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11. 发明申请

US20090052210A1 TEMPERATURE SENSING ARRANGEMENTS FOR POWER ELECTRONIC DEVICES 有权
标题翻译：电力电子设备温度感测装置
公开(公告)号：US20090052210A1
公开(公告)日：2009-02-26
申请号：US11758781
申请日：2007-08-22
申请人： Terence G. Ward , Edward P. Yankoski
发明人： Terence G. Ward , Edward P. Yankoski
IPC分类号： H02H7/122 , G01K7/22
CPC分类号： G05D23/20 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/37011 , H01L2224/40225 , H01L2224/48091 , H01L2224/48472 , H01L2224/73221 , H01L2224/83801 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： A cooling system is provided for controlling temperature in a power electronic device. The power electronic device includes a semiconductor having a major surface. The cooling system includes a temperature sensor coupled to the major surface of the semiconductor; and a control circuit coupled the temperature sensor. The control circuit is configured to reduce current to the inverter circuit when the temperature exceeds a predetermined temperature.
摘要翻译：提供了用于控制电力电子设备中的温度的冷却系统。功率电子器件包括具有主表面的半导体。冷却系统包括耦合到半导体主表面的温度传感器; 以及耦合该温度传感器的控制电路。所述控制电路构成为，当所述温度超过预定温度时，减少到所述逆变器电路的电流。

12. 发明授权

US07952875B2 Stacked busbar assembly with integrated cooling 有权
标题翻译：堆叠式母线组合，集成冷却
公开(公告)号：US07952875B2
公开(公告)日：2011-05-31
申请号：US12475005
申请日：2009-05-29
申请人： George R. Woody , Terence G. Ward , Edward P. Yankoski
发明人： George R. Woody , Terence G. Ward , Edward P. Yankoski
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L25/071 , H01L25/18 , H01L2924/0002 , H01L2924/12044 , H02M7/003 , H01L2924/00
摘要： A stacked busbar assembly includes two or more busbar subassemblies, each including a plurality of busbars having one or more power semiconductor devices bonded thereto (e.g., IGBTs, power diodes, and the like). Each busbar has an internal integrated cooling system including one or more fluid channels in communication with an inlet and an outlet. The busbar assemblies are stacked such that their respective inlets and outlets are aligned and a coolant may then flow in parallel therethrough.
摘要翻译：堆叠母线组件包括两个或更多个母线组件，每个母线组件包括多个母线，其具有与其连接的一个或多个功率半导体器件（例如，IGBT，功率二极管等）。每个母线具有内部集成冷却系统，其包括与入口和出口连通的一个或多个流体通道。母线组件被堆叠成使得它们各自的入口和出口对齐，然后冷却剂可以平行流过其中。

13. 发明申请

US20110012425A1 POWER MODULE LAYOUT FOR AUTOMOTIVE POWER CONVERTERS 有权
标题翻译：用于汽车电源转换器的电源模块布局
公开(公告)号：US20110012425A1
公开(公告)日：2011-01-20
申请号：US12891316
申请日：2010-09-27
申请人： TERENCE G. WARD , EDWARD P. YANKOSKI
发明人： TERENCE G. WARD , EDWARD P. YANKOSKI
IPC分类号： B60L1/00
CPC分类号： H02M7/003 , H01L25/072 , H01L25/18 , H01L2924/0002 , H01L2924/00
摘要： An automotive power converter is provided. The automotive power converter includes a substrate, first and second electronic devices on the substrate, at least one conductive member coupled to the substrate and having a first device portion electrically coupled to the first electronic device and a second device portion electrically coupled to the second electronic device, and first and second terminals electrically coupled to the at least one conductive member. When a power supply is coupled to the first and second terminals, current flows from the first terminal to the first device portion substantially in a first direction and from the second terminal to the second device portion substantially in a second direction. The first direction has a first component and the second direction has a second component opposing the first component.
摘要翻译：提供汽车功率转换器。所述汽车功率转换器包括衬底，所述衬底上的第一和第二电子器件，耦合到所述衬底的至少一个导电构件，并且具有电耦合到所述第一电子器件的第一器件部分和电耦合到所述第二电子器件的第二器件部分装置，以及电耦合到所述至少一个导电构件的第一和第二端子。当电源耦合到第一和第二端子时，电流基本上在第一方向上从第一端子流到第一器件部分，并且从第二端子到第二器件部分基本上沿第二方向流动。第一方向具有第一分量，第二方向具有与第一分量相对的第二分量。

