供电的直流电能D的总要求直流电能A，如果D

14. 发明申请

US20120292760A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20120292760A1
公开(公告)日：2012-11-22
申请号：US13471895
申请日：2012-05-15
申请人： Hiroaki NARITA , Ken MASUTA , Toru MAKANAE
发明人： Hiroaki NARITA , Ken MASUTA , Toru MAKANAE
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： H01L23/3107 , H01L21/561 , H01L21/568 , H01L23/49541 , H01L23/49548 , H01L23/49582 , H01L24/13 , H01L24/81 , H01L24/97 , H01L2224/0401 , H01L2224/05567 , H01L2224/05573 , H01L2224/05624 , H01L2224/1134 , H01L2224/13022 , H01L2224/13144 , H01L2224/16245 , H01L2224/75745 , H01L2224/81005 , H01L2224/81206 , H01L2224/81207 , H01L2224/81385 , H01L2224/81439 , H01L2224/81444 , H01L2224/94 , H01L2924/00014 , H01L2924/01029 , H01L2924/12042 , H01L2924/181 , H01L2224/11 , H01L2224/03 , H01L2224/05552 , H01L2924/00
摘要： To increase the manufacturing yield of semiconductor devices by improving a joint failure of a bump electrode.In a semiconductor device in which a plurality of boding pads 4 formed on a front surface of a semiconductor chip 3 and a plurality of leads 2 are connected via a plurality of bump electrodes 5, respectively, the upper surface of the leads 2 is formed into a semi-glossy surface having a roughness a maximum height (Ry) of which is in a range greater than 0 μm and not greater than 20 μm (0 μm
摘要翻译：通过改善凸块电极的接合故障来增加半导体器件的制造成品率。在半导体装置中，形成在半导体芯片3的前表面上的多个焊盘4和多个引线2分别经由多个突起电极5连接，引线2的上表面形成为具有最大高度（Ry）的粗糙度在大于0μm且不大于20μm（0μm<最大高度（Ry）＆nlE;20μm）的范围内的半光泽表面，而不是平面（最大高度（Ry）= 0）。

15. 发明申请

US20110215749A1 ELECTRIC ACTUATOR AND MODULE FOR SUPPLYING POWER DURING A POWER FAILURE 审中-公开
标题翻译：在电源故障期间供电的电动执行器和模块
公开(公告)号：US20110215749A1
公开(公告)日：2011-09-08
申请号：US12968499
申请日：2010-12-15
申请人： Makoto Saruwatari , Hiroaki Narita
发明人： Makoto Saruwatari , Hiroaki Narita
IPC分类号： H02P1/18 , H02J9/06
CPC分类号： G05B23/00 , H02P1/18 , Y10T307/625
摘要： An electric actuator is provided having the same configuration whether used as an ordinary electric actuator or as an electric actuator having an emergency shutoff function. A power failure detection circuit, a portion for supplying power during a power failure, a motor power supply switching circuit, a power failure control signal generation circuit, and a control signal switching circuit are provided in a module detachably coupled to the electric actuator. When failure of the primary power is not detected, the motor power supply switching circuit and the control signal switching circuit send the primary power and a signal indicative of a setting of an aperture of a valve of the electric actuator, respectively, to the electric actuator. When failure of the primary power is detected, the motor power supply switching circuit and the control signal switching circuit send the secondary power and the signal indicative of the setting of the aperture during a power failure to the electric actuator.
摘要翻译：提供具有与用作普通电动致动器或具有紧急关闭功能的电致动器相同的构造的电致动器。电力故障检测电路，电源故障时供电的部分，电动机电源切换电路，停电控制信号生成电路以及控制信号切换电路设置在与电致动器可拆卸地连接的模块中。当没有检测到主电源的故障时，电动机电源切换电路和控制信号切换电路分别将电力执行器的主电源和表示电动致动器的阀的开度的设定信号发送到电致动器。当检测到主电源故障时，电动机电源切换电路和控制信号切换电路将电力故障期间的二次电力和指示孔径设定的信号发送到电致动器。

