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11. 发明授权

US4890194A A chip carrier and mounting structure connected to the chip carrier 失效
标题翻译：芯片载体和安装结构连接到芯片载体
公开(公告)号：US4890194A
公开(公告)日：1989-12-26
申请号：US161572
申请日：1987-02-28
申请人： Lesli A. Derryberry , Charles E. Williams
发明人： Lesli A. Derryberry , Charles E. Williams
IPC分类号： H05K1/02 , H05K1/14 , H05K1/18 , H05K3/30 , H05K3/34 , H05K3/36
CPC分类号： H05K3/303 , H05K1/141 , H05K3/3436 , H01L2224/48091 , H01L2924/01079 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H05K1/0201 , H05K1/0203 , H05K1/147 , H05K1/189 , H05K2201/049 , H05K2201/09072 , H05K2201/10681 , H05K2201/10727 , H05K2201/2036 , H05K3/363 , Y02P70/613
摘要： A chip carrier including a connecting strip is supported by a thermally conductive spacer block under its center, which provides a mechanical connection to a circuit board. The external contact pads on the underside of the chip carrier are not bonded directly to traces on the board, but instead are bonded to the connecting strip which is formed from a polymer layer having conductive traces thereon. The conductive traces may be bonded to traces on the circuit board.
摘要翻译：包括连接条的芯片载体由其中心处的导热间隔块支撑，其提供与电路板的机械连接。芯片载体下侧的外部接触焊盘不直接粘合到板上的迹线上，而是与由其上具有导电迹线的聚合物层形成的连接条接合。导电迹线可以结合到电路板上的迹线上。

12. 发明授权

US4582047A High humidity steam cooker with continuously running conveyor 失效
标题翻译：高湿度蒸汽锅，连续运行输送机
公开(公告)号：US4582047A
公开(公告)日：1986-04-15
申请号：US60986
申请日：1979-07-26
申请人： Charles E. Williams
发明人： Charles E. Williams
IPC分类号： A47J27/16 , A47J37/04 , A23L3/06
CPC分类号： A47J37/046 , A47J27/16 , A47J37/044 , B65G2207/24
摘要： A steam cooker processes large quantities of food products such as meat, fish, poultry and produce passed therethrough in a spiral conveyor path. The continuously running conveyor is provided with loading and unloading stations outside the cooker and with a continuously operable spray detergent cleaning bath.Efficient cooking is achieved without loss of humidity, flavor or appearance by maintaining water drop free steam at near 100.degree. C. and 100% humidity at a pressure greater than atmospheric and by features of the apparatus including control of steam flow out of the cooking chamber and introduction of cold air thereinto.Two separate steam sources, internal and external, are provided with the internal source comprising a heated pool of water on the floor of the cooker chamber, which is agitated for heat transfer efficiency and to remove fat or drippings from the cooking products.Sanitation means include mounting of machinery parts outside the cooker, access to all sides of the cooking chamber for cleaning, an internal cleaning spray system and other apparatus features.
摘要翻译：蒸汽锅处理大量食品，例如肉，鱼，禽，以及螺旋输送路径中通过的食品。连续运行的输送机在炊具外部设有装卸站，并具有连续可操作的喷雾洗涤剂清洁浴。在高于大气压的压力下，通过将接近100℃和100％湿度的无水蒸气保持在不损失湿度，风味或外观的情况下实现高效烹饪，并且通过该设备的特征包括控制从蒸煮室流出的蒸汽流并引入冷空气。内部和外部两个独立的蒸汽源设置有内部源，其包括在炊具室的地板上的加热的水池，其被搅拌以提供传热效率并且从烹饪产品中去除脂肪或滴落物。卫生设施包括将机器部件安装在炊具外部，进入烹饪室的所有侧面进行清洁，内部清洁喷雾系统和其他设备特征。

