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131. 发明申请

US20090310062A1 LINEAR LIGHT SOURCE DEVICE, PLANAR LIGHT EMITTING DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE 审中-公开
标题翻译：线性光源装置，平面发光装置和液晶显示装置
公开(公告)号：US20090310062A1
公开(公告)日：2009-12-17
申请号：US11915977
申请日：2006-06-23
申请人： Yoshihiko Chosa , Hiroshi Uchida , Tetsuya Fukudome , Hisakazu Kawahara , Toshiro Horiuchi , Yu Hasegawa , Kouji Hidaka , Hiroshi Yamaguchi
发明人： Yoshihiko Chosa , Hiroshi Uchida , Tetsuya Fukudome , Hisakazu Kawahara , Toshiro Horiuchi , Yu Hasegawa , Kouji Hidaka , Hiroshi Yamaguchi
IPC分类号： G02F1/1335 , F21V7/22
CPC分类号： G02B6/0068 , G02B6/0031 , G02B6/0073 , G02B6/0083 , G02B6/0091 , G02F1/133603
摘要： To provide a linear light source device (1) arranged on a lateral surface of a light guide plate, comprising: a plurality of linear light source assemblies (3) each including an elongated substrate and a plurality of light emitting elements linearly mounted on one of main surfaces of the sub substrate; and a main substrate (2) having mounted thereon the linear light source assemblies (3). With this structure, even if the linear light source device (1) is elongated, luminance unevenness is hardly caused in planar light emitting devices and liquid crystal display devices.
摘要翻译：为了提供一种布置在导光板的侧表面上的线性光源装置（1），包括：多个线性光源组件（3），每个线性光源组件包括细长基板和多个发光元件，所述多个发光元件线性地安装在副基板的主表面; 以及其上安装有线性光源组件（3）的主基板（2）。利用这种结构，即使线性光源装置（1）细长，在平面发光装置和液晶显示装置中几乎不产生亮度不均匀。

132. 发明申请

US20090261298A1 High-Stability Microencapsulated Hardened for Epoxy Resin and Epoxy Resin Composition 有权
标题翻译：用于环氧树脂和环氧树脂组合物的高稳定性微胶囊化硬化
公开(公告)号：US20090261298A1
公开(公告)日：2009-10-22
申请号：US11991785
申请日：2006-09-29
申请人： Yoshikimi Kondo , Hiroshi Uchida , Kazuhiro Daikai
发明人： Yoshikimi Kondo , Hiroshi Uchida , Kazuhiro Daikai
IPC分类号： H01B1/12 , C08L63/00 , C08K5/55 , C09J163/00 , C09D163/00 , B32B1/00
CPC分类号： C08G59/188 , C08J3/241 , C08J2363/00 , H01L2924/0002 , Y10T428/149 , Y10T428/2989 , H01L2924/00
摘要： A microencapsulated latent hardener for epoxy resins which comprises cores (C) and shells (S) with which the cores are covered, characterized in that the cores (C) are ones formed from, as a starking material, particles of an epoxy resin hardener (H) comprising an amine adduct (A) and a low-molecular amine compound (B) as major ingredients and that the shells (S) have on the surface thereof connecting groups (x), (y), and (z) which absorb infrared. Also provided is an epoxy resin composition containing the hardener.
摘要翻译：一种用于环氧树脂的微胶囊化潜在硬化剂，其包括芯（C）和壳（S），芯被覆盖，其特征在于，芯（C）是由环氧树脂固化剂颗粒 H），其包含胺加合物（A）和低分子胺化合物（B）作为主要成分，并且所述壳（S）在其表面上具有吸收的连接基团（x），（y）和（z）红外线。还提供含有硬化剂的环氧树脂组合物。

