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    • 14. 发明授权
    • Method for evaluating processing parameters in the manufacture of
semiconductor devices
    • 用于评估半导体器件制造中的处理参数的方法
    • US4782288A
    • 1988-11-01
    • US946239
    • 1986-12-24
    • Giuseppe Vento
    • Giuseppe Vento
    • G01R17/02G01R17/00G01R31/00
    • G01R17/02
    • This method, allowing pointing out of the effects of one manufacture parameter independently from other parameters and phenomena and yielding very high precision in measurement, comprises a first step in which a symmetrical resistive bridge is formed, comprising a pair of test resistive arms having topological characteristics related to the process or phenomenon to be evaluated and a pair of reference resistive arms. Each pair of arms is formed by two reciprocally counterposed resistors with identical topography and value. The method furthermore comprises a second step in which a current, having a known value, is applied to the bridge, the voltages present in suitable points of the bridge are measured, and the difference in conductance between the pair of test resistive arms and the reference arms is calculated according to the known or calculated current and voltage values.
    • 该方法能够独立于其他参数和现象指出一个制造参数的影响并产生非常高的测量精度,包括形成对称电阻桥的第一步骤,包括具有拓扑特性的一对测试电阻臂 与待评估的过程或现象有关,以及一对参考电阻臂。 每对臂由具有相同形貌和值的两个相互对置的电阻器形成。 该方法还包括第二步骤,其中具有已知值的电流施加到桥接器,测量存在于桥接器的适当点中的电压,并且测量电阻臂对与参考电压之间的电导差 根据已知或计算的电流和电压值计算臂。