13. 发明授权

US4153642A Rubber compositions comprising dibromopolybutadiene and a solid polyamide 失效
标题翻译：包含二溴聚丁二烯和固体聚酰胺的橡胶组合物
公开(公告)号：US4153642A
公开(公告)日：1979-05-08
申请号：US766204
申请日：1977-02-07
申请人： Charles E. Williams
发明人： Charles E. Williams
IPC分类号： C08L15/02 , C08L77/00 , C08L9/00 , C08L63/10 , C08L77/06
CPC分类号： C08L15/02 , C08L77/00 , C08K3/26 , C08K5/01 , C08L63/00 , C08L77/06 , C08L95/00 , Y10T428/31511 , Y10T428/31529 , Y10T428/31681 , Y10T428/31725 , Y10T428/31783
摘要： Described is a rubber composition comprising dibromopolybutadiene and the reaction product between aliphatic polyamines and polycarboxylic acids or anhydrides. The compositions are preferably used as low temperature adhesives or sealers.
摘要翻译：描述了包含二溴聚丁二烯和脂族多胺和多元羧酸或酸酐之间的反应产物的橡胶组合物。组合物优选用作低温粘合剂或密封剂。

14. 发明授权

US06315189B1 Semiconductor package lead plating method and apparatus 有权
标题翻译：半导体封装铅镀方法及装置
公开(公告)号：US06315189B1
公开(公告)日：2001-11-13
申请号：US09417452
申请日：1999-10-13
申请人： Charles E. Williams
发明人： Charles E. Williams
IPC分类号： B23K3102
CPC分类号： H01L21/4821 , Y10T29/53191
摘要： A method and apparatus for uniformly solder plating leads on semiconductor packages wherein the leads are rotated during the solder plating process and the solder on the leads in planarized and solder between and bridging the leads is removed by the application of a hot gas to the device having the leads. The hot gas is preferably N2 which is inert to the process flow at the point in the process when it is utilized.
摘要翻译：用于均匀焊接电镀的方法和装置在半导体封装上引导，其中引线在焊料镀覆过程期间旋转，并且引线上的焊料在平坦化之间并且在引线之间焊接和桥接之间，通过将热气体施加到具有线索。热气体优选为在使用该过程时在工艺流程中为惰性的N 2。

15. 发明授权

US06167937A Seal setting mechanism 失效
标题翻译：密封设定机构
公开(公告)号：US06167937A
公开(公告)日：2001-01-02
申请号：US09132793
申请日：1998-08-13
申请人： Charles E. Williams
发明人： Charles E. Williams
IPC分类号： E06B718
CPC分类号： E06B7/215
摘要： A seal setting mechanism is provided that includes a pair of cross-members and a pair of downwardly extending force transfer members. The cross-members are linked with a linking member. When the cross-members are pivoted downwardly, the force is transferred through the force transfer members to a spring associated with each force transfer member. The spring applies a force on a sealing member. The sealing member is thus pressed against the floor, and held in place by the springs.
摘要翻译：提供一种密封设定机构，其包括一对横向构件和一对向下延伸的力传递构件。交叉构件与连接构件相连。当横向构件向下枢转时，力通过力传递构件传递到与每个力传递构件相关联的弹簧。弹簧对密封件施加力。因此，密封构件被压靠在地板上，并被弹簧保持在适当位置。

