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    • 12. 发明申请
    • HIGH THROUGHPUT MULTI-WAFER EPITAXIAL REACTOR
    • 高通量多波长外延反应器
    • US20100263587A1
    • 2010-10-21
    • US12713116
    • 2010-02-25
    • Visweswaren SivaramakrishnanKedarnath SangamTirunelveli S. RaviAndrzej KaszubaQuoc Vinh Truong
    • Visweswaren SivaramakrishnanKedarnath SangamTirunelveli S. RaviAndrzej KaszubaQuoc Vinh Truong
    • C30B25/10C30B25/08
    • C30B25/12C30B25/08C30B25/105C30B35/005
    • An epitaxial reactor enabling simultaneous deposition of thin films on a multiplicity of wafers is disclosed. During deposition, a number of wafers are contained within a wafer sleeve comprising a number of wafer carrier plates spaced closely apart to minimize the process volume. Process gases flow preferentially into the interior volume of the wafer sleeve, which is heated by one or more lamp modules. Purge gases flow outside the wafer sleeve within a reactor chamber to minimize deposition on the walls of the chamber. In addition, sequencing of the illumination of the individual lamps in the lamp module may further improve the linearity of variation in deposition rates within the wafer sleeve. To improve uniformity, the direction of process gas flow may be varied in a cross-flow configuration. Combining lamp sequencing with cross-flow processing in a multiple reactor system enables high throughput deposition with good film uniformities and efficient use of process gases.
    • 公开了一种能够在多个晶片上同时沉积薄膜的外延反应器。 在沉积期间,许多晶片被包含在晶片套筒内,其包括间隔开的多个晶片承载板,以最小化处理体积。 工艺气体优先流入由一个或多个灯模块加热的晶片套筒的内部容积。 吹扫气体在反应器室内的晶片套筒外部流动,以最小化腔室壁上的沉积。 此外,灯模组中各灯的照明顺序可以进一步提高晶片套筒内沉积速率变化的线性。 为了改善均匀性,工艺气体流动的方向可以在横流构型中变化。 将灯排序与多反应器系统中的交叉流处理相结合,可实现高通量沉积,具有良好的膜均匀性和有效利用工艺气体。