133. 发明申请

US20090186962A1 Microcapsule-Based Hardener for Epoxy Resin, Masterbatch-Based Hardener Composition for Epoxy Resin, One-Part Epoxy Resin Composition, and Processed Good 有权
标题翻译：用于环氧树脂的微胶囊基固化剂，环氧树脂的母料基固化剂组合物，单组分环氧树脂组合物和加工良好
公开(公告)号：US20090186962A1
公开(公告)日：2009-07-23
申请号：US12223523
申请日：2007-01-31
申请人： Yoshikimi Kondo , Hiroshi Uchida , Kazuhiro Daikai
发明人： Yoshikimi Kondo , Hiroshi Uchida , Kazuhiro Daikai
IPC分类号： C08L63/00 , C08J3/22
CPC分类号： C08G59/184 , C08G59/188 , Y10T428/2989
摘要： Provided is a microcapsule-based hardener for an epoxy resin, which have a core (C) formed using a hardener (H) for the epoxy resin as a starting material and a shell (S) for covering the core (C) therewith. Since it is characterized in that the hardener (H) for the epoxy resin has an average particle size exceeding 0.3 μm and not greater than 12 μm; a content of a small-particle-size hardener for epoxy resin defined to have a particle size 0.5 time or less of the average particle size of the hardener (H) for the epoxy resin is from 0.1 to 15%; and the shell (S) has, on the surface thereof, a binding group (x) capable of absorbing infrared rays having a wave number of from 1630 to 1680 cm−1, a binding group (y) capable of absorbing infrared rays having a wave number of from 1680 to 1725 cm−1, and a binding group (z) capable of absorbing infrared rays having a wave number of from 1730 to 1755 cm−1, it is excellent in storage stability and at the same time, in reaction rapidity.
摘要翻译：本发明提供一种环氧树脂微胶囊型固化剂，其具有使用环氧树脂作为原料的固化剂（H）形成的芯（C）和用于覆盖芯（C）的壳（S）。由于其特征在于环氧树脂的硬化剂（H）的平均粒径超过0.3μm且不大于12μm; 用于环氧树脂的小粒径固化剂的含量为环氧树脂的固化剂（H）的平均粒径的0.5倍以下的粒径为0.1〜15％壳体（S）的表面上具有能够吸收波数为1630〜1680cm -1的红外线的结合组（x），能够吸收红外线的结合基（y）具有 1680〜1725cm -1的波数和能够吸收1730〜1755cm -1的波数的红外线的结合基（z），其保存稳定性优异，同时在反应中速度快

134. 发明授权

US07558017B2 Magnetic disk drive and a loading/unloading method 失效
标题翻译：磁盘驱动器和装载/卸载方法
公开(公告)号：US07558017B2
公开(公告)日：2009-07-07
申请号：US11789770
申请日：2007-04-24
申请人： Isao Yoneda , Kazuyuki Ishibashi , Takeshi Chawanya , Hiroshi Uchida
发明人： Isao Yoneda , Kazuyuki Ishibashi , Takeshi Chawanya , Hiroshi Uchida
IPC分类号： G11B21/02 , G11B5/596
CPC分类号： G11B5/5526 , G11B21/12
摘要： Embodiments in accordance with the present invention provide a magnetic disk drive with sufficiently low noise. A digital/analog converter supplies to a voice coil motor (VCM) driver a control voltage comprising a first preset voltage value, a second preset voltage value, and a transition voltage value of a substantially cosine wave that interconnects the first preset voltage value and the second preset voltage value. A driving current is supplied from the VCM driver to a voice coil of an actuator assembly. Since a current not containing higher-harmonic components in a transition period flows as a VCM current that flows into the voice coil, vibromotive force can be easily suppressed by shifting a structural resonance point of the entire disk drive including the actuator assembly. In addition, since the back electromotive force occurring in an inductance element is cleared to zero during a half wavelength of period of the cosine wave, speed electromotive force can be measured by immediate shifting from a setting period to a measuring period.
摘要翻译：根据本发明的实施例提供具有足够低噪声的磁盘驱动器。数字/模拟转换器向音圈电机（VCM）驱动器提供包括第一预设电压值，第二预设电压值和互连第一预设电压值和基本上余弦波的转换电压值的控制电压，第二预设电压值。驱动电流从VCM驱动器提供给致动器组件的音圈。由于在过渡期间不包含高次谐波分量的电流作为流入音圈的VCM电流流动，所以通过移动包括致动器组件在内的整个磁盘驱动器的结构共振点，可以容易地抑制振动力。此外，由于在余弦波的周期的半波长期间，电感元件中产生的反电动势被清零，所以可以通过立即从设定周期向测量周期移动来测量速度电动势。

