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141. 发明申请

US20100065817A1 Memory device and method of fabricating the same 有权
标题翻译：存储器件及其制造方法
公开(公告)号：US20100065817A1
公开(公告)日：2010-03-18
申请号：US12318502
申请日：2008-12-30
申请人： Seung-Hyun Lee
发明人： Seung-Hyun Lee
IPC分类号： H01L29/12 , H01L21/20
CPC分类号： H01L51/0048 , B82Y10/00 , H01L27/285 , H01L51/0583 , Y10S977/742 , Y10S977/762
摘要： A memory device includes a first electrode, a second electrode spaced apart from the first electrode and a nanotube or nanowire network disposed between the first electrode and the second electrode, having a heterojunction structure of a P-type network and an N-type network, and having a diode characteristic. Since the nanotube or nanowire network has the heterojunction structure of the P-type network and the N-type network, and has the diode characteristic, it is possible to enhance a degree of integration of the memory device and simplify the fabrication processes without separately requiring a selection device.
摘要翻译：存储器件包括第一电极，与第一电极间隔开的第二电极和布置在第一电极和第二电极之间的纳米管或纳米线网络，具有P型网络和N型网络的异质结结构，并具有二极管特性。由于纳米管或纳米线网络具有P型网络和N型网络的异质结结构，并且具有二极管特性，因此可以提高存储器件的集成度并简化制造工艺，而无需单独要求选择装置。

142. 发明授权

US07598617B2 Stack package utilizing through vias and re-distribution lines 有权
标题翻译：堆叠包通过通孔和再分配线路
公开(公告)号：US07598617B2
公开(公告)日：2009-10-06
申请号：US11647703
申请日：2006-12-29
申请人： Seung Hyun Lee , Min Suk Suh
发明人： Seung Hyun Lee , Min Suk Suh
IPC分类号： H01L23/02 , H01L23/48 , H01L23/12 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L25/0657 , H01L23/481 , H01L24/45 , H01L24/48 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05024 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05548 , H01L2224/05647 , H01L2224/06181 , H01L2224/16145 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A stack package includes a printed circuit board; at least two semiconductor chips stacked on the printed circuit board, each having first re-distribution lines formed on the upper surface thereof and connected to bonding pads, through silicon vias which are formed therethrough and connected to the first re-distribution lines, and second re-distribution lines formed on the lower surface thereof and connected to the through silicon vias; first and second solder balls interposed between the first and second re-distribution lines which face each other and between the first re-distribution lines of the lowermost semiconductor chip and electrode terminals of the printed circuit board; a molding material for molding the upper surface of the printed circuit board including the stacked semiconductor chips; and third solder balls attached to ball lands formed on the lower surface of the printed circuit board.
摘要翻译：堆叠包装包括印刷电路板; 堆叠在印刷电路板上的至少两个半导体芯片，每个半导体芯片具有形成在其上表面上的第一重新分配线，并且通过形成在其中并连接到第一再分配线的硅通孔连接到接合焊盘，第二再分配线形成在其下表面并连接到通孔硅通孔; 介于第一和第二再分配线之间的第一和第二焊球，它们彼此相对并且在最下半导体芯片的第一重新分配线与印刷电路板的电极端之间; 用于模制包括堆叠的半导体芯片的印刷电路板的上表面的模制材料; 以及附接到形成在印刷电路板的下表面上的球场的第三焊球。