16. 发明申请

US20110074016A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20110074016A1
公开(公告)日：2011-03-31
申请号：US12856664
申请日：2010-08-15
申请人： Hiroaki NARITA
发明人： Hiroaki NARITA
IPC分类号： H01L23/498 , H01L21/56 , H01L21/60 , H01L23/31
CPC分类号： H01L23/4951 , H01L21/4821 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3107 , H01L23/49548 , H01L23/49582 , H01L23/49805 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/97 , H01L2224/0401 , H01L2224/04042 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16245 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/78301 , H01L2224/81001 , H01L2224/81801 , H01L2224/85051 , H01L2224/85986 , H01L2224/97 , H01L2924/00014 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H05K3/3442 , H01L2224/81 , H01L2224/85186 , H01L2924/00 , H01L2224/48227 , H01L2924/00012 , H01L2224/4554
摘要： The size and thickness of a semiconductor device are reduced. A semiconductor package with a flip chip bonding structure includes: a semiconductor chip having a main surface with multiple electrode pads formed therein and a back surface located on the opposite side thereto; four lead terminals each having an upper surface with the semiconductor chip placed thereover and a lower surface located on the opposite side thereto; and a sealing body having a main surface and a back surface located on the opposite side thereto. In this semiconductor package, the distance between adjacent first lower surfaces of the four lead terminals exposed in the back surface of the sealing body is made longer than the distance between adjacent upper surfaces thereof. This makes it possible to suppress the production of a solder bridge when the semiconductor package is solder mounted to a mounting board and to reduce the size and thickness of the semiconductor package and further enhance the reliability of the semiconductor package.
摘要翻译：半导体器件的尺寸和厚度减小。具有倒装芯片接合结构的半导体封装包括：具有形成在其中的多个电极焊盘的主表面和位于其相对侧的后表面的半导体芯片; 四个引线端子各自具有其上放置有半导体芯片的上表面和位于其相对侧上的下表面; 以及密封体，其具有位于其相对侧上的主表面和后表面。在该半导体封装中，在密封体的后表面露出的四个引线端子的相邻第一下表面之间的距离比其相邻的上表面之间的距离长。这使得当半导体封装被焊接到安装板上时可以抑制焊接桥的制造，并且可以减小半导体封装的尺寸和厚度，进一步提高半导体封装的可靠性。

17. 发明申请

US20090062455A1 Rubber Composition For Tire And Its Producing Method 审中-公开
标题翻译：轮胎橡胶组合及其生产方法
公开(公告)号：US20090062455A1
公开(公告)日：2009-03-05
申请号：US12192204
申请日：2008-08-15
申请人： Hiroaki Narita , Ikuo Ihara , Takashi Miyasaka , Hirofumi Hayashi
发明人： Hiroaki Narita , Ikuo Ihara , Takashi Miyasaka , Hirofumi Hayashi
IPC分类号： C08L9/00
CPC分类号： C08J3/20 , B60C1/00 , C08J2321/00 , C08K5/378 , C08L21/00
摘要： A rubber composition for tire, which combines low heat build-up properties and breakage property, reduces fuel consumption of a tire, and has excellent good processability is provided. The rubber composition for tire is obtained by blending sulfur and caprolactam disulfide with a diene rubber component to obtain a pre-mixture which does not contain a reinforcing filler and a vulcanization accelerator, and blending and mixing a reinforcing filler and a vulcanization accelerator with the pre-mixture in a post-mixing step.
摘要翻译：一种结合了低发热性和断裂性的轮胎用橡胶组合物，降低了轮胎的燃料消耗，并且具有优异的加工性。用于轮胎的橡胶组合物是通过将硫和己内酰胺二硫化物与二烯橡胶组分混合而获得的，以获得不含增强填料和硫化促进剂的预混合物，并将增强填料和硫化促进剂与前预混合混合后混合。

18. 发明授权

US08987063B2 Manufacturing method of semiconductor device 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US08987063B2
公开(公告)日：2015-03-24
申请号：US13372406
申请日：2012-02-13
申请人： Ryoji Harata , Hiroaki Narita
发明人： Ryoji Harata , Hiroaki Narita
IPC分类号： H01L21/56 , H01L21/60 , H01L23/495 , H01L23/00 , B29C45/14 , B29C45/00 , H01L23/31
CPC分类号： H01L23/49503 , B29C45/0046 , B29C45/14655 , H01L21/565 , H01L21/568 , H01L23/28 , H01L23/3107 , H01L23/49575 , H01L23/50 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L24/97 , H01L29/16 , H01L29/20 , H01L2224/02166 , H01L2224/05554 , H01L2224/0603 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/4848 , H01L2224/48639 , H01L2224/49171 , H01L2224/73265 , H01L2224/83191 , H01L2224/85207 , H01L2224/85439 , H01L2224/97 , H01L2924/01029 , H01L2924/10161 , H01L2924/10253 , H01L2924/10329 , H01L2924/1306 , H01L2924/13063 , H01L2924/13064 , H01L2924/13091 , H01L2924/1421 , H01L2924/15788 , H01L2924/181 , H01L2924/18165 , H01L2924/30107 , H01L2924/00014 , H01L2224/85 , H01L2924/00012 , H01L2924/00
摘要： A manufacturing method of a semiconductor device of a thin resin sealed multichip rectangular package having wire connection between the chips, wherein: at least one chip is fixed to a die pad thinned more than a die pad support lead, the die pad is supported by die pad support leads arranged to respectively connect a pair of long sides of the rectangle, and sealing resin is introduced from one side of the pair of long sides when resin molding is performed.
摘要翻译：一种在芯片之间具有线连接的薄树脂密封多芯矩形封装的半导体器件的制造方法，其中：至少一个芯片固定在比芯片支撑引线更薄的管芯焊盘上，管芯焊盘由管芯支撑衬垫支撑引线被布置成分别连接矩形的一对长边，并且当进行树脂模制时，从一对长边的一侧引入密封树脂。

