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    • 146. 发明授权
    • Operating method for card reader
    • US10042803B2
    • 2018-08-07
    • US15122460
    • 2015-03-26
    • Feitian Technologies Co., Ltd.
    • Zhou LuHuazhang Yu
    • G06F13/20G06F13/38G06F13/24G06F13/42G06K7/04
    • An operating method for a card reader, comprising: powering on a card reader, and setting an operating mode according to the type of a device connected thereto; judging the operating mode, waiting to receive audio data if the operating mode is an audio mode, converting the received audio data into a digital signal, forming a data packet by the digital signal, parsing the data packet to obtain a parsing result, judging an instruction type according to the parsing result, executing a corresponding operation according to the instruction type, converting the obtained operation result into an audio data packet, and sending the audio data packet to the device connected thereto; and waiting to receive USB data if the operating mode is a USB mode, judging an instruction type of the received USB data, executing a corresponding operation according to the instruction type, and returning the operation result to the device connected thereto. According to the present invention, a card reader conducts data communication with a device through an audio module or a USB module, thereby not depending on the USB module in the existing card reader to conduct data communication any longer, having relatively good compatibility, and improving the user experience.
    • 148. 发明申请
    • SMART CARD AND METHOD FOR MANUFACTURING SAME
    • US20180174008A1
    • 2018-06-21
    • US15577399
    • 2016-06-08
    • Feitian Technologies Co., Ltd.
    • Zhou LUHuazhang Yu
    • G06K19/077G06K19/07
    • G06K19/077G06K19/0723G06K19/07743
    • Provided is a method for manufacturing a smart card, comprising: mounting a secure chip (230) on a modular circuit board (210) to obtain a secure chip module, one layer of the modular circuit board (210) being provided with a plurality of contact points (220) insulated from each other; planting a solder ball (240) on the secure chip solder pad (311) of the main circuit board (300); according to the position of the secure chip solder pad (311) on the main circuit board (300), milling out a groove (800) on the substrate on which the main circuit board (300) is packed, such that the solder ball (240) on the secure chip solder pad (311) is visible at the bottom of the groove (800); packing the secure chip module into the groove (800), and by means of the solder ball (240) on the secure chip solder pad (311), mounting the secure chip module onto the main circuit board (300). The method reduces the restrictions to the wiring of the main circuit board caused by the contact points on the surface of the smart card, thus improving the quality of the wiring of the main circuit board; furthermore, electronic circuit-level expansion may be performed on the contact point module and the secure chip, increasing the scalability of the smart card.