14. 发明申请

US20100302737A1 POWER ELECTRONICS POWER MODULE WITH IMBEDDED GATE CIRCUITRY 有权
标题翻译：功率电子电源模块，带有门控电路
公开(公告)号：US20100302737A1
公开(公告)日：2010-12-02
申请号：US12473632
申请日：2009-05-28
申请人： EDWARD P. YANKOSKI , TERENCE G. WARD , GEORGE R. WOODY
发明人： EDWARD P. YANKOSKI , TERENCE G. WARD , GEORGE R. WOODY
IPC分类号： H05K7/20 , H05K1/14 , H05K3/30
CPC分类号： H01L25/18 , H01L2924/0002 , H01L2924/13055 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T29/4913 , H01L2924/00
摘要： A power electronics power module is provided. The power electronics power module includes an electrically conductive substrate, a electronic die having first and second opposing surfaces and at least one transistor formed thereon, the electronic die being mounted to the electrically conductive substrate and the at least one transistor being configured such that when the at least one transistor is activated, current flows from the first surface of the electronic die into the electrically conductive substrate, and a control member at least partially imbedded in the electrically conductive substrate, the control member having a control conductor formed thereon and electrically connected to the at least one transistor such that when a control signal is provided to the control conductor, the at least one transistor is activated.
摘要翻译：提供电力电子电源模块。电力电子功率模块包括导电衬底，具有第一和第二相对表面的电子管芯以及形成在其上的至少一个晶体管，该电子管芯安装在导电衬底上，并且至少一个晶体管被配置成使得当至少一个晶体管被激活，电流从电子管芯的第一表面流入导电衬底，以及至少部分嵌入导电衬底中的控制构件，该控制构件具有形成在其上的控制导体并电连接到所述至少一个晶体管使得当控制信号被提供给所述控制导体时，所述至少一个晶体管被激活。

15. 发明授权

US07612447B2 Semiconductor devices with layers having extended perimeters for improved cooling and methods for cooling semiconductor devices 有权
标题翻译：具有延伸周期的层的半导体器件用于改进的冷却和用于冷却半导体器件的方法
公开(公告)号：US07612447B2
公开(公告)日：2009-11-03
申请号：US11758833
申请日：2007-06-06
申请人： Terence G. Ward , Edward P. Yankoski
发明人： Terence G. Ward , Edward P. Yankoski
IPC分类号： H01L23/34 , H01L23/52
CPC分类号： H01L23/4735 , H01L23/3735 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device is provided, and includes a wafer having first and second opposed metallized major faces and a transistor bonded to the first metallized face of the wafer. The transistor includes a first surface, and the first surface defines a first area. The device further includes a first metal layer bonded to the first surface of the transistor. The first metal layer has a first surface that defines a second area larger than the first area of the transistor. The device further includes a ceramic layer bonded to the first surface of the first metal layer.
摘要翻译：提供半导体器件，并且包括具有第一和第二相对的金属化主面的晶片和结合到晶片的第一金属化面的晶体管。晶体管包括第一表面，并且第一表面限定第一区域。该器件还包括结合到晶体管的第一表面的第一金属层。第一金属层具有限定比晶体管的第一区域大的第二区域的第一表面。该装置还包括结合到第一金属层的第一表面的陶瓷层。

16. 发明申请

US20090034310A1 COMPACT TERMINAL ASSEMBLY FOR POWER CONVERTERS 有权
标题翻译：功率转换器紧凑型端子组件
公开(公告)号：US20090034310A1
公开(公告)日：2009-02-05
申请号：US12178897
申请日：2008-07-24
申请人： Terence G. WARD , George JOHN , Edward P. YANKOSKI , Gregory S. SMITH , James M. NAGASHIMA
发明人： Terence G. WARD , George JOHN , Edward P. YANKOSKI , Gregory S. SMITH , James M. NAGASHIMA
IPC分类号： H02M1/00
CPC分类号： H02M7/003 , H01L2224/49111
摘要： A terminal assembly for a power converter is provided. The terminal assembly includes first and second conductive components and a current sensor. The first conductive component has first and second releasable attachment formations. The second conductive component has first and second portions with respective first and second widths. The first width is less than the second width. The first portion is releasably attached to the first conductive component with the second releasable attachment formation. The current sensor has an opening therethrough and is positioned between the first conductive component and the second portion of the second conductive component such that the first portion of the first conductive component extends through the opening. The current sensor is responsive to current flowing through the first portion of the second conductive component.
摘要翻译：提供了一种用于功率转换器的端子组件。端子组件包括第一和第二导电部件和电流传感器。第一导电组件具有第一和第二可释放的附接结构。第二导电部件具有相应的第一和第二宽度的第一和第二部分。第一宽度小于第二宽度。第一部分通过第二可释放的连接结构可释放地附接到第一导电部件。电流传感器具有穿过其的开口并且位于第一导电部件和第二导电部件的第二部分之间，使得第一导电部件的第一部分延伸穿过开口。电流传感器响应于流过第二导电部件的第一部分的电流。