19. 发明申请

US20130040426A1 MANUFACTURING METHOD USING MULTI-STEP ADHESIVE CURING FOR SEALED SEMICONDUCTOR DEVICE 有权
标题翻译：用于密封半导体器件的多步粘合固化的制造方法
公开(公告)号：US20130040426A1
公开(公告)日：2013-02-14
申请号：US13559397
申请日：2012-07-26
申请人： HIROAKI NARITA
发明人： HIROAKI NARITA
IPC分类号： H01L21/78
CPC分类号： H01L24/28 , H01L21/561 , H01L21/568 , H01L21/6836 , H01L21/78 , H01L23/3107 , H01L23/544 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/743 , H01L24/78 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2221/68327 , H01L2221/6834 , H01L2223/54433 , H01L2223/54486 , H01L2224/05554 , H01L2224/27436 , H01L2224/29017 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/743 , H01L2224/78301 , H01L2224/83191 , H01L2224/83856 , H01L2224/85001 , H01L2224/85045 , H01L2224/85181 , H01L2224/85186 , H01L2224/85207 , H01L2224/92247 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , H01L2924/20305 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A method for forming a sealing body without cracks in manufacture of a semiconductor device having an external terminal formed through the use of an electrolysis plating method. A front surface of a semiconductor wafer is placed over a front surface of a first support heated to a first temperature. An adhesive sheet is then bonded to a back surface of the semiconductor wafer, after which the semiconductor wafer is subjected to heat treatment at a second temperature higher than the first temperature. After the semiconductor wafer and the adhesive sheet are cut along cutting regions, a plurality of semiconductor chips each having an adhesive patch bonded thereto are obtained. A mother substrate is placed over a front surface of a second support heated to a third temperature and the semiconductor chips are fixed to an upper surface of the mother substrate via the adhesive patch.
摘要翻译：在具有通过使用电解镀法形成的外部端子的半导体器件的制造中，形成密封体而没有裂纹的方法。将半导体晶片的前表面放置在加热到第一温度的第一支撑件的前表面上。然后将粘合片粘合到半导体晶片的背面，然后在高于第一温度的第二温度对半导体晶片进行热处理。在切割区域切割半导体晶片和粘合片之后，获得多个粘合贴片的半导体芯片。将母基板放置在加热到第三温度的第二支撑体的前表面上，并且半导体芯片经由粘合贴片固定到母基板的上表面。

20. 发明申请

US20120208324A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US20120208324A1
公开(公告)日：2012-08-16
申请号：US13372406
申请日：2012-02-13
申请人： Ryoji HARATA , Hiroaki Narita
发明人： Ryoji HARATA , Hiroaki Narita
IPC分类号： H01L21/60
CPC分类号： H01L23/49503 , B29C45/0046 , B29C45/14655 , H01L21/565 , H01L21/568 , H01L23/28 , H01L23/3107 , H01L23/49575 , H01L23/50 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L24/97 , H01L29/16 , H01L29/20 , H01L2224/02166 , H01L2224/05554 , H01L2224/0603 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/4848 , H01L2224/48639 , H01L2224/49171 , H01L2224/73265 , H01L2224/83191 , H01L2224/85207 , H01L2224/85439 , H01L2224/97 , H01L2924/01029 , H01L2924/10161 , H01L2924/10253 , H01L2924/10329 , H01L2924/1306 , H01L2924/13063 , H01L2924/13064 , H01L2924/13091 , H01L2924/1421 , H01L2924/15788 , H01L2924/181 , H01L2924/18165 , H01L2924/30107 , H01L2924/00014 , H01L2224/85 , H01L2924/00012 , H01L2924/00
摘要： In a multichip thin package requiring a thickness of submillimeter region, it is difficult to thin the package if the chips are mounted over a usual die pad. According to a technique of the present application, in a manufacturing method of a semiconductor device of a thin resin sealed multichip rectangular package having wire connection between the chips, at least one chip is fixed to a die pad thinned more than a die pad support lead, the die pad is supported by die pad support leads arranged to respectively connect a pair of long sides of the rectangle, and sealing resin is introduced from one side of the pair of long sides when resin molding is performed.
摘要翻译：在需要亚毫米厚度区域的多芯片薄封装中，如果芯片安装在通常的芯片焊盘上，则难以将封装薄化。根据本申请的技术，在具有在芯片之间具有导线连接的薄树脂密封多芯矩形封装的半导体器件的制造方法中，至少一个芯片被固定到比模具垫支撑引线更薄的管芯焊盘芯片焊盘由分别连接矩形的一对长边的芯片支撑引线支撑，当进行树脂成型时，密封树脂从一对长边的一侧引入。

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