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    • 12. 发明授权
    • Puncture resistant pneumatic tire
    • 耐穿刺充气轮胎
    • US07938158B2
    • 2011-05-10
    • US11832817
    • 2007-08-02
    • David R. Stewart
    • David R. Stewart
    • B60C9/18B60C9/22B60C9/28
    • B60C19/12B60C9/0064B60C9/2006Y10T152/1018Y10T152/10189Y10T152/10765Y10T152/10783Y10T152/10801
    • A puncture resistant pneumatic tire has a tread portion and a pair of lateral tread edges. A belt package is located radially inward of the tread portion and a carcass structure has at least one body ply which extends between and is turned up around a pair of bead cores. A protective band extends circumferentially about the tire radially beneath the tread portion and includes a plurality of circumferentially spaced metal rods, each of which extends in a lateral direction between the tread edges. The protective band may be located radially inward or outward of a spiral ply layer and the rods may be arranged in a staggered laterally offset layered relationship. The rods have a circular cross-section with a diameter of between 1/16 inch and ¼ inch and a length of between 7 inches and 8 inches and will deflect and dislodge the pointed end of road debris before it completely punctures the tire.
    • 耐穿刺充气轮胎具有胎面部和一对胎面侧缘。 皮带包装位于胎面部分的径向内侧,并且胎体结构具有至少一个主体帘布层,其在一对胎圈芯之间延伸并围绕一对珠芯卷起。 保护带围绕轮胎径向地在胎面部分下方周向延伸,并且包括多个周向间隔开的金属杆,每个金属杆在胎面边缘之间沿横向方向延伸。 保护带可以位于螺旋层层的径向向内或向外的位置,并且杆可以以交错的侧向偏移分层关系布置。 这些杆具有圆形横截面,其直径在1/16英寸和1/4英寸之间,长度在7英寸至8英寸之间,并且将在道路碎屑的尖端完全穿透轮胎之前偏转和移开。
    • 15. 发明授权
    • Spincup with a wafer backside deposition reduction apparatus
    • 具有晶片背面沉积减少装置的加工
    • US5529626A
    • 1996-06-25
    • US327730
    • 1994-10-24
    • David R. Stewart
    • David R. Stewart
    • G03F7/16G03F7/30H01L21/00B05C13/00
    • H01L21/6715G03F7/162G03F7/3021
    • A spincup having a wafer backside deposition reduction apparatus is used to reduce wafer backside particle deposition of materials on a wafer during processing. The spincup includes an opening for accommodating a wafer supporting chuck and a particle guard which circumscribes the chuck. The particle guard contacts the base of the spincup and circumscribes the chuck. When the chuck supports a wafer, a wafer backside region is defined between the chuck and the particle guard. The spincup further includes an exhaust channel coupled to the wafer backside region to independently exhaust the wafer backside region. In one embodiment, the exhaust channel includes an exhaust port for connecting a vacuum generator to the exhaust channel and a shroud contacting a base of the spincup and the particle guard. In another embodiment, the exhaust channel includes exhaust tubes which replace the exhaust manifold shroud and exhaust port.
    • 使用具有晶片背面沉积还原装置的复合物在处理期间减少晶片背面颗粒在晶片上的沉积。 支撑件包括用于容纳晶片支撑卡盘的开口和限制卡盘的颗粒保护器。 颗粒防护装置与接头的底部接触并限制卡盘。 当卡盘支撑晶片时,晶片背面区域被限定在卡盘和粒子防护罩之间。 所述支柱还包括耦合到所述晶片背侧区域以排放所述晶片背侧区域的排气通道。 在一个实施例中,排气通道包括用于将真空发生器连接到排气通道的排气口和接触所述填料和颗粒防护件的底部的护罩。 在另一个实施例中,排气通道包括排气管,其替代排气歧管罩和排气口。