135. 发明申请

US20090156752A1 CARBOXYL GROUP-CONTAINING POLYURETHANE AND HEAT-CURABLE POLYURETHANE RESIN COMPOSITION 有权
标题翻译：含羧基的聚氨酯和可固化聚氨酯树脂组合物
公开(公告)号：US20090156752A1
公开(公告)日：2009-06-18
申请号：US12089500
申请日：2006-10-04
申请人： Hiroshi Uchida , Ritsuko Azuma
发明人： Hiroshi Uchida , Ritsuko Azuma
IPC分类号： C09D175/04 , C08G18/32
CPC分类号： C08G18/348 , C08G18/0823 , C08G18/3212 , C08G18/44 , C08G18/664 , C08G18/758 , C09D11/102 , C09D175/06 , H05K3/285 , Y10S428/901 , Y10T428/31551 , C08L2666/22
摘要： A carboxyl group-containing polyurethane is capable of giving cured products excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability. The carboxyl group-containing polyurethane includes a structure derived from a polyol compound having 1 to 10 hydroxyl groups and 18 to 72 carbon atoms per molecule. The carboxyl group-containing polyurethane is produced by reacting: (A) a polyisocyanate compound; (B) a polyol compound having 1 to 10 hydroxyl groups and 18 to 72 carbon atoms per molecule; and (C) a carboxyl group-containing dihydroxy compound (other than the compound (B)).
摘要翻译：含羧基的聚氨酯能够提供与基材的粘合性优异的弯曲性，柔软性，耐电镀性，耐焊接性和长期可靠性。含羧基的聚氨酯包括衍生自每分子具有1至10个羟基和18至72个碳原子的多元醇化合物的结构。含羧基的聚氨酯通过使（A）多异氰酸酯化合物反应而制备，（B）每分子具有1〜10个羟基和18〜72个碳原子的多元醇化合物; 和（C）含羧基的二羟基化合物（化合物（B）以外）。

136. 发明申请

US20090136732A1 THERMOSET RESIN COMPOSITION 审中-公开
标题翻译：热固性树脂组合物
公开(公告)号：US20090136732A1
公开(公告)日：2009-05-28
申请号：US12294342
申请日：2007-04-02
申请人： Hiroshi Uchida , Yuko Sakata
发明人： Hiroshi Uchida , Yuko Sakata
IPC分类号： B05D3/10 , C08L71/00 , C08L67/00 , B32B27/38
CPC分类号： C08G18/0823 , C08G18/12 , C08G18/6659 , C08G18/751 , C08G18/758 , C09D175/04 , C08G18/58
摘要： The present invention provides a thermoset resin composition which contains polycarboxylic acid resin (A) and epoxy resin and/or oxetane resin (B) as essential ingredients and is capable of forming a transparent cured product having improved endurance in hot and humid conditions; an optical film obtained by curing the above-mentioned thermoset resin composition; and a laminated film obtained by applying the above-mentioned thermoset resin composition onto a film substrate and curing it.
摘要翻译：本发明提供一种热固性树脂组合物，其含有多元羧酸树脂（A）和环氧树脂和/或氧杂环丁烷树脂（B）作为必要成分，并且能够形成在耐热和潮湿条件下具有改善的耐久性的透明固化产物; 通过固化上述热固性树脂组合物获得的光学膜; 以及通过将上述热固性树脂组合物涂布在薄膜基材上并使其固化而获得的层压膜。

