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181. 发明授权

US08664773B2 Mounting structure of semiconductor package component and manufacturing method therefor 有权
标题翻译：半导体封装部件的安装结构及其制造方法
公开(公告)号：US08664773B2
公开(公告)日：2014-03-04
申请号：US13477524
申请日：2012-05-22
申请人： Atsushi Yamaguchi , Hideyuki Tsujimura , Hiroe Kowada , Ryo Kuwabara , Naomichi Ohashi
发明人： Atsushi Yamaguchi , Hideyuki Tsujimura , Hiroe Kowada , Ryo Kuwabara , Naomichi Ohashi
IPC分类号： H01L21/58 , H01L21/60 , H01L23/488
CPC分类号： H01L23/315 , H01L23/3157 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/14131 , H01L2224/14136 , H01L2224/16238 , H01L2224/29017 , H01L2224/29035 , H01L2224/29082 , H01L2224/29083 , H01L2224/2919 , H01L2224/30155 , H01L2224/32225 , H01L2224/73203 , H01L2224/81143 , H01L2224/81193 , H01L2224/81411 , H01L2224/81815 , H01L2224/831 , H01L2224/83862 , H01L2224/9221 , H01L2924/01047 , H01L2924/01029 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00012 , H01L2924/0665
摘要： A manufacturing method for a mounting structure of a semiconductor package component, including: applying a first adhesive with viscosity η1 and a thixotropy index T1 at a position on the substrate, which is on an outer side of the mounted semiconductor package component; applying, on the first adhesive, a second adhesive with viscosity η2 and a thixotropy index T2 so that the second adhesive gets in contact with an outer periphery part of the semiconductor package component; and forming, through a subsequent reflow process, a first adhesive part of the hardened first adhesive and a second adhesive part of the hardened second adhesive, wherein the first and second adhesives satisfy 30≦η2≦η1≦300 (Pa·s) and 3≦T2≦T1≦7, and sectional area S1 of the first adhesive part and sectional area S2 of the second adhesive part with respect to a direction perpendicular to a mounting surface of the substrate satisfy a relation S1≦S2.
摘要翻译：一种半导体封装件的安装结构的制造方法，包括：在安装的半导体封装部件的外侧的基板上的位置处施加粘度eta1和触变指数T1的第一粘合剂; 在第一粘合剂上施加具有粘度eta2和触变指数T2的第二粘合剂，使得第二粘合剂与半导体封装部件的外周部分接触; 并且通过随后的回流工艺形成所述硬化的第一粘合剂的第一粘合部分和所述硬化的第二粘合剂的第二粘合部分，其中所述第一和第二粘合剂满足30（Pa·s）和3 @ T2 @ T1 @ 7，第一粘合部分的截面面积S1和第二粘合部分相对于垂直于基板的安装表面的方向的截面面积S2满足关系S1 @ S2。

182. 发明申请

US20130070364A1 THIN FILM MAGNETIC HEAD AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：薄膜磁头及其制造方法
公开(公告)号：US20130070364A1
公开(公告)日：2013-03-21
申请号：US13233092
申请日：2011-09-15
申请人： Yuji Matsuura , Atsushi Yamaguchi , Tetsuji Hori , Naoto Matono
发明人： Yuji Matsuura , Atsushi Yamaguchi , Tetsuji Hori , Naoto Matono
IPC分类号： G11B5/17 , G11B21/02 , G11B5/127 , G11B5/48
CPC分类号： G11B5/3123 , G11B5/1278 , G11B5/3163 , Y10T29/49032
摘要： A thin film magnetic head of the present invention is configured to include a main pole layer; a main pole direct junction magnetic layer that has an auxiliary pole layer and an auxiliary yoke layer, the main pole direct junction magnetic layer being directly joined to the main pole layer in a state where a recording gap layer is partially intervened near an air bearing surface (ABS) with respect to the main pole layer; and a first magnetic recording exciting coil that is buried between the auxiliary pole layer and the auxiliary yoke layer configuring the main magnetic direct junction magnetic layer with an insulating layer therebetween. Thereby, an effective magnetic path length can be shortened in order to improve the high-frequency characteristics, and furthermore, simplification of the manufacturing processes becomes possible.
摘要翻译：本发明的薄膜磁头构造成包括主极层; 具有辅助极层和辅助磁轭层的主极直接结磁性层，在记录间隙层部分地插入到空气轴承表面的状态下，主极直接结磁性层直接接合到主极层（ABS）相对于主极层; 以及第一磁记录励磁线圈，其被埋在辅助极层和构成主磁性直接结磁性层的辅助磁轭层之间，其间具有绝缘层。由此，为了提高高频特性，可以缩短有效的磁路长度，进而可以简化制造工序。