143. 发明申请

US20090224392A1 SEMICONDUCTOR PACKAGE HAVING SIDE WALLS AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有侧壁的半导体封装及其制造方法
公开(公告)号：US20090224392A1
公开(公告)日：2009-09-10
申请号：US12261112
申请日：2008-10-30
申请人： Min Suk SUH , Seung Taek YANG , Seung Hyun LEE , Jong Hoon KIM
发明人： Min Suk SUH , Seung Taek YANG , Seung Hyun LEE , Jong Hoon KIM
IPC分类号： H01L21/50 , H01L23/48 , H01L23/04
CPC分类号： H01L23/4334 , H01L21/568 , H01L21/6835 , H01L23/3114 , H01L23/525 , H01L24/19 , H01L2221/68345 , H01L2221/68359 , H01L2224/04105 , H01L2224/20 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2924/15311
摘要： A semiconductor package includes a semiconductor chip having an upper surface, side surfaces connected with the upper surface, and bonding pads formed on the upper surface. A first insulation layer pattern is formed to cover the upper surface and the side surfaces of the semiconductor chip and expose the bonding pads. Re-distribution lines are placed on the first insulation layer pattern and include first re-distribution line parts and second re-distribution line parts. The first re-distribution line parts have an end connected with the bonding pads and correspond to the upper surface of the semiconductor chip and the second re-distribution line parts extend from the first re-distribution line parts beyond the side surfaces of the semiconductor chip. A second insulation layer pattern is formed over the semiconductor chip and exposes portions of the first re-distribution line parts and the second re-distribution line parts.
摘要翻译：半导体封装包括具有上表面的半导体芯片，与上表面连接的侧表面，以及形成在上表面上的焊盘。形成第一绝缘层图案以覆盖半导体芯片的上表面和侧表面并且暴露接合焊盘。再分配线路放置在第一绝缘层图案上，并且包括第一再分配线部分和第二再分配线部分。第一再分配线部分具有与接合焊盘连接的端部并且对应于半导体芯片的上表面，并且第二再分配线部分从第一再分配线部分延伸超过半导体芯片的侧表面。在半导体芯片上形成第二绝缘层图案，并且暴露出第一再分配线部分和第二再分配线部分的部分。

144. 发明申请

US20090152708A1 SUBSTRATE FOR HIGH SPEED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVING THE SAME 审中-公开
标题翻译：用于高速半导体封装的基板和具有该高速半导体封装的半导体封装
公开(公告)号：US20090152708A1
公开(公告)日：2009-06-18
申请号：US12049661
申请日：2008-03-17
申请人： Woong Sun LEE , Qwan Ho CHUNG , Il Hwan CHO , Sang Joon LIM , Jong Woo YOO , Jin Ho BAE , Seung Hyun LEE
发明人： Woong Sun LEE , Qwan Ho CHUNG , Il Hwan CHO , Sang Joon LIM , Jong Woo YOO , Jin Ho BAE , Seung Hyun LEE
IPC分类号： H01L23/498
CPC分类号： H01L23/5384 , H01L23/5386 , H01L24/29 , H01L24/48 , H01L25/0657 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/29387 , H01L2224/2939 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73253 , H01L2224/83007 , H01L2224/83138 , H01L2225/06517 , H01L2225/06572 , H01L2225/06575 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed.
摘要翻译：用于半导体封装的衬底包括具有第一表面和与第一表面相对的第二表面的衬底本体。在第一表面的边缘附近形成连接垫。形成具有导电通孔和第一，第二和第三线部分的信号线。第一线部分形成在第一表面上并且连接到穿过基板主体的连接焊盘和导电通孔。第二线部分形成在第一表面上并连接到导电通孔。第三线部分形成在第二表面上并连接到导电通孔。第二和第三线部分形成为具有基本相同的长度。半导体封装利用上述基板高速处理数据。

145. 发明授权

US07534545B2 Method of making an organic light emitting display device 失效
标题翻译：制造有机发光显示装置的方法
公开(公告)号：US07534545B2
公开(公告)日：2009-05-19
申请号：US11511021
申请日：2006-08-28
申请人： Tae Min Kang , Jin Soo Kim , Mu Hyun Kim , Sun Hoe Kim , Noh Min Kwak , Sang Bong Lee , Seong Taek Lee , Seung Hyun Lee , Sok Won Noh , Jin Wook Seong , Myung Won Song , Yeun Joo Sung , Byeong Wook Yoo
发明人： Tae Min Kang , Jin Soo Kim , Mu Hyun Kim , Sun Hoe Kim , Noh Min Kwak , Sang Bong Lee , Seong Taek Lee , Seung Hyun Lee , Sok Won Noh , Jin Wook Seong , Myung Won Song , Yeun Joo Sung , Byeong Wook Yoo
IPC分类号： G03C8/00
CPC分类号： B41M5/265 , B41M5/38221 , H01L51/0013
摘要： A laser induced thermal imaging (LITI) apparatus and a method of making an electronic device using the same are disclosed. The LITI apparatus includes a chamber, a substrate support, a contact frame, and a laser source or oscillator. The LITI apparatus transfers a transferable layer from a film donor device onto a surface of an intermediate electronic device. The LITI apparatus uses a magnetic force to provide a close contact between the transferable layer and the surface of the intermediate device. The magnetic force is generated by magnetic materials formed in two components of the LITI apparatus that are spaced apart interposing transferable layer and the surface of the intermediate device. Magnets or magnetic materials are formed in the two following components of the LITI apparatus: 1) the intermediate device and the film donor device; 2) the intermediate device and the contact frame; 3) the substrate support and the film donor device; or 4) the substrate support and the contact frame.
摘要翻译：公开了一种激光诱导热成像（LITI）装置和使用其的电子装置的制造方法。 LITI装置包括腔室，衬底支撑件，接触框架和激光源或振荡器。 LITI装置将可转移层从成膜剂装置转移到中间电子装置的表面上。 LITI装置使用磁力来提供可转移层与中间装置的表面之间的紧密接触。磁力由形成在LITI装置的两个部件中的磁性材料产生，该两个部件是间隔开的中间转印层和中间装置的表面。在LITI装置的以下两个部件中形成磁体或磁性材料：1）中间装置和薄膜供体装置; 2）中间装置和接触框架; 3）基底支撑体和薄膜供体装置; 或4）衬底支撑件和接触框架。