137. 发明申请

US20090082518A1 CARBOXYL GROUP-CONTAINING POLYURETHANE, HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF 审中-公开
标题翻译：含羧基的聚氨酯，可固化树脂组合物及其用途
公开(公告)号：US20090082518A1
公开(公告)日：2009-03-26
申请号：US11914435
申请日：2006-05-16
申请人： Hiroshi Uchida , Ritsuko Hirakawa , Yoshio Miyajima , Hirofumi Inoue , Kazuya Kimura , Yukihiko Azuma
发明人： Hiroshi Uchida , Ritsuko Hirakawa , Yoshio Miyajima , Hirofumi Inoue , Kazuya Kimura , Yukihiko Azuma
IPC分类号： C08L75/04 , C08G18/32 , C08L67/00 , C09D11/10 , C09D175/04
CPC分类号： H05K3/285 , C08G18/0823 , C08G18/348 , C08G18/44 , C08G18/6576 , C08G18/6659 , C08G18/69 , C08G18/698 , C09D11/106 , C09D175/04 , H05K1/0393
摘要： Disclosed is a carboxyl group-containing polyurethane (A) produced from a polyol (b) containing at least 10 mol % (relative to the total (100 mol %) of the polyol (b)) of a polyol (b1) which: (i) has a number-average molecular weight of 500 to 50,000; (ii) has 1 to 10 hydroxyl groups per molecule; and (iii) is one or a combination of two or more polyols selected from the group consisting of polybutadiene polyol, polyisoprene polyol, hydrogenated polybutadiene polyol and hydrogenated polyisoprene polyol. The carboxyl group-containing polyurethane (A) is suitable as materials of cured products, for example cured films, that are excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability.
摘要翻译：公开了由多元醇（b）生成的含有羧基的聚氨酯（A），该多元醇（b）含有多元醇（b1）的至少10摩尔％（相对于多元醇（b）的总量（100摩尔％））为：（ i）数均分子量为500〜50,000; （ii）每分子具有1至10个羟基; 和（iii）是选自聚丁二烯多元醇，聚异戊二烯多元醇，氢化聚丁二烯多元醇和氢化聚异戊二烯多元醇的一种或两种以上的多元醇的组合。含羧基的聚氨酯（A）适合作为与基材的粘合性优异，翘曲翘曲，柔韧性，耐电镀性，焊接耐热性，长期可靠性等固化物例如固化膜的材料。

138. 发明申请

US20090008138A1 THERMOSETTING RESIN COMPOSITION AND USES THEREOF 有权
标题翻译：热固性树脂组合物及其用途
公开(公告)号：US20090008138A1
公开(公告)日：2009-01-08
申请号：US12281274
申请日：2007-03-08
申请人： Hiroshi Uchida , Tomokazu Umezawa
发明人： Hiroshi Uchida , Tomokazu Umezawa
IPC分类号： H05K1/03 , C08K5/5313
CPC分类号： C08G18/758 , C08G18/0823 , C08G18/44 , C08G18/6576 , C08G18/6659 , C08G59/4269 , C08K3/016 , C08K5/5313 , C08L63/00 , C08L75/04 , H05K3/285 , H05K2201/012 , H05K2201/0212 , C08L2666/14 , C08L2666/22
摘要： The thermosetting resin composition and the solder resist ink according to the present invention are characterized by comprising: a thermosetting resin (A) comprising (A1) a compound containing an acid anhydride group and/or a carboxyl group and (A2) a compound having a functional group which reacts with (A1) described above and an organic filler (B) containing a phosphorus atom, wherein the organic filler (B) containing a phosphorus atom has an average particle diameter of 50 Êm or less. According to the present invention, capable of being provided at a low cost and a good productivity are an excellent thermosetting resin composition and solder resist ink capable of forming a cured material which achieves an adhesion to a substrate, a low warping property, a flexibility, a plating resistance, a solder heat resistance and a long term reliability as well as a flame retardancy, and a cured material and a protective film which are excellent in the above characteristics. Further, electronic parts having a protective film which is excellent in a flame retardancy and which has a high reliability can be provided.
摘要翻译：根据本发明的热固性树脂组合物和阻焊油墨的特征在于包括：包含（A1）含有酸酐基和/或羧基的化合物的热固性树脂（A）和（A2）具有与上述（A1）反应的官能团和含有磷原子的有机填料（B），其中，含有磷原子的有机填料（B）的平均粒径为50μm以下。根据本发明，能够以低成本和高生产率提供的是具有能够形成固化材料的优异的热固性树脂组合物和阻焊油墨，其能够实现与基材的粘合性，低翘曲性，柔软性，电镀电阻，焊料耐热性和长期可靠性以及阻燃性，以及上述特性优异的固化材料和保护膜。此外，可以提供具有阻燃性优异且可靠性高的保护膜的电子部件。