183. 发明授权

US08345268B2 Beam irradiation device 有权
标题翻译：光束照射装置
公开(公告)号：US08345268B2
公开(公告)日：2013-01-01
申请号：US12907828
申请日：2010-10-19
申请人： Atsushi Yamaguchi , Yoshiaki Maeno , Hiroyuki Mutou
发明人： Atsushi Yamaguchi , Yoshiaki Maeno , Hiroyuki Mutou
IPC分类号： G01B11/14
CPC分类号： G01B11/026 , G01S7/4814 , G01S7/497 , G01S17/42
摘要： A beam irradiation device includes a photodetector which receives servo light and outputs a detection signal depending on a light receiving position of the servo light, and a signal processing section which obtains the light receiving position based on the detection signal. In the above arrangement, the signal processing section has an A/D conversion circuit which converts the detection signal into a digital signal, and an error signal adjusting circuit which converts an error component signal to be outputted from the photodetector when the photodetector is not irradiated by the servo light, into a signal within a processable range of the A/D conversion circuit, and supplies the converted signal to the A/D conversion circuit. A first digital signal derived from the detection signal is corrected with a second digital signal derived from the error component signal.
摘要翻译：光束照射装置包括：光电检测器，其接收伺服光并根据伺服光的光接收位置输出检测信号;以及信号处理部，其基于检测信号获得光接收位置。在上述结构中，信号处理部分具有将检测信号转换为数字信号的A / D转换电路和误差信号调节电路，当光电检测器未被照射时，将误差分量信号转换成从光电检测器输出的误差分量信号通过伺服光进入A / D转换电路的可处理范围内的信号，并将转换的信号提供给A / D转换电路。从检测信号导出的第一数字信号用从误差分量信号导出的第二数字信号来校正。

184. 发明授权

US08344268B2 Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the same 有权
标题翻译：具有双层防潮涂层的电子部件包装结构及其制造方法
公开(公告)号：US08344268B2
公开(公告)日：2013-01-01
申请号：US12496017
申请日：2009-07-01
申请人： Hideyuki Tsujimura , Hidenori Miyakawa , Atsushi Yamaguchi , Hiroe Kowada , Koso Matsuno
发明人： Hideyuki Tsujimura , Hidenori Miyakawa , Atsushi Yamaguchi , Hiroe Kowada , Koso Matsuno
IPC分类号： H05K1/11
CPC分类号： H05K3/288 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K3/284 , H05K2201/09872 , H05K2201/0989 , H05K2203/0783 , H05K2203/1322 , Y10T29/49146 , H01L2224/0401
摘要： An electronic component packaging structure includes a circuit board, electronic components mounted on the circuit board and a moisture-proof coating layer covering the electronic components. The moisture-proof coating layer is constituted from a polymer material coating having at least two layers of a lower layer and an upper layer, and the polymer material forming the lower layer has higher swelling property and/or solubility to a repairing solvent that is selected from among hydrocarbon-based solvents than the polymer material forming the upper layer.
摘要翻译：电子部件封装结构包括电路板，安装在电路板上的电子部件和覆盖电子部件的防潮涂层。防潮涂层由具有至少两层下层和上层的聚合物材料涂层构成，形成下层的聚合物材料具有较高的溶胀性和/或对所选择的修补溶剂的溶解性与烃类溶剂相比，形成上层的聚合物材料。

185. 发明授权

US08319108B2 Mounting structure and electronic equipment 有权
标题翻译：安装结构和电子设备
公开(公告)号：US08319108B2
公开(公告)日：2012-11-27
申请号：US12535760
申请日：2009-08-05
申请人： Atsushi Yamaguchi , Koso Matsuno , Ryo Kuwabara , Hiroe Kowada , Kimiaki Nakaya
发明人： Atsushi Yamaguchi , Koso Matsuno , Ryo Kuwabara , Hiroe Kowada , Kimiaki Nakaya
IPC分类号： H05K7/20
CPC分类号： H05K3/305 , H01L21/563 , H01L21/565 , H01L23/295 , H01L23/3121 , H01L23/3135 , H01L24/75 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16237 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01029 , H01L2924/181 , H01L2924/351 , H05K1/0203 , H05K2201/0209 , H05K2201/0269 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , Y10T428/24372 , H01L2224/16225 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A mounting structure formed by bonding the electrodes of a substantially planar electronic component to the electrodes provided on the mounting surface of a circuit board includes a sealing body 5 formed between one main surface of the electronic component and the circuit board and/or on the other main surface of the electronic component. The sealing body 5 is composed of a plurality of layers having different adhesive strengths and thermal conductivities, wherein a layer having a relatively high adhesion strength is arranged in a region being in contact with either one of the electronic component and the circuit board, and a layer having a relatively high thermal conductivity is arranged in a region being in contact with none of the electronic component and the circuit board.
摘要翻译：通过将基本上平面的电子部件的电极接合到设置在电路基板的安装面上的电极而形成的安装结构包括形成在电子部件的一个主面和电路基板之间和/或另一个之间的密封体5 电子元件的主表面。密封体5由具有不同粘合强度和导热性的多个层组成，其中具有相对较高粘合强度的层被布置在与电子部件和电路板中的任一个接触的区域中，并且在与电子部件和电路基板没有接触的区域中布置具有较高热传导率的层。