17. 发明授权

US08400775B2 Capacitor with direct DC connection to substrate 有权
标题翻译：直接与基板直接连接的电容器
公开(公告)号：US08400775B2
公开(公告)日：2013-03-19
申请号：US11774329
申请日：2007-07-06
申请人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
发明人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
IPC分类号： H05K1/18
CPC分类号： H02M7/003
摘要： A subcomponent is provided for a power inverter module. The apparatus comprises a capacitor having a terminal and integrated into a housing. A substrate is mounted on the housing. The substrate incorporates a power semiconductor switch and has at least one direct current (DC) tab. The direct current tab is directly connected to the terminal of the capacitor.
摘要翻译：为功率逆变器模块提供了一个子部件。该装置包括具有端子并且集成到壳体中的电容器。衬底安装在壳体上。该基板包括功率半导体开关，并具有至少一个直流（DC）接头。直流标签直接连接到电容器的端子。

18. 发明申请

US20110141690A1 POWER ELECTRONICS SUBSTRATE FOR DIRECT SUBSTRATE COOLING 有权
标题翻译：用于直接基板冷却的电力电子基板
公开(公告)号：US20110141690A1
公开(公告)日：2011-06-16
申请号：US12638683
申请日：2009-12-15
申请人： Khiet LE , Terence G. WARD , Brooks S. MANN , Edward P. YANKOSKI , Gregory S. SMITH
发明人： Khiet LE , Terence G. WARD , Brooks S. MANN , Edward P. YANKOSKI , Gregory S. SMITH
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L25/072 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.
摘要翻译：为适用于直接基板冷却的电力电子基板提供系统和装置。电力电子基板包括被配置为具有设置在其上的电路的第一表面，第二表面和第二表面上的多个物理特征。物理特征被配置为促进撞击在第二表面上的冷却剂中的湍流边界层。

19. 发明申请

US20110088957A1 AXIALLY OFFSET MOTOR 审中-公开
标题翻译： AXIALLY偏移电机
公开(公告)号：US20110088957A1
公开(公告)日：2011-04-21
申请号：US12603358
申请日：2009-10-21
申请人： EDWARD P. YANKOSKI , TERENCE G. WARD
发明人： EDWARD P. YANKOSKI , TERENCE G. WARD
IPC分类号： B60K7/00
CPC分类号： H02K7/006 , B60K1/00 , B60K5/06 , B60K2001/001 , B60L2220/44 , Y02T10/641
摘要： A vehicle is provided. The vehicle comprises an axle having a longitudinal dimension along a first axis, the axle coupled to at least one wheel, and a motor coupled to the axle and adapted to turn the axle, the motor adapted to rotate around a second axis, wherein the motor is oriented such that the first axis is substantially perpendicular to the second axis.
摘要翻译：提供车辆。车辆包括具有沿着第一轴线的纵向尺寸的轴线，联接到至少一个车轮的车轴和联接到车轴并适于转动车轴的马达，该马达适于围绕第二轴线旋转，其中马达被定向为使得第一轴线基本上垂直于第二轴线。

20. 发明授权

US07857509B2 Temperature sensing arrangements for power electronic devices 有权
标题翻译：电力电子设备的温度感测装置
公开(公告)号：US07857509B2
公开(公告)日：2010-12-28
申请号：US11758781
申请日：2007-08-22
申请人： Terence G. Ward , Edward P. Yankoski
发明人： Terence G. Ward , Edward P. Yankoski
IPC分类号： G01K7/22 , G05D23/00
CPC分类号： G05D23/20 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/37011 , H01L2224/40225 , H01L2224/48091 , H01L2224/48472 , H01L2224/73221 , H01L2224/83801 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： A cooling system is provided for controlling temperature in a power electronic device. The power electronic device includes a semiconductor having a major surface. The cooling system includes a temperature sensor coupled to the major surface of the semiconductor; and a control circuit coupled the temperature sensor. The control circuit is configured to reduce current to the inverter circuit when the temperature exceeds a predetermined temperature.
摘要翻译：提供了用于控制电力电子设备中的温度的冷却系统。功率电子器件包括具有主表面的半导体。冷却系统包括耦合到半导体主表面的温度传感器; 以及耦合该温度传感器的控制电路。所述控制电路构成为，当所述温度超过预定温度时，减少到所述逆变器电路的电流。

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