139. 发明申请

US20080227946A1 Thermosetting Composition and Curing Method Thereof 审中-公开
标题翻译：热固性组合物及其固化方法
公开(公告)号：US20080227946A1
公开(公告)日：2008-09-18
申请号：US11547664
申请日：2005-04-05
申请人： Hirotoshi Kamata , Kazuya Kimura , Hiroshi Uchida
发明人： Hirotoshi Kamata , Kazuya Kimura , Hiroshi Uchida
IPC分类号： C08G63/02
CPC分类号： C08K5/3445 , C08L67/025 , C08L101/08 , C08L2666/02 , C09J167/025 , H05K3/287 , H05K3/4676 , C08L67/00
摘要： The invention relates to a thermosetting composition comprising (A) a compound having at least one oxetanyl group in the molecule, (B) a compound having at least two carboxyl groups in the molecule, and (C) an imidazolium salt, curing method thereof and products cured thereby. Cured products prepared from the composition of the invention is excellent in electrical isolation, flexibility, adhesiveness and mechanical strength.
摘要翻译：本发明涉及一种热固性组合物，其包含（A）在分子中具有至少一个氧杂环丁烷基的化合物，（B）分子中具有至少两个羧基的化合物和（C）咪唑鎓盐，其固化方法和产品被固化。由本发明组合物制备的固化产品在电绝缘性，柔韧性，粘合性和机械强度方面优异。

140. 发明申请

US20080188625A1 Carboxyl Group-Containing Polyurethane and Thermosetting Resin Composition Using the Same 审中-公开
标题翻译：含羧基的聚氨酯和使用其的热固性树脂组合物
公开(公告)号：US20080188625A1
公开(公告)日：2008-08-07
申请号：US11885258
申请日：2006-03-03
申请人： Hiroshi Uchida , Kazuya Kimura , Yuko Sakata
发明人： Hiroshi Uchida , Kazuya Kimura , Yuko Sakata
IPC分类号： C08L75/04
CPC分类号： C08G18/44 , C08G18/0823 , C08G18/3212 , C08G18/672 , C08G18/73 , C08G18/757 , C08G18/758 , C08G18/7621 , C08G18/7642 , C08G59/4269 , C08L63/00 , C08L75/16 , C08G18/6659 , C08L2666/22
摘要： The invention relates to a carboxyl group-containing polyurethane, which is obtained by reacting (a) a polyisocyanate compound, (b) a polycarbonate diol having a molecular weight of 300 to 50,000, (c) a dihydroxy compound having a carboxyl group and when necessary (d) a monohydroxy compound, a thermosetting composition using the carboxyl group-containing polyurethane and a paste for forming a film using thermosetting composition. The thermosetting composition of the invention is excellent in adhesion to a substrate, low warpage, flexibility, plating resistance and soldering heat resistance.
摘要翻译：本发明涉及含羧基的聚氨酯，其通过使（a）多异氰酸酯化合物，（b）分子量为300〜50,000的聚碳酸酯二醇，（c）具有羧基的二羟基化合物和必要的（d）单羟基化合物，使用含羧基的聚氨酯的热固性组合物和使用热固性组合物形成膜的糊剂。本发明的热固性组合物对基材的粘附性优异，翘曲性，柔韧性，耐电镀性和耐焊接性优异。

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