186. 发明授权

US08304795B2 Semiconductor light emitting device with concave-convex pattern and method for manufacturing the same 有权
标题翻译：具有凹凸图案的半导体发光器件及其制造方法
公开(公告)号：US08304795B2
公开(公告)日：2012-11-06
申请号：US12087173
申请日：2006-12-28
申请人： Atsushi Yamaguchi , Ken Nakahara
发明人： Atsushi Yamaguchi , Ken Nakahara
IPC分类号： H01L33/00
CPC分类号： H01L33/42 , H01L33/20 , H01L33/44 , H01L2933/0083
摘要： A semiconductor lamination portion (6) is formed by laminating nitride semiconductor layers including an n-type layer (3) and a p-type layer (5) on one side of a substrate (1) so as to form a light emitting layer, and a light transmitting conductive layer (7) is provided at a surface side of the semiconductor lamination portion. A concave-convex pattern, i.e., concaves (7a), is provided on a surface of the light transmitting conductive layer. A p-side electrode (8) is provided on the light transmitting conductive layer, and an n-side electrode (9) is electrically connected to the n-type layer exposed by etching a part of the semiconductor lamination portion. Light emitted from the light emitting layer is therefore totally reflected repeatedly in the semiconductor lamination portion and the substrate and can be effectively taken out without attenuation, so external quantum efficiency can be improved.
摘要翻译：通过在衬底（1）的一侧层叠包括n型层（3）和p型层（5）的氮化物半导体层以形成发光层，形成半导体层叠部（6）并且在半导体层叠部的表面侧设置有透光性导电层（7）。在透光导电层的表面上设置凹凸图案，即凹部（7a）。 p侧电极（8）设置在透光导电层上，n侧电极（9）与通过蚀刻半导体层叠部分的一部分露出的n型层电连接。因此，从半导体层叠部和基板反射全反射从发光层发出的光，能够有效地取出而不衰减，能够提高外部的量子效率。

187. 发明申请

US20120237827A1 POROUS METAL BODY, METHOD FOR PRODUCING THE SAME, AND MOLTEN-SALT BATTERY 审中-公开
标题翻译：多孔金属体，其制造方法和盐酸电池
公开(公告)号：US20120237827A1
公开(公告)日：2012-09-20
申请号：US13368643
申请日：2012-02-08
申请人： Atsushi FUKUNAGA , Shinji Inazawa , Masatoshi Majima , Atsushi Yamaguchi , Koji Nitta , Shoichiro Sakai
发明人： Atsushi FUKUNAGA , Shinji Inazawa , Masatoshi Majima , Atsushi Yamaguchi , Koji Nitta , Shoichiro Sakai
IPC分类号： H01M4/38 , B32B15/01 , B32B5/18
CPC分类号： C23C28/023 , C25D1/006 , C25D3/30 , C25D3/44 , C25D3/66 , H01M4/661 , H01M4/808 , H01M10/399 , Y10T428/12479
摘要： A porous metal body includes a porous skeleton that forms a three-dimensional network structure and includes an aluminum layer having a thickness of 1 to 100 μm, and tin layers disposed on an internal surface and an external surface of the aluminum layer. Such a porous metal body can be produced by an internal-tin-layer formation step of forming a tin layer on a surface of a resin molded body having a three-dimensional network structure; an aluminum-skeleton formation step of forming an aluminum layer serving as an aluminum skeleton on a surface of the internal tin layer; an external-tin-layer formation step of forming a tin layer on a surface of the aluminum skeleton; and a resin removal step of removing the resin molded body, the resin removal step being performed after the aluminum-skeleton formation step or after the external-tin-layer formation step.
摘要翻译：多孔金属体包括形成三维网状结构的多孔骨架，并且包括厚度为1〜100μm的铝层和设置在铝层的内表面和外表面上的锡层。这种多孔金属体可以通过在具有三维网状结构的树脂成型体的表面上形成锡层的内锡层形成工序来制造; 在所述内部锡层的表面上形成作为铝骨架的铝层的铝骨架形成工序; 在铝骨架的表面上形成锡层的外锡层形成工序; 以及去除树脂成形体的树脂除去工序，在铝 - 骨架形成工序之后或在外部锡层形成工序之后进行树脂除去工序。