16. 发明授权

US06140702A Plastic encapsulation for integrated circuits having plated copper top surface level interconnect 失效
标题翻译：具有电镀铜顶表面级互连的集成电路的塑料封装
公开(公告)号：US06140702A
公开(公告)日：2000-10-31
申请号：US864386
申请日：1997-05-28
申请人： Taylor R. Efland , Dale J. Skelton , Quang X. Mai , Charles E. Williams
发明人： Taylor R. Efland , Dale J. Skelton , Quang X. Mai , Charles E. Williams
IPC分类号： H01L21/60 , H01L23/48
CPC分类号： H01L24/05 , H01L24/48 , H01L2224/04042 , H01L2224/05647 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48647 , H01L2224/48747 , H01L2224/48847 , H01L2224/73265 , H01L24/45 , H01L2924/01004 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1306 , H01L2924/14 , H01L2924/181
摘要： A plastic packaged integrated circuit (20) having a thick copper plated top surface level interconnection structure. A semiconductor integrated circuit (20) is formed having devices at the surface of a semiconductor substrate (23). First and second metallization layers (27, 31) are formed over the substrate and contacting selected ones of said devices. The first and second levels of metallization may be in contact with one another through vias. A thick top surface level metal interconnect layer (35) is then formed over the second metal layer (31), either physically contacting it or selectively electrically contacting it. The surface level metal (35) is fabricated of a highly conductive copper layer. The thick surface level metal layer (35) substantially lowers the resistance of the interconnect metallization of the device (20) and further eliminates current debiasing and early failure location problems experienced with integrated circuits of the prior art. In one embodiment, the copper surface level interconnect layer (35) is coated with a thin barrier layer of material (37) which may receive a bond wire. The entire structure is then encapsulated in a plastic package (22) such that the plastic is in physical contact with the copper interconnect metal (35). The use of the plastic packaging (22) in physical contact with the copper interconnect metal (35) eliminates the need for the passivation layers of the prior art. Other devices and methods are described.
摘要翻译：一种塑料封装集成电路（20），其具有厚镀铜的顶表面级互连结构。半导体集成电路（20）在半导体衬底（23）的表面形成有器件。第一和第二金属化层（27,31）形成在衬底上并且接触选定的所述器件。金属化的第一和第二层可以通过通孔彼此接触。然后在第二金属层（31）上形成厚的顶表面级金属互连层（35），或者物理地接触第二金属层或选择性地电接触它。表面金属（35）由高导电性铜层制成。厚表面金属层（35）基本上降低了器件（20）的互连金属化的电阻，并且进一步消除了现有技术的集成电路所经历的电流去差和早期故障定位问题。在一个实施例中，铜表面水平互连层（35）涂覆有可以接收接合线的材料（37）的薄阻挡层。然后将整个结构封装在塑料封装（22）中，使得塑料与铜互连金属（35）物理接触。与铜互连金属（35）物理接触的塑料封装（22）的使用消除了对现有技术的钝化层的需要。描述其他设备和方法。

17. 发明授权

US6079174A Wall panel having movable cap 有权
标题翻译：墙板有可动盖
公开(公告)号：US6079174A
公开(公告)日：2000-06-27
申请号：US205933
申请日：1998-12-04
申请人： Charles E. Williams , James M. Durand , Yale Shea
发明人： Charles E. Williams , James M. Durand , Yale Shea
IPC分类号： E04B2/82 , E05D15/06 , E05D15/26 , E04H6/00 , E04H14/00
CPC分类号： E04B2/827 , E05D15/0652 , E05D15/26 , E05Y2900/132 , E05Y2900/142
摘要： A vertical movement accommodating apparatus for use with a wall panel includes a cap mounted on a ceiling structure of a room, and a support assembly mounted on a top edge of the wall panel and at least partially disposed within the cap for vertical movement with respect to the cap. The cap is a U-shaped member opening down. The support assembly includes an upper rail, a lower rail, and a truss assembly interconnecting the upper and lower rails. A sealing member is disposed between the upper rail and the cap to provide a sound reducing seal therebetween. The lower rail defines a channel in which a roller mounted on the upper edge of the wall panel is allowed to roll in the longitudinal direction.
摘要翻译：一种与墙板一起使用的垂直运动收纳装置包括安装在房间的天花板结构上的盖和安装在壁板的顶部边缘上并且至少部分地设置在盖中的支撑组件，用于垂直运动相对于这顶帽子。帽子是开口的U形构件。支撑组件包括上轨道，下轨道和互连上轨道和下轨道的桁架组件。密封构件设置在上轨道和盖之间，以在它们之间提供减声密封。下导轨限定了允许安装在壁板的上边缘上的辊沿纵向滚动的通道。

