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    • 145. 发明授权
    • SYSTEM FOR MULTISPECTRAL IMAGING
    • 中多光谱图像
    • EP1952106B1
    • 2014-08-27
    • EP06836846.3
    • 2006-11-02
    • Themelis, George
    • Themelis, George
    • G01J3/36G01J3/28G06T1/00G01J3/51
    • G01J3/2823G01J3/36G01J3/51G01J3/513G01J2003/2806G01J2003/2826
    • Apparatus and method for multispectral imaging of an object (180). The apparatus comprises a multispectral light source adapted to transmit multispectral light (174,176) having a plurality of first discrete spectral bands toward the object, wherein the light source is adapted to excite emission of fluorescent light (178c) from the object; and a multispectral imaging system adapted to receive light from the object, wherein the light comprises a reflected light component (178a) in accordance with the transmitted light, wherein the reflected light component has the plurality of first discrete spectral bands, and a fluorescent light component (178c). The imaging system is adapted to measure the intensity of a combination of the received reflected light component and the received fluorescent light component at the plurality of first discrete spectral bands, and the intensity of the received fluorescent light at one or more second discrete spectral bands, which are not aligned with the plurality of first discrete spectral bands. The multispectral imaging system comprises a processor adapted to separate the intensity of the received reflected light component and the intensity of the received fluorescent light component based on the intensities measured at the plurality of first discrete spectral bands and the one or more second discrete spectral bands, and to generate one or more reflected light spectral images from the separated intensity of the reflected light component and/or one or more fluorescent light spectral images from the separated intensity of the fluorescent light component.
    • 146. 发明公开
    • Integrated circuit for spectral imaging system
    • Integrierte Schaltungfürspektrales Abbildungsystem
    • EP2522968A1
    • 2012-11-14
    • EP12175335.4
    • 2010-11-30
    • IMEC
    • Tack, KlaasLambrechts, AndyHaspeslagh, Luc
    • G01J3/26G01J3/28G01J3/12
    • G01J3/2823G01J3/12G01J3/26G01J3/2803G01J2003/1226G01J2003/265G01J2003/2806G01J2003/2826H04N5/332H04N5/378
    • An integrated circuit for an imaging system has an array of optical sensors (40), and an array of optical filters (10) each configured to pass a band of wavelengths onto one or more of the sensors, the array of optical filters being integrated with the array of sensors, and the integrated circuit also having read out circuitry (30) to read out pixel values from the array of sensors to represent an image, different ones of the optical filters being configured to have a different thickness, to pass different bands of wavelengths by means of interference, to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.
    • 一种用于成像系统的集成电路具有光学传感器阵列(40)和每个被配置成将波长带传递到一个或多个传感器上的滤光器阵列(10),所述滤光器阵列与 所述传感器阵列和所述集成电路还具有读出电路(30),以从所述传感器阵列中读出像素值以表示图像,所述不同的所述滤光器被配置为具有不同的厚度以通过不同的带 的波长,以允许检测波长的光谱。 读出电路可以使一个光学滤波器下的多个像素平行读出。 厚度可以在整个阵列上单调变化。 读出或稍后的图像处理可能涉及波长之间的选择或插值,以进行频谱采样或移位,以补偿厚度误差。