188. 发明授权

US08243387B2 Magnetic head with plated magnetic film formed on PdNi alloy electrode film 有权
标题翻译：磁头与PdNi合金电极膜上形成镀覆磁性膜
公开(公告)号：US08243387B2
公开(公告)日：2012-08-14
申请号：US11733469
申请日：2007-04-10
申请人： Atsushi Yamaguchi , Kiyoshi Noguchi , Shingo Miyata , Masashi Sano
发明人： Atsushi Yamaguchi , Kiyoshi Noguchi , Shingo Miyata , Masashi Sano
IPC分类号： G11B5/31
CPC分类号： G11B5/3116 , G11B5/1278 , G11B5/3133 , G11B5/3163
摘要： The present invention relates to a perpendicular recording magnetic head. A perpendicular recording element includes a main magnetic pole film for emitting a perpendicular magnetic field and is supported by a slider. The main magnetic pole film includes an electrode film and a plated film, the electrode film is an alloy film of at least one element selected from the platinum group and Ni, and the plated film is a magnetic film grown on the electrode film.
摘要翻译：本发明涉及一种垂直记录磁头。垂直记录元件包括用于发射垂直磁场并由滑块支撑的主磁极膜。主磁极膜包括电极膜和电镀膜，电极膜是选自铂族和Ni中的至少一种元素的合金膜，电镀膜是在电极膜上生长的磁性膜。

189. 发明申请

US20110316553A1 ABNORMALITY DETECTION SYSTEM 有权
标题翻译：异常检测系统
公开(公告)号：US20110316553A1
公开(公告)日：2011-12-29
申请号：US13189960
申请日：2011-07-25
申请人： Yuichi Taguchi , Tsuyoshi Koike , Atsushi Yamaguchi
发明人： Yuichi Taguchi , Tsuyoshi Koike , Atsushi Yamaguchi
IPC分类号： G01R31/00
CPC分类号： B60L11/182 , B60L3/00 , B60L2270/36 , Y02T10/7005 , Y02T10/7072 , Y02T10/7088 , Y02T90/122 , Y02T90/14
摘要： The abnormality detection system is provided for detecting an abnormality of an object. The abnormality detection system includes a high-frequency power source, a primary coil, a secondary coil and a controller. The high-frequency power source supplies power. The primary coil receives the power supplied from the high-frequency power source. The secondary coil is mounted to the object in noncontact with the primary coil for receiving power supplied from the primary coil. The controller is operable to detect the power received by the secondary coil and also to determine whether or not an abnormality is present in the object based on the detected power.
摘要翻译：异常检测系统用于检测物体的异常。异常检测系统包括高频电源，初级线圈，次级线圈和控制器。高频电源供电。初级线圈接收从高频电源提供的电力。次级线圈以与初级线圈非接触的方式安装到物体上，用于接收从初级线圈提供的功率。控制器可操作以检测由次级线圈接收的功率，并且还基于检测到的功率来确定对象中是否存在异常。

190. 发明申请

US20110252911A1 Work Vehicle 有权
标题翻译：工作车辆
公开(公告)号：US20110252911A1
公开(公告)日：2011-10-20
申请号：US13061867
申请日：2010-03-03
申请人： Daisuke Kobayashi , Tatsuyuki Kashimoto , Makoto Saegusa , Mikio Ishida , Atsushi Yamaguchi
发明人： Daisuke Kobayashi , Tatsuyuki Kashimoto , Makoto Saegusa , Mikio Ishida , Atsushi Yamaguchi
IPC分类号： B60K20/06 , F16H59/10
CPC分类号： B60K20/06 , B60Y2200/221 , E02F9/2004 , F16H59/0278 , Y10T74/20146
摘要： There are provided a forward/reverse switchover lever pivotally operably about, as a pivotal center, a position which is inwardly of an outer periphery of a steering wheel and laterally outer side of vehicle body of a rotational axis of the steering wheel as seen in a direction along the rotational axis and a pivotal support shaft pivotally supporting the forward/reverse switchover lever at a position lower than the steering wheel such that a pivotal end of the forward/reverse switchover lever projects to the laterally outer side beyond the outer periphery of the steering wheel.
摘要翻译：提供了一个向前/向后切换杆，其可枢转地操作地围绕作为枢转中心的位置，该位置在方向盘的外周边的内侧和方向盘的旋转轴线的车体横向外侧，如沿着旋转轴线的方向和枢转支撑轴，其将前进/后退切换杆枢转地支撑在比方向盘低的位置，使得前进/倒退切换杆的枢转端部突出到外侧的外侧方向盘。

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