18. 发明授权

US5481834A Fire-rated panel 失效
标题翻译：防火面板
公开(公告)号：US5481834A
公开(公告)日：1996-01-09
申请号：US224953
申请日：1994-04-08
申请人： Stanley Kowalczyk , Todd A. Williams , James D. Petzrick , Charles E. Williams
发明人： Stanley Kowalczyk , Todd A. Williams , James D. Petzrick , Charles E. Williams
IPC分类号： E04B1/94 , E04B2/82 , E06B5/16 , E06B9/04
CPC分类号： E06B5/16 , E04B1/942 , E04B2/827
摘要： A fire resistant panel includes at least four parallel vertically extending sheets of gypsum. The sheets are fastened together in a spaced apart arrangement with two outer sheets and two inner sheets positioned between the outer sheets to define a member having first and second opposite vertically extending sides. Vertically extending sheets of steel are in contact with and cover both sides of the member. The upper support for the member defines a circuitous path from one side of the member to the other. A bottom seal is supported by the member and includes a weight mechanism attached to the bottom seal. The weight is pivotally movable and biases the bottom seal downwardly for engagement with a floor.
摘要翻译：耐火面板包括至少四个平行的垂直延伸的石膏片。片材以间隔布置的方式紧固在一起，其中两个外部片材和位于外部片材之间的两个内部片材以限定具有第一和第二相对的垂直延伸侧面的部件。垂直延伸的钢板与构件的两侧接触并覆盖。构件的上支撑限定了从构件的一侧到另一侧的迂回路径。底部密封件由所述构件支撑并且包括附接到所述底部密封件的重量机构。重物可枢转地移动，并且向下偏压底部密封件以与地板接合。

19. 发明授权

US5181296A Reinforced carrier disc for operable partition system 失效
标题翻译：用于可操作分区系统的加强载体盘
公开(公告)号：US5181296A
公开(公告)日：1993-01-26
申请号：US815380
申请日：1991-12-31
申请人： Charles E. Williams
发明人： Charles E. Williams
IPC分类号： E04G21/14 , E04G21/16 , E05D15/06
CPC分类号： E05D15/0613 , E05Y2900/142 , Y10T16/359 , Y10T16/376 , Y10T16/3831 , Y10T16/3837
摘要： A multidirectional carrier and track generally comprising a disc, a track, and structure on the track defining a disc supporting surface. The disc is supported for rotation about an axis. The disc is in engagement with the disc supporting surface and has first and second ball bearing assemblies. The ball bearing assemblies have inner and outer races, the inner races mounted adjacent one another along the axis. The disc also has an outer cylindrical rim portion, the rim portion have an inner-facing surface, an outer-facing surface and upper and lower surfaces, the inner-facing surface engaging the outer races and the lower surface contacting the track. Structure on the inner-facing surface defines axially spaced faces projecting radially inward towards the axis in step-wise fashion, forming two axially-facing shoulders projecting from the inner-facing surface. The outer races contact the shoulders and are held in the outer rim portion against axial movement in one direction relative to the axis of the support member. A cylindrical reinforcing band surrounds and reinforces the rim portion.

20. 发明授权

US4943844A High-density package 失效
标题翻译：高密度包装
公开(公告)号：US4943844A
公开(公告)日：1990-07-24
申请号：US801029
申请日：1985-11-22
申请人： Alex A. Oscilowski , Charles E. Williams , Gary L. Beene , Peter Zogas
发明人： Alex A. Oscilowski , Charles E. Williams , Gary L. Beene , Peter Zogas
IPC分类号： H01L23/04 , H01L23/52 , H01L23/538 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L23/5385 , H01L25/0652 , H01L2224/49109 , H01L24/49 , H01L2924/00014 , H01L2924/01014 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/1627 , H01L2924/30107 , H01L2924/3011
摘要： A chip carrier with improved packing density, wherein at least one layer of chips is bonded not directly to the substrate, but rather to a heat plate which attaches over the chip cavity and inside the hermetic sealing lid. The heat plate has openings in it to permit attachment of the leads from the chips in the upper layer to bond pads on a bonding ledge inside the cavity of the chip carrier, after the heat plate is emplaced. Each bonding ledge is preferably made somwhat wider than it would otherwise be, and the leads from multiple layers of chips are preferably bonded onto the same bonding ledge.
摘要翻译：具有改进的填充密度的芯片载体，其中至少一层芯片不直接粘合到基底上，而是结合到贴附在芯片空腔和密封密封盖内部的加热板。加热板上有开口以允许引线从上层中的芯片连接到芯片载体的空腔内的接合凸缘上，在加热板放置之后。每个接合凸缘优选地制成比其它情况更宽的波长，并且来自多层芯片的引线优选地结合到相同的接合凸缘上。

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