146. 发明申请

US20090040977A1 APPARATUS AND METHOD FOR SCHEDULING IN CONSIDERATION OF SERVICE CONNECTION TIME DURATION (SCTD) IN MOBILE COMMUNICATION SYSTEM 有权
标题翻译：在移动通信系统中考虑服务连接时间延迟（SCTD）的设备和方法
公开(公告)号：US20090040977A1
公开(公告)日：2009-02-12
申请号：US12187893
申请日：2008-08-07
申请人： Seung-Hyun LEE
发明人： Seung-Hyun LEE
IPC分类号： H04Q7/20
CPC分类号： H04W72/1257 , H04W72/1284
摘要： An apparatus and a method for scheduling in consideration of a Service Connection Time Duration (SCTD) in a mobile communication system. The apparatus includes a User Equipment (UE) for transmitting a Media Access Control (MAC) Protocol Data Unit (PDU) including an SCTD measured by counting a connection time to receive an uplink service through a high speed data transmission, and a Base Transceiver Station (BTS) for receiving the MAC PDU including the SCTD from the UE, allocating a priority by considering the SCTD, and allocating radio resources based on the priority.
摘要翻译：考虑到移动通信系统中的服务连接时间持续时间（SCTD）的调度的装置和方法。该装置包括用于发送媒体接入控制（MAC）协议数据单元（PDU）的用户设备（UE），该媒体接入控制（MAC）协议数据单元（PDU）包括通过计数通过高速数据传输接收上行链路服务的连接时间而测量的SCTD，以及基站收发台（BTS），用于从UE接收包括SCTD的MAC PDU，通过考虑SCTD分配优先级，并且基于优先级分配无线电资源。

147. 发明授权

US07486014B2 Electron emission device and electron emission display using the electron emission device 失效
标题翻译：电子发射装置和使用电子发射装置的电子发射显示
公开(公告)号：US07486014B2
公开(公告)日：2009-02-03
申请号：US11443067
申请日：2006-05-31
申请人： Seong-Yeon Hwang , Seung-Hyun Lee
发明人： Seong-Yeon Hwang , Seung-Hyun Lee
IPC分类号： H01J1/30
CPC分类号： H01J31/127 , H01J1/304
摘要： An electron emission device includes a first electrode disposed on a substrate, an electron emission region electrically coupled to the first electrode, and a second electrode spaced apart from the first electrode, wherein the first electrode includes an opening and an extension that projects into the opening, and the electron emission region is electrically coupled to the first electrode by the extension.
摘要翻译：电子发射装置包括设置在基板上的第一电极，电耦合到第一电极的电子发射区域和与第一电极间隔开的第二电极，其中第一电极包括突出到开口中的开口和延伸部分并且电子发射区域通过延伸电耦合到第一电极。

148. 发明申请

US20090003290A1 Method and Apparatus for Selecting Transport Format Combination in a Wireless Communication System 审中-公开
标题翻译：在无线通信系统中选择传输格式组合的方法和装置
公开(公告)号：US20090003290A1
公开(公告)日：2009-01-01
申请号：US12161086
申请日：2007-07-26
申请人： Seung-Hyun Lee
发明人： Seung-Hyun Lee
IPC分类号： H04J3/00
CPC分类号： H04L1/0025 , H04L1/0006 , H04L69/14 , H04W28/18 , H04W52/34
摘要： A method and apparatus for selecting a Transport Format Combination (TFC) in a wireless communication system are provided, in which it is determined whether a previous TFC used for data transmission on a previous valid Transmission Time Interval (TTI) can be reused as a current TFC for data transmission on a current valid TTI via at least one transport channel according to at least one parameter related to the transport channel, the previous TFC is set as the current TFC without performing a TFC search and determination process, when the previous TFC can be reused on the current valid TTI, and TFCs, each having Transport Formats (TFs) preset for data transmission on transport channels are searched, and a suitable TFC is selected for the current valid TTI from among the TFCs when the previous TFC cannot be reused on the current valid TTI.
摘要翻译：提供了一种用于在无线通信系统中选择传输格式组合（TFC）的方法和装置，其中确定用于先前有效传输时间间隔（TTI）上的数据传输的先前TFC是否可以重新用作电流 TFC，用于根据与传输信道有关的至少一个参数，经由至少一个传输信道在当前有效TTI上进行数据传输，将前一个TFC设置为当前TFC，而不执行TFC搜索和确定过程，当前一个TFC可以在当前有效的TTI上重复使用，并且在传输信道上预先设置用于数据传输的传输格式（TF）的TFC，并且当前一个TFC不能被重用时，从TFC中选择适合的TFC用于当前有效的TTI 在当前有效的TTI上。

149. 发明申请

US20080318361A1 METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE 失效
标题翻译：制造半导体封装的方法
公开(公告)号：US20080318361A1
公开(公告)日：2008-12-25
申请号：US11777388
申请日：2007-07-13
申请人： Kwon Whan HAN , Chang Jun PARK , Min Suk SUH , Seong Cheol KIM , Sung Min KIM , Seung Taek YANG , Seung Hyun LEE , Jong Hoon KIM , Ha Na LEE
发明人： Kwon Whan HAN , Chang Jun PARK , Min Suk SUH , Seong Cheol KIM , Sung Min KIM , Seung Taek YANG , Seung Hyun LEE , Jong Hoon KIM , Ha Na LEE
IPC分类号： H01L21/44 , H01L21/02
CPC分类号： H01L21/76898 , H01L25/0657 , H01L25/50 , H01L2224/04042 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/16145 , H01L2224/274 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/00014 , H01L2924/00 , H01L2924/013
摘要： A method for manufacturing a semiconductor package includes forming a groove in the portion outside of the bonding pad of a semiconductor chip provided with the bonding pad on an upper surface thereof; forming an insulation layer on the side wall of the groove; forming a metal layer over the semiconductor chip so as to fill the groove formed with the insulation layer; etching the metal layer to simultaneously form a through silicon via for filling the groove and a distribution layer for connecting the through silicon via and the bonding pad; and removing a rear surface of the semiconductor chip such that the lower surface of the through silicon via protrudes from the semiconductor chip.
摘要翻译：一种半导体封装的制造方法，其特征在于，在设置有所述接合焊盘的半导体芯片的焊盘的外侧的部分的外表面形成有槽，在所述槽的侧壁上形成绝缘层; 在半导体芯片上形成金属层，以填充形成有绝缘层的槽; 蚀刻金属层以同时形成用于填充槽的通过硅通孔和用于连接通过硅通孔和接合焊盘的分布层; 以及去除所述半导体芯片的后表面，使得所述贯穿硅通孔的下表面从所述半导体芯片突出。

150. 发明申请

US20080214024A1 Backlight unit and liquid crystal display device having the same 失效
标题翻译：背光单元和具有该背光单元的液晶显示装置
公开(公告)号：US20080214024A1
公开(公告)日：2008-09-04
申请号：US12005624
申请日：2007-12-28
申请人： Young-Eun Lee , Seung-Hyun Lee
发明人： Young-Eun Lee , Seung-Hyun Lee
IPC分类号： H01R12/00
CPC分类号： G02F1/133604 , G02F2001/133612
摘要： A capacitive connector for a backlight unit having a light source including: a first conductive layer covering an end portion of the light source; an insulation layer covering an external surface of the first conductive layer; and a second conductive layer separated from the first conductive layer with the insulation layer interposed therebetween.
摘要翻译：一种用于具有光源的背光单元的电容连接器，包括：覆盖所述光源的端部的第一导电层; 覆盖所述第一导电层的外表面的绝缘层; 以及与所述第一导电层分离的第二导电层，其间具